Battery Serving Network with Multiple Loads with Individual Voltage Sensing at Each Load

ABSTRACT

A battery sensor system (BSS) includes a battery operably coupled to a plurality of loads via a wired connection, where a first load is operably coupled to a terminal of the battery via a first portion of the wired connection and a second load is operably coupled to the terminal via a second portion of the wired connection. The BSS further includes a first drive sense circuit operably coupled proximate to the battery to sense a first voltage. The BSS further includes a second drive sense circuit operably coupled proximate to the first load to sense a second voltage, where the second voltage and first voltage are different based on an impedance of the wired connection between the first point and the second point. The BSS further includes memory and processing modules to process the first and second voltages to determine operational status of the battery, wired connection, and loads.

CROSS REFERENCE TO RELATED PATENTS/PATENT APPLICATIONS

The present U.S. Utility patent application claims priority pursuant to35 U.S.C. § 119(e) to U.S. Provisional Application No. 63/195,556,entitled “Sensing voltage using micro-watt sensor,” (Attorney Docket No.SGS00340-01P), filed Jun. 1, 2021, which is hereby incorporated hereinby reference in its entirety and made part of the present U.S. Utilitypatent application for all purposes.

The U.S. Utility application Ser. No. 16/427,935, entitled “Batterymonitoring and characterization during charging,” (Attorney Docket No.SGS00126), filed May 31, 2019, now issued as U.S. Pat. No. 11,131,714 onSep. 28, 2021, is hereby incorporated herein by reference in itsentirety and made part of the present U.S. Provisional Application forall purposes.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not Applicable.

INCORPORATION-BY-REFERENCE OF MATERIAL SUBMITTED ON A COMPACT DISC

Not Applicable.

BACKGROUND OF THE INVENTION Technical Field of the Invention

This invention relates generally to data communication systems and moreparticularly to sensed data collection and/or communication.

Description of Related Art

Sensors are used in a wide variety of applications ranging from in-homeautomation, to industrial systems, to health care, to transportation,and so on. For example, sensors are placed in bodies, automobiles,airplanes, boats, ships, trucks, motorcycles, cell phones, televisions,touch-screens, industrial plants, appliances, motors, checkout counters,etc. for the variety of applications.

In general, a sensor converts a physical quantity into an electrical oroptical signal. For example, a sensor converts a physical phenomenon,such as a biological condition, a chemical condition, an electriccondition, an electromagnetic condition, a temperature, a magneticcondition, mechanical motion (position, velocity, acceleration, force,pressure), an optical condition, and/or a radioactivity condition, intoan electrical signal.

A sensor includes a transducer, which functions to convert one form ofenergy (e.g., force) into another form of energy (e.g., electricalsignal). There are a variety of transducers to support the variousapplications of sensors. For example, a transducer is capacitor, apiezoelectric transducer, a piezoresistive transducer, a thermaltransducer, a thermal-couple, a photoconductive transducer such as aphotoresistor, a photodiode, and/or phototransistor.

A sensor circuit is coupled to a sensor to provide the sensor with powerand to receive the signal representing the physical phenomenon from thesensor. The sensor circuit includes at least three electricalconnections to the sensor: one for a power supply; another for a commonvoltage reference (e.g., ground); and a third for receiving the signalrepresenting the physical phenomenon. The signal representing thephysical phenomenon will vary from the power supply voltage to ground asthe physical phenomenon changes from one extreme to another (for therange of sensing the physical phenomenon).

The sensor circuits provide the received sensor signals to one or morecomputing devices for processing. A computing device is known tocommunicate data, process data, and/or store data. The computing devicemay be a cellular phone, a laptop, a tablet, a personal computer (PC), awork station, a video game device, a server, and/or a data center thatsupport millions of web searches, stock trades, or on-line purchasesevery hour.

The computing device processes the sensor signals for a variety ofapplications. For example, the computing device processes sensor signalsto determine temperatures of a variety of items in a refrigerated truckduring transit. As another example, the computing device processes thesensor signals to determine a touch on a touchscreen. As yet anotherexample, the computing device processes the sensor signals to determinevarious data points in a production line of a product.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem in accordance with the present disclosure;

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice in accordance with the present disclosure;

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present disclosure;

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice in accordance with the present disclosure;

FIG. 5A is a schematic plot diagram of a computing subsystem inaccordance with the present disclosure;

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present disclosure;

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present disclosure;

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present disclosure;

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem in accordance with the present disclosure;

FIG. 6 is a schematic block diagram of a drive center circuit inaccordance with the present disclosure;

FIG. 6A is a schematic block diagram of another embodiment of a drivesense circuit in accordance with the present disclosure;

FIG. 7 is an example of a power signal graph in accordance with thepresent disclosure;

FIG. 8 is an example of a sensor graph in accordance with the presentdisclosure;

FIG. 9 is a schematic block diagram of another example of a power signalgraph in accordance with the present disclosure;

FIG. 10 is a schematic block diagram of another example of a powersignal graph in accordance with the present disclosure;

FIG. 11 is a schematic block diagram of another example of a powersignal graph in accordance with the present disclosure;

FIG. 11A is a schematic block diagram of another example of a powersignal graph in accordance with the present disclosure;

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit in accordance with the present disclosure;

FIG. 13 is a schematic block diagram of another embodiment of adrive-sense circuit in accordance with the present disclosure;

FIG. 14 is a schematic block diagram of an embodiment of a drive-sensecircuit (DSC) that is interactive with a connection to an electricalnode via a single line in accordance with the present disclosure;

FIG. 15 is a schematic block diagram of another embodiment of a DSC thatis interactive with a connection to an electrical node via a single linein accordance with the present disclosure;

FIG. 16A is a schematic block diagram of another embodiment of a DSCconfigured simultaneously to drive and sense a drive signal to aconnection to an electrical node via a single line in accordance withthe present disclosure;

FIG. 16B is a schematic block diagram of another embodiment of a DSCconfigured simultaneously to drive and sense a drive signal to aconnection to an electrical node via a single line in accordance withthe present disclosure;

FIG. 17 is a schematic block diagram of an embodiment of a lead acidbattery such as may be serviced using one or more DSCs in accordancewith the present disclosure;

FIG. 18 is a schematic block diagram of an embodiment of a Lithium-ionbattery such as may be serviced using one or more DSCs in accordancewith the present disclosure;

FIG. 19A is a schematic block diagram showing an embodiment of azero-time-constant model of an equivalent circuit of a battery inaccordance with the present disclosure;

FIG. 19B is a schematic block diagram showing an embodiment of aone-time-constant model of an equivalent circuit of a battery inaccordance with the present disclosure;

FIG. 19C is a schematic block diagram showing an embodiment of a dualpolarization (DP) model of an equivalent circuit of a battery inaccordance with the present disclosure;

FIG. 20A is a schematic block diagram showing an embodiment of a batterythat is connected or coupled to a load in accordance with the presentdisclosure;

FIG. 20B is a schematic block diagram showing an embodiment of a batterythat is connected or coupled to a load, and an associated electricalmodel of that configuration, in accordance with the present disclosure;

FIG. 21A is a schematic block diagram showing an embodiment of a batterythat is connected or coupled to a load and a DSC that is implemented todetect voltage in conjunction with a high impedance (Z) reference loadin accordance with the present disclosure;

FIGS. 21B and 21C are schematic block diagram showing other embodimentsof a battery that is connected or coupled to a load and a DSC that isimplemented to detect voltage in conjunction with a high impedance (Z)reference load in accordance with the present disclosure;

FIGS. 21D, 21E, 21F, and 21G are schematic block diagrams showingvarious embodiments of feedback circuits that may be implemented withina DSC in accordance with the present disclosure;

FIG. 21H is a schematic block diagram of an embodiment of a method forexecution by one or more devices in accordance with the presentdisclosure;

FIG. 22A is a schematic block diagram showing an embodiment of a batterythat is connected or coupled to a load and a DSC that is implemented todetect voltage without a high impedance (Z) reference load in accordancewith the present disclosure;

FIGS. 22B and 22C are schematic block diagrams showing other embodimentsof a battery that is connected or coupled to a load and a DSC that isimplemented to detect voltage without a high impedance (Z) referenceload in accordance with the present disclosure;

FIG. 22D is a schematic block diagram of an embodiment of a method forexecution by one or more devices in accordance with the presentdisclosure;

FIG. 23A is a schematic block diagram showing an embodiment of a batterythat is connected or coupled to a load and multiple DSCs that areimplemented to detect voltages in conjunction with high impedance (Z)reference loads in accordance with the present disclosure;

FIGS. 23B, 23C, and 23D are schematic block diagrams showing otherembodiments of a battery that is connected or coupled to a load andmultiple DSCs that are implemented to detect voltages in conjunctionwith high impedance (Z) reference loads in accordance with the presentdisclosure;

FIG. 23E is a schematic block diagram showing an embodiment of a batterythat is connected or coupled to a load and a DSC that is implemented todetect voltage without a high impedance (Z) reference load in accordancewith the present disclosure;

FIGS. 23F and 23G are schematic block diagrams showing other embodimentsof a battery that is connected or coupled to a load and multiple DSCsthat are implemented to detect voltages without high impedance (Z)reference loads in accordance with the present disclosure;

FIG. 23H is a schematic block diagram showing an embodiment ofoperations as may be used to perform impedance (Z) characterization inaccordance with the present invention;

FIG. 23I is a schematic block diagram showing an embodiment of a circuitconfigured to provide a reference signal having a desired frequency to aDSC in accordance with the present invention;

FIG. 23J is a schematic block diagram showing an embodiment ofoperations as may be used to perform impedance (Z) characterizationacross a number of different frequencies in accordance with the presentinvention;

FIGS. 23K and 23L are schematic block diagrams showing embodiments ofimpedance (Z) profiles across a number of different frequencies inaccordance with the present invention;

FIGS. 23M and 23N are schematic block diagrams of embodiments of methodsfor execution by one or more devices in accordance with the presentdisclosure;

FIG. 24A is a schematic block diagram showing an embodiment of a batterythat is connected or coupled to a load and multiple DSCs that areimplemented to detect voltages in conjunction with a common referenceload impedance (Z) in accordance with the present disclosure;

FIG. 24B is a schematic block diagram showing another embodiment of abattery that is connected or coupled to a load and multiple DSCs thatare implemented to detect voltages in conjunction with a commonreference load impedance (Z) in accordance with the present disclosure;

FIG. 24C includes schematic block diagrams showing various embodimentsof common reference load impedances (Zs) that may be implemented inconjunction within multiple DSCs in accordance with the presentdisclosure;

FIG. 24D is a schematic block diagram of an embodiment of variousexamples of impedance (Zs) such as may be implemented within aconfigurable impedance (Z) circuit in accordance with the presentdisclosure;

FIG. 24E is a schematic block diagram of an embodiment of a method forexecution by one or more devices in accordance with the presentdisclosure;

FIG. 25A is a schematic block diagram of an embodiment of a batterysensor system;

FIG. 25B is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 25C is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 25D is a schematic block diagram of an embodiment of a minus directcurrent (DC) selector circuit;

FIG. 25E is a flowchart illustrating an example of a method ofdetermining operational status of a battery sensor system;

FIG. 26A is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 26B is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 26C is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 26D is a flowchart illustrating an example of a method ofdetermining currents on a wired connection of a battery sensor system;

FIG. 27A is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 27B is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 27C is a flowchart illustrating an example of a method ofdetermining a load management operation;

FIG. 28A is a schematic block diagram of another embodiment of batterysensor system;

FIG. 28B is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 28C is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 28D is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 28E is a flowchart illustrating an example of a method ofdetermining operational status of a battery sensor system;

FIG. 29A is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 29B is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 29C is a flowchart illustrating an example of another method ofdetermining currents on a wired connection of a battery sensor system;

FIG. 30A is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 30B is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 30C is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 30D is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 30E is a schematic block diagram of another embodiment of a batterysensor system;

FIG. 30F is a schematic block diagram of another embodiment of a batterysensor system; and

FIG. 30G is a flowchart illustrating an example of a method of batterycell management utilizing a battery sensor system.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 is a schematic block diagram of an embodiment of a communicationsystem 10 that includes a plurality of computing devices 12-10, one ormore servers 22, one or more databases 24, one or more networks 26, aplurality of drive-sense circuits 28, a plurality of sensors 30, and aplurality of actuators 32. Computing devices 14 include a touchscreen 16with sensors and drive-sense circuits and computing devices 18 include atouch & tactic screen 20 that includes sensors, actuators, anddrive-sense circuits.

A sensor 30 functions to convert a physical input into an electricaloutput and/or an optical output. The physical input of a sensor may beone of a variety of physical input conditions. For example, the physicalcondition includes one or more of, but is not limited to, acoustic waves(e.g., amplitude, phase, polarization, spectrum, and/or wave velocity);a biological and/or chemical condition (e.g., fluid concentration,level, composition, etc.); an electric condition (e.g., charge, voltage,current, conductivity, permittivity, electric field, which includesamplitude, phase, and/or polarization); a magnetic condition (e.g.,flux, permeability, magnetic field, which amplitude, phase, and/orpolarization); an optical condition (e.g., refractive index,reflectivity, absorption, etc.); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). For example, piezoelectric sensorconverts force or pressure into an electric signal. As another example,a microphone converts audible acoustic waves into electrical signals.

There are a variety of types of sensors to sense the various types ofphysical conditions. Sensor types include, but are not limited to,capacitor sensors, inductive sensors, accelerometers, piezoelectricsensors, light sensors, magnetic field sensors, ultrasonic sensors,temperature sensors, infrared (IR) sensors, touch sensors, proximitysensors, pressure sensors, level sensors, smoke sensors, and gassensors. In many ways, sensors function as the interface between thephysical world and the digital world by converting real world conditionsinto digital signals that are then processed by computing devices for avast number of applications including, but not limited to, medicalapplications, production automation applications, home environmentcontrol, public safety, and so on.

The various types of sensors have a variety of sensor characteristicsthat are factors in providing power to the sensors, receiving signalsfrom the sensors, and/or interpreting the signals from the sensors. Thesensor characteristics include resistance, reactance, powerrequirements, sensitivity, range, stability, repeatability, linearity,error, response time, and/or frequency response. For example, theresistance, reactance, and/or power requirements are factors indetermining drive circuit requirements. As another example, sensitivity,stability, and/or linear are factors for interpreting the measure of thephysical condition based on the received electrical and/or opticalsignal (e.g., measure of temperature, pressure, etc.).

An actuator 32 converts an electrical input into a physical output. Thephysical output of an actuator may be one of a variety of physicaloutput conditions. For example, the physical output condition includesone or more of, but is not limited to, acoustic waves (e.g., amplitude,phase, polarization, spectrum, and/or wave velocity); a magneticcondition (e.g., flux, permeability, magnetic field, which amplitude,phase, and/or polarization); a thermal condition (e.g., temperature,flux, specific heat, thermal conductivity, etc.); and a mechanicalcondition (e.g., position, velocity, acceleration, force, strain,stress, pressure, torque, etc.). As an example, a piezoelectric actuatorconverts voltage into force or pressure. As another example, a speakerconverts electrical signals into audible acoustic waves.

An actuator 32 may be one of a variety of actuators. For example, anactuator 32 is one of a comb drive, a digital micro-mirror device, anelectric motor, an electroactive polymer, a hydraulic cylinder, apiezoelectric actuator, a pneumatic actuator, a screw jack, aservomechanism, a solenoid, a stepper motor, a shape-memory allow, athermal bimorph, and a hydraulic actuator.

The various types of actuators have a variety of actuatorscharacteristics that are factors in providing power to the actuator andsending signals to the actuators for desired performance. The actuatorcharacteristics include resistance, reactance, power requirements,sensitivity, range, stability, repeatability, linearity, error, responsetime, and/or frequency response. For example, the resistance, reactance,and power requirements are factors in determining drive circuitrequirements. As another example, sensitivity, stability, and/or linearare factors for generating the signaling to send to the actuator toobtain the desired physical output condition.

The computing devices 12, 14, and 18 may each be a portable computingdevice and/or a fixed computing device. A portable computing device maybe a social networking device, a gaming device, a cell phone, a smartphone, a digital assistant, a digital music player, a digital videoplayer, a laptop computer, a handheld computer, a tablet, a video gamecontroller, and/or any other portable device that includes a computingcore. A fixed computing device may be a computer (PC), a computerserver, a cable set-top box, a satellite receiver, a television set, aprinter, a fax machine, home entertainment equipment, a video gameconsole, and/or any type of home or office computing equipment. Thecomputing devices 12, 14, and 18 will be discussed in greater detailwith reference to one or more of FIGS. 2-4 .

A server 22 is a special type of computing device that is optimized forprocessing large amounts of data requests in parallel. A server 22includes similar components to that of the computing devices 12, 14,and/or 18 with more robust processing modules, more main memory, and/ormore hard drive memory (e.g., solid state, hard drives, etc.). Further,a server 22 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a server may be a standalone separate computing device and/ormay be a cloud computing device.

A database 24 is a special type of computing device that is optimizedfor large scale data storage and retrieval. A database 24 includessimilar components to that of the computing devices 12, 14, and/or 18with more hard drive memory (e.g., solid state, hard drives, etc.) andpotentially with more processing modules and/or main memory. Further, adatabase 24 is typically accessed remotely; as such it does notgenerally include user input devices and/or user output devices. Inaddition, a database 24 may be a standalone separate computing deviceand/or may be a cloud computing device.

The network 26 includes one more local area networks (LAN) and/or one ormore wide area networks WAN), which may be a public network and/or aprivate network. A LAN may be a wireless-LAN (e.g., Wi-Fi access point,Bluetooth, ZigBee, etc.) and/or a wired network (e.g., Firewire,Ethernet, etc.). A WAN may be a wired and/or wireless WAN. For example,a LAN may be a personal home or business's wireless network and a WAN isthe Internet, cellular telephone infrastructure, and/or satellitecommunication infrastructure.

In an example of operation, computing device 12-1 communicates with aplurality of drive-sense circuits 28, which, in turn, communicate with aplurality of sensors 30. The sensors 30 and/or the drive-sense circuits28 are within the computing device 12-1 and/or external to it. Forexample, the sensors 30 may be external to the computing device 12-1 andthe drive-sense circuits are within the computing device 12-1. Asanother example, both the sensors 30 and the drive-sense circuits 28 areexternal to the computing device 12-1. When the drive-sense circuits 28are external to the computing device, they are coupled to the computingdevice 12-1 via wired and/or wireless communication links as will bediscussed in greater detail with reference to one or more of FIGS.5A-5C.

The computing device 12-1 communicates with the drive-sense circuits 28to; (a) turn them on, (b) obtain data from the sensors (individuallyand/or collectively), (c) instruct the drive sense circuit on how tocommunicate the sensed data to the computing device 12-1, (d) providesignaling attributes (e.g., DC level, AC level, frequency, power level,regulated current signal, regulated voltage signal, regulation of animpedance, frequency patterns for various sensors, different frequenciesfor different sensing applications, etc.) to use with the sensors,and/or (e) provide other commands and/or instructions.

As a specific example, the sensors 30 are distributed along a pipelineto measure flow rate and/or pressure within a section of the pipeline.The drive-sense circuits 28 have their own power source (e.g., battery,power supply, etc.) and are proximally located to their respectivesensors 30. At desired time intervals (milliseconds, seconds, minutes,hours, etc.), the drive-sense circuits 28 provide a regulated sourcesignal or a power signal to the sensors 30. An electrical characteristicof the sensor 30 affects the regulated source signal or power signal,which is reflective of the condition (e.g., the flow rate and/or thepressure) that sensor is sensing.

The drive-sense circuits 28 detect the effects on the regulated sourcesignal or power signals as a result of the electrical characteristics ofthe sensors. The drive-sense circuits 28 then generate signalsrepresentative of change to the regulated source signal or power signalbased on the detected effects on the power signals. The changes to theregulated source signals or power signals are representative of theconditions being sensed by the sensors 30.

The drive-sense circuits 28 provide the representative signals of theconditions to the computing device 12-1. A representative signal may bean analog signal or a digital signal. In either case, the computingdevice 12-1 interprets the representative signals to determine thepressure and/or flow rate at each sensor location along the pipeline.The computing device may then provide this information to the server 22,the database 24, and/or to another computing device for storing and/orfurther processing.

As another example of operation, computing device 12-2 is coupled to adrive-sense circuit 28, which is, in turn, coupled to a senor 30. Thesensor 30 and/or the drive-sense circuit 28 may be internal and/orexternal to the computing device 12-2. In this example, the sensor 30 issensing a condition that is particular to the computing device 12-2. Forexample, the sensor 30 may be a temperature sensor, an ambient lightsensor, an ambient noise sensor, etc. As described above, wheninstructed by the computing device 12-2 (which may be a default settingfor continuous sensing or at regular intervals), the drive-sense circuit28 provides the regulated source signal or power signal to the sensor 30and detects an effect to the regulated source signal or power signalbased on an electrical characteristic of the sensor. The drive-sensecircuit generates a representative signal of the affect and sends it tothe computing device 12-2.

In another example of operation, computing device 12-3 is coupled to aplurality of drive-sense circuits 28 that are coupled to a plurality ofsensors 30 and is coupled to a plurality of drive-sense circuits 28 thatare coupled to a plurality of actuators 32. The generally functionalityof the drive-sense circuits 28 coupled to the sensors 30 in accordancewith the above description.

Since an actuator 32 is essentially an inverse of a sensor in that anactuator converts an electrical signal into a physical condition, whilea sensor converts a physical condition into an electrical signal, thedrive-sense circuits 28 can be used to power actuators 32. Thus, in thisexample, the computing device 12-3 provides actuation signals to thedrive-sense circuits 28 for the actuators 32. The drive-sense circuitsmodulate the actuation signals on to power signals or regulated controlsignals, which are provided to the actuators 32. The actuators 32 arepowered from the power signals or regulated control signals and producethe desired physical condition from the modulated actuation signals.

As another example of operation, computing device 12-x is coupled to adrive-sense circuit 28 that is coupled to a sensor 30 and is coupled toa drive-sense circuit 28 that is coupled to an actuator 32. In thisexample, the sensor 30 and the actuator 32 are for use by the computingdevice 12-x. For example, the sensor 30 may be a piezoelectricmicrophone and the actuator 32 may be a piezoelectric speaker.

FIG. 2 is a schematic block diagram of an embodiment of a computingdevice 12 (e.g., any one of 12-1 through 12-x). The computing device 12includes a core control module 40, one or more processing modules 42,one or more main memories 44, cache memory 46, a video graphicsprocessing module 48, a display 50, an Input-Output (I/O) peripheralcontrol module 52, one or more input interface modules 56, one or moreoutput interface modules 58, one or more network interface modules 60,and one or more memory interface modules 62. A processing module 42 isdescribed in greater detail at the end of the detailed description ofthe invention section and, in an alternative embodiment, has a directionconnection to the main memory 44. In an alternate embodiment, the corecontrol module 40 and the I/O and/or peripheral control module 52 areone module, such as a chipset, a quick path interconnect (QPI), and/oran ultra-path interconnect (UPI).

Each of the main memories 44 includes one or more Random Access Memory(RAM) integrated circuits, or chips. For example, a main memory 44includes four DDR4 (4th generation of double data rate) RAM chips, eachrunning at a rate of 2,400 MHz. In general, the main memory 44 storesdata and operational instructions most relevant for the processingmodule 42. For example, the core control module 40 coordinates thetransfer of data and/or operational instructions from the main memory 44and the memory 64-66. The data and/or operational instructions retrievefrom memory 64-66 are the data and/or operational instructions requestedby the processing module or will most likely be needed by the processingmodule. When the processing module is done with the data and/oroperational instructions in main memory, the core control module 40coordinates sending updated data to the memory 64-66 for storage.

The memory 64-66 includes one or more hard drives, one or more solidstate memory chips, and/or one or more other large capacity storagedevices that, in comparison to cache memory and main memory devices,is/are relatively inexpensive with respect to cost per amount of datastored. The memory 64-66 is coupled to the core control module 40 viathe I/O and/or peripheral control module 52 and via one or more memoryinterface modules 62. In an embodiment, the I/O and/or peripheralcontrol module 52 includes one or more Peripheral Component Interface(PCI) buses to which peripheral components connect to the core controlmodule 40. A memory interface module 62 includes a software driver and ahardware connector for coupling a memory device to the I/O and/orperipheral control module 52. For example, a memory interface 62 is inaccordance with a Serial Advanced Technology Attachment (SATA) port.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and the network(s) 26 via the I/O and/orperipheral control module 52, the network interface module(s) 60, and anetwork card 68 or 70. A network card 68 or 70 includes a wirelesscommunication unit or a wired communication unit. A wirelesscommunication unit includes a wireless local area network (WLAN)communication device, a cellular communication device, a Bluetoothdevice, and/or a ZigBee communication device. A wired communication unitincludes a Gigabit LAN connection, a Firewire connection, and/or aproprietary computer wired connection. A network interface module 60includes a software driver and a hardware connector for coupling thenetwork card to the I/O and/or peripheral control module 52. Forexample, the network interface module 60 is in accordance with one ormore versions of IEEE 802.11, cellular telephone protocols, 10/100/1000Gigabit LAN protocols, etc.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and input device(s) 72 via the input interfacemodule(s) 56 and the I/O and/or peripheral control module 52. An inputdevice 72 includes a keypad, a keyboard, control switches, a touchpad, amicrophone, a camera, etc. An input interface module 56 includes asoftware driver and a hardware connector for coupling an input device tothe I/O and/or peripheral control module 52. In an embodiment, an inputinterface module 56 is in accordance with one or more Universal SerialBus (USB) protocols.

The core control module 40 coordinates data communications between theprocessing module(s) 42 and output device(s) 74 via the output interfacemodule(s) 58 and the I/O and/or peripheral control module 52. An outputdevice 74 includes a speaker, etc. An output interface module 58includes a software driver and a hardware connector for coupling anoutput device to the I/O and/or peripheral control module 52. In anembodiment, an output interface module 56 is in accordance with one ormore audio codec protocols.

The processing module 42 communicates directly with a video graphicsprocessing module 48 to display data on the display 50. The display 50includes an LED (light emitting diode) display, an LCD (liquid crystaldisplay), and/or other type of display technology. The display has aresolution, an aspect ratio, and other features that affect the qualityof the display. The video graphics processing module 48 receives datafrom the processing module 42, processes the data to produce rendereddata in accordance with the characteristics of the display, and providesthe rendered data to the display 50.

FIG. 2 further illustrates sensors 30 and actuators 32 coupled todrive-sense circuits 28, which are coupled to the input interface module56 (e.g., USB port). Alternatively, one or more of the drive-sensecircuits 28 is coupled to the computing device via a wireless networkcard (e.g., WLAN) or a wired network card (e.g., Gigabit LAN). While notshown, the computing device 12 further includes a BIOS (Basic InputOutput System) memory coupled to the core control module 40.

FIG. 3 is a schematic block diagram of another embodiment of a computingdevice 14 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touchscreen 16, an Input-Output (I/O)peripheral control module 52, one or more input interface modules 56,one or more output interface modules 58, one or more network interfacemodules 60, and one or more memory interface modules 62. The touchscreen16 includes a touchscreen display 80, a plurality of sensors 30, aplurality of drive-sense circuits (DSC), and a touchscreen processingmodule 82.

Computing device 14 operates similarly to computing device 12 of FIG. 2with the addition of a touchscreen as an input device. The touchscreenincludes a plurality of sensors (e.g., electrodes, capacitor sensingcells, capacitor sensors, inductive sensor, etc.) to detect a proximaltouch of the screen. For example, when one or more fingers touches thescreen, capacitance of sensors proximal to the touch(es) are affected(e.g., impedance changes). The drive-sense circuits (DSC) coupled to theaffected sensors detect the change and provide a representation of thechange to the touchscreen processing module 82, which may be a separateprocessing module or integrated into the processing module 42.

The touchscreen processing module 82 processes the representativesignals from the drive-sense circuits (DSC) to determine the location ofthe touch(es). This information is inputted to the processing module 42for processing as an input. For example, a touch represents a selectionof a button on screen, a scroll function, a zoom in-out function, etc.

FIG. 4 is a schematic block diagram of another embodiment of a computingdevice 18 that includes a core control module 40, one or more processingmodules 42, one or more main memories 44, cache memory 46, a videographics processing module 48, a touch and tactile screen 20, anInput-Output (I/O) peripheral control module 52, one or more inputinterface modules 56, one or more output interface modules 58, one ormore network interface modules 60, and one or more memory interfacemodules 62. The touch and tactile screen 20 includes a touch and tactilescreen display 90, a plurality of sensors 30, a plurality of actuators32, a plurality of drive-sense circuits (DSC), a touchscreen processingmodule 82, and a tactile screen processing module 92.

Computing device 18 operates similarly to computing device 14 of FIG. 3with the addition of a tactile aspect to the screen 20 as an outputdevice. The tactile portion of the screen 20 includes the plurality ofactuators (e.g., piezoelectric transducers to create vibrations,solenoids to create movement, etc.) to provide a tactile feel to thescreen 20. To do so, the processing module creates tactile data, whichis provided to the appropriate drive-sense circuits (DSC) via thetactile screen processing module 92, which may be a stand-aloneprocessing module or integrated into processing module 42. Thedrive-sense circuits (DSC) convert the tactile data into drive-actuatesignals and provide them to the appropriate actuators to create thedesired tactile feel on the screen 20.

FIG. 5A is a schematic plot diagram of a computing subsystem 25 thatincludes a sensed data processing module 65, a plurality ofcommunication modules 61A-x, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1 . The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing devices in which processing modules 42A-xreside.

A drive-sense circuit 28 (or multiple drive-sense circuits), aprocessing module (e.g., 41A), and a communication module (e.g., 61A)are within a common computing device. Each grouping of a drive-sensecircuit(s), processing module, and communication module is in a separatecomputing device. A communication module 61A-x is constructed inaccordance with one or more wired communication protocol and/or one ormore wireless communication protocols that is/are in accordance with theone or more of the Open System Interconnection (OSI) model, theTransmission Control Protocol/Internet Protocol (TCP/IP) model, andother communication protocol module.

In an example of operation, a processing module (e.g., 42A) provides acontrol signal to its corresponding drive-sense circuit 28. Theprocessing module 42 A may generate the control signal, receive it fromthe sensed data processing module 65, or receive an indication from thesensed data processing module 65 to generate the control signal. Thecontrol signal enables the drive-sense circuit 28 to provide a drivesignal to its corresponding sensor. The control signal may furtherinclude a reference signal having one or more frequency components tofacilitate creation of the drive signal and/or interpreting a sensedsignal received from the sensor.

Based on the control signal, the drive-sense circuit 28 provides thedrive signal to its corresponding sensor (e.g., 1) on a drive & senseline. While receiving the drive signal (e.g., a power signal, aregulated source signal, etc.), the sensor senses a physical condition1-x (e.g., acoustic waves, a biological condition, a chemical condition,an electric condition, a magnetic condition, an optical condition, athermal condition, and/or a mechanical condition). As a result of thephysical condition, an electrical characteristic (e.g., impedance,voltage, current, capacitance, inductance, resistance, reactance, etc.)of the sensor changes, which affects the drive signal. Note that if thesensor is an optical sensor, it converts a sensed optical condition intoan electrical characteristic.

The drive-sense circuit 28 detects the effect on the drive signal viathe drive & sense line and processes the affect to produce a signalrepresentative of power change, which may be an analog or digitalsignal. The processing module 42A receives the signal representative ofpower change, interprets it, and generates a value representing thesensed physical condition. For example, if the sensor is sensingpressure, the value representing the sensed physical condition is ameasure of pressure (e.g., x PSI (pounds per square inch)).

In accordance with a sensed data process function (e.g., algorithm,application, etc.), the sensed data processing module 65 gathers thevalues representing the sensed physical conditions from the processingmodules. Since the sensors 1-x may be the same type of sensor (e.g., apressure sensor), may each be different sensors, or a combinationthereof; the sensed physical conditions may be the same, may each bedifferent, or a combination thereof. The sensed data processing module65 processes the gathered values to produce one or more desired results.For example, if the computing subsystem 25 is monitoring pressure alonga pipeline, the processing of the gathered values indicates that thepressures are all within normal limits or that one or more of the sensedpressures is not within normal limits.

As another example, if the computing subsystem 25 is used in amanufacturing facility, the sensors are sensing a variety of physicalconditions, such as acoustic waves (e.g., for sound proofing, soundgeneration, ultrasound monitoring, etc.), a biological condition (e.g.,a bacterial contamination, etc.) a chemical condition (e.g.,composition, gas concentration, etc.), an electric condition (e.g.,current levels, voltage levels, electro-magnetic interference, etc.), amagnetic condition (e.g., induced current, magnetic field strength,magnetic field orientation, etc.), an optical condition (e.g., ambientlight, infrared, etc.), a thermal condition (e.g., temperature, etc.),and/or a mechanical condition (e.g., physical position, force, pressure,acceleration, etc.).

The computing subsystem 25 may further include one or more actuators inplace of one or more of the sensors and/or in addition to the sensors.When the computing subsystem 25 includes an actuator, the correspondingprocessing module provides an actuation control signal to thecorresponding drive-sense circuit 28. The actuation control signalenables the drive-sense circuit 28 to provide a drive signal to theactuator via a drive & actuate line (e.g., similar to the drive & senseline, but for the actuator). The drive signal includes one or morefrequency components and/or amplitude components to facilitate a desiredactuation of the actuator.

In addition, the computing subsystem 25 may include an actuator andsensor working in concert. For example, the sensor is sensing thephysical condition of the actuator. In this example, a drive-sensecircuit provides a drive signal to the actuator and another drive sensesignal provides the same drive signal, or a scaled version of it, to thesensor. This allows the sensor to provide near immediate and continuoussensing of the actuator's physical condition. This further allows forthe sensor to operate at a first frequency and the actuator to operateat a second frequency.

In an embodiment, the computing subsystem is a stand-alone system for awide variety of applications (e.g., manufacturing, pipelines, testing,monitoring, security, etc.). In another embodiment, the computingsubsystem 25 is one subsystem of a plurality of subsystems forming alarger system. For example, different subsystems are employed based ongeographic location. As a specific example, the computing subsystem 25is deployed in one section of a factory and another computing subsystemis deployed in another part of the factory. As another example,different subsystems are employed based function of the subsystems. As aspecific example, one subsystem monitors a city's traffic lightoperation and another subsystem monitors the city's sewage treatmentplants.

Regardless of the use and/or deployment of the computing system, thephysical conditions it is sensing, and/or the physical conditions it isactuating, each sensor and each actuator (if included) is driven andsensed by a single line as opposed to separate drive and sense lines.This provides many advantages including, but not limited to, lower powerrequirements, better ability to drive high impedance sensors, lower lineto line interference, and/or concurrent sensing functions.

FIG. 5B is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a plurality of processing modules 42A-x, aplurality of drive sense circuits 28, and a plurality of sensors 1-x,which may be sensors 30 of FIG. 1 . The sensed data processing module 65is one or more processing modules within one or more servers 22 and/orone more processing modules in one or more computing devices that aredifferent than the computing device, devices, in which processingmodules 42A-x reside.

In an embodiment, the drive-sense circuits 28, the processing modules,and the communication module are within a common computing device. Forexample, the computing device includes a central processing unit thatincludes a plurality of processing modules. The functionality andoperation of the sensed data processing module 65, the communicationmodule 61, the processing modules 42A-x, the drive sense circuits 28,and the sensors 1-x are as discussed with reference to FIG. 5A.

FIG. 5C is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a sensed data processing module 65,a communication module 61, a processing module 42, a plurality of drivesense circuits 28, and a plurality of sensors 1-x, which may be sensors30 of FIG. 1 . The sensed data processing module 65 is one or moreprocessing modules within one or more servers 22 and/or one moreprocessing modules in one or more computing devices that are differentthan the computing device in which the processing module 42 resides.

In an embodiment, the drive-sense circuits 28, the processing module,and the communication module are within a common computing device. Thefunctionality and operation of the sensed data processing module 65, thecommunication module 61, the processing module 42, the drive sensecircuits 28, and the sensors 1-x are as discussed with reference to FIG.5A.

FIG. 5D is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a referencesignal circuit 100, a plurality of drive sense circuits 28, and aplurality of sensors 30. The processing module 42 includes a drive-senseprocessing block 104, a drive-sense control block 102, and a referencecontrol block 106. Each block 102-106 of the processing module 42 may beimplemented via separate modules of the processing module, may be acombination of software and hardware within the processing module,and/or may be field programmable modules within the processing module42.

In an example of operation, the drive-sense control block 104 generatesone or more control signals to activate one or more of the drive-sensecircuits 28. For example, the drive-sense control block 102 generates acontrol signal that enables of the drive-sense circuits 28 for a givenperiod of time (e.g., 1 second, 1 minute, etc.). As another example, thedrive-sense control block 102 generates control signals to sequentiallyenable the drive-sense circuits 28. As yet another example, thedrive-sense control block 102 generates a series of control signals toperiodically enable the drive-sense circuits 28 (e.g., enabled onceevery second, every minute, every hour, etc.).

Continuing with the example of operation, the reference control block106 generates a reference control signal that it provides to thereference signal circuit 100. The reference signal circuit 100generates, in accordance with the control signal, one or more referencesignals for the drive-sense circuits 28. For example, the control signalis an enable signal, which, in response, the reference signal circuit100 generates a pre-programmed reference signal that it provides to thedrive-sense circuits 28. In another example, the reference signalcircuit 100 generates a unique reference signal for each of thedrive-sense circuits 28. In yet another example, the reference signalcircuit 100 generates a first unique reference signal for each of thedrive-sense circuits 28 in a first group and generates a second uniquereference signal for each of the drive-sense circuits 28 in a secondgroup.

The reference signal circuit 100 may be implemented in a variety ofways. For example, the reference signal circuit 100 includes a DC(direct current) voltage generator, an AC voltage generator, and avoltage combining circuit. The DC voltage generator generates a DCvoltage at a first level and the AC voltage generator generates an ACvoltage at a second level, which is less than or equal to the firstlevel. The voltage combining circuit combines the DC and AC voltages toproduce the reference signal. As examples, the reference signal circuit100 generates a reference signal similar to the signals shown in FIG. 7, which will be subsequently discussed.

As another example, the reference signal circuit 100 includes a DCcurrent generator, an AC current generator, and a current combiningcircuit. The DC current generator generates a DC current a first currentlevel and the AC current generator generates an AC current at a secondcurrent level, which is less than or equal to the first current level.The current combining circuit combines the DC and AC currents to producethe reference signal.

Returning to the example of operation, the reference signal circuit 100provides the reference signal, or signals, to the drive-sense circuits28. When a drive-sense circuit 28 is enabled via a control signal fromthe drive sense control block 102, it provides a drive signal to itscorresponding sensor 30. As a result of a physical condition, anelectrical characteristic of the sensor is changed, which affects thedrive signal. Based on the detected effect on the drive signal and thereference signal, the drive-sense circuit 28 generates a signalrepresentative of the effect on the drive signal.

The drive-sense circuit provides the signal representative of the effecton the drive signal to the drive-sense processing block 104. Thedrive-sense processing block 104 processes the representative signal toproduce a sensed value 97 of the physical condition (e.g., a digitalvalue that represents a specific temperature, a specific pressure level,etc.). The processing module 42 provides the sensed value 97 to anotherapplication running on the computing device, to another computingdevice, and/or to a server 22.

FIG. 5E is a schematic block diagram of another embodiment of acomputing subsystem 25 that includes a processing module 42, a pluralityof drive sense circuits 28, and a plurality of sensors 30. Thisembodiment is similar to the embodiment of FIG. 5D with thefunctionality of the drive-sense processing block 104, a drive-sensecontrol block 102, and a reference control block 106 shown in greaterdetail. For instance, the drive-sense control block 102 includesindividual enable/disable blocks 102-1 through 102-y. An enable/disableblock functions to enable or disable a corresponding drive-sense circuitin a manner as discussed above with reference to FIG. 5D.

The drive-sense processing block 104 includes variance determiningmodules 104-1 a through y and variance interpreting modules 104-2 athrough y. For example, variance determining module 104-1 a receives,from the corresponding drive-sense circuit 28, a signal representativeof a physical condition sensed by a sensor. The variance determiningmodule 104-1 a functions to determine a difference from the signalrepresenting the sensed physical condition with a signal representing aknown, or reference, physical condition. The variance interpretingmodule 104-1 b interprets the difference to determine a specific valuefor the sensed physical condition.

As a specific example, the variance determining module 104-1 a receivesa digital signal of 1001 0110 (150 in decimal) that is representative ofa sensed physical condition (e.g., temperature) sensed by a sensor fromthe corresponding drive-sense circuit 28. With 8-bits, there are 2⁸(256) possible signals representing the sensed physical condition.Assume that the units for temperature is Celsius and a digital value of0100 0000 (64 in decimal) represents the known value for 25 degreeCelsius. The variance determining module 104-b 1 determines thedifference between the digital signal representing the sensed value(e.g., 1001 0110, 150 in decimal) and the known signal value of (e.g.,0100 0000, 64 in decimal), which is 0011 0000 (86 in decimal). Thevariance determining module 104-b 1 then determines the sensed valuebased on the difference and the known value. In this example, the sensedvalue equals 25+86*(100/256)=25+33.6=58.6 degrees Celsius.

FIG. 6 is a schematic block diagram of a drive center circuit 28-acoupled to a sensor 30. The drive sense-sense circuit 28 includes apower source circuit 110 and a power signal change detection circuit112. The sensor 30 includes one or more transducers that have varyingelectrical characteristics (e.g., capacitance, inductance, impedance,current, voltage, etc.) based on varying physical conditions 114 (e.g.,pressure, temperature, biological, chemical, etc.), or vice versa (e.g.,an actuator).

The power source circuit 110 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 116 to the sensor 30. The power sourcecircuit 110 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal, a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The power source circuit 110 generates the power signal 116 to include aDC (direct current) component and/or an oscillating component.

When receiving the power signal 116 and when exposed to a condition 114,an electrical characteristic of the sensor affects 118 the power signal.When the power signal change detection circuit 112 is enabled, itdetects the affect 118 on the power signal as a result of the electricalcharacteristic of the sensor. For example, the power signal is a 1.5voltage signal and, under a first condition, the sensor draws 1 milliampof current, which corresponds to an impedance of 1.5 K Ohms. Under asecond conditions, the power signal remains at 1.5 volts and the currentincreases to 1.5 milliamps. As such, from condition 1 to condition 2,the impedance of the sensor changed from 1.5 K Ohms to 1 K Ohms. Thepower signal change detection circuit 112 determines this change andgenerates a representative signal 120 of the change to the power signal.

As another example, the power signal is a 1.5 voltage signal and, undera first condition, the sensor draws 1 milliamp of current, whichcorresponds to an impedance of 1.5 K Ohms. Under a second conditions,the power signal drops to 1.3 volts and the current increases to 1.3milliamps. As such, from condition 1 to condition 2, the impedance ofthe sensor changed from 1.5 K Ohms to 1 K Ohms. The power signal changedetection circuit 112 determines this change and generates arepresentative signal 120 of the change to the power signal.

The power signal 116 includes a DC component 122 and/or an oscillatingcomponent 124 as shown in FIG. 7 . The oscillating component 124includes a sinusoidal signal, a square wave signal, a triangular wavesignal, a multiple level signal (e.g., has varying magnitude over timewith respect to the DC component), and/or a polygonal signal (e.g., hasa symmetrical or asymmetrical polygonal shape with respect to the DCcomponent). Note that the power signal is shown without affect from thesensor as the result of a condition or changing condition.

In an embodiment, power generating circuit 110 varies frequency of theoscillating component 124 of the power signal 116 so that it can betuned to the impedance of the sensor and/or to be off-set in frequencyfrom other power signals in a system. For example, a capacitancesensor's impedance decreases with frequency. As such, if the frequencyof the oscillating component is too high with respect to thecapacitance, the capacitor looks like a short and variances incapacitances will be missed. Similarly, if the frequency of theoscillating component is too low with respect to the capacitance, thecapacitor looks like an open and variances in capacitances will bemissed.

In an embodiment, the power generating circuit 110 varies magnitude ofthe DC component 122 and/or the oscillating component 124 to improveresolution of sensing and/or to adjust power consumption of sensing. Inaddition, the power generating circuit 110 generates the drive signal110 such that the magnitude of the oscillating component 124 is lessthan magnitude of the DC component 122.

FIG. 6A is a schematic block diagram of a drive center circuit 28-a 1coupled to a sensor 30. The drive sense-sense circuit 28-a 1 includes asignal source circuit 111, a signal change detection circuit 113, and apower source 115. The power source 115 (e.g., a battery, a power supply,a current source, etc.) generates a voltage and/or current that iscombined with a signal 117, which is produced by the signal sourcecircuit 111. The combined signal is supplied to the sensor 30.

The signal source circuit 111 may be a voltage supply circuit (e.g., abattery, a linear regulator, an unregulated DC-to-DC converter, etc.) toproduce a voltage-based signal 117, a current supply circuit (e.g., acurrent source circuit, a current mirror circuit, etc.) to produce acurrent-based signal 117, or a circuit that provide a desired powerlevel to the sensor and substantially matches impedance of the sensor.The signal source circuit 111 generates the signal 117 to include a DC(direct current) component and/or an oscillating component.

When receiving the combined signal (e.g., signal 117 and power from thepower source) and when exposed to a condition 114, an electricalcharacteristic of the sensor affects 119 the signal. When the signalchange detection circuit 113 is enabled, it detects the affect 119 onthe signal as a result of the electrical characteristic of the sensor.

FIG. 8 is an example of a sensor graph that plots an electricalcharacteristic versus a condition. The sensor has a substantially linearregion in which an incremental change in a condition produces acorresponding incremental change in the electrical characteristic. Thegraph shows two types of electrical characteristics: one that increasesas the condition increases and the other that decreases and thecondition increases. As an example of the first type, impedance of atemperature sensor increases and the temperature increases. As anexample of a second type, a capacitance touch sensor decreases incapacitance as a touch is sensed.

FIG. 9 is a schematic block diagram of another example of a power signalgraph in which the electrical characteristic or change in electricalcharacteristic of the sensor is affecting the power signal. In thisexample, the effect of the electrical characteristic or change inelectrical characteristic of the sensor reduced the DC component but hadlittle to no effect on the oscillating component. For example, theelectrical characteristic is resistance. In this example, the resistanceor change in resistance of the sensor decreased the power signal,inferring an increase in resistance for a relatively constant current.

FIG. 10 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor reduced magnitude of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is impedance of a capacitorand/or an inductor. In this example, the impedance or change inimpedance of the sensor decreased the magnitude of the oscillatingsignal component, inferring an increase in impedance for a relativelyconstant current.

FIG. 11 is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor shifted frequency of theoscillating component but had little to no effect on the DC component.For example, the electrical characteristic is reactance of a capacitorand/or an inductor. In this example, the reactance or change inreactance of the sensor shifted frequency of the oscillating signalcomponent, inferring an increase in reactance (e.g., sensor isfunctioning as an integrator or phase shift circuit).

FIG. 11A is a schematic block diagram of another example of a powersignal graph in which the electrical characteristic or change inelectrical characteristic of the sensor is affecting the power signal.In this example, the effect of the electrical characteristic or changein electrical characteristic of the sensor changes the frequency of theoscillating component but had little to no effect on the DC component.For example, the sensor includes two transducers that oscillate atdifferent frequencies. The first transducer receives the power signal ata frequency of f₁ and converts it into a first physical condition. Thesecond transducer is stimulated by the first physical condition tocreate an electrical signal at a different frequency f₂. In thisexample, the first and second transducers of the sensor change thefrequency of the oscillating signal component, which allows for moregranular sensing and/or a broader range of sensing.

FIG. 12 is a schematic block diagram of an embodiment of a power signalchange detection circuit 112 receiving the affected power signal 118 andthe power signal 116 as generated to produce, therefrom, the signalrepresentative 120 of the power signal change. The affect 118 on thepower signal is the result of an electrical characteristic and/or changein the electrical characteristic of a sensor; a few examples of theaffects are shown in FIGS. 8-11A.

In an embodiment, the power signal change detection circuit 112 detect achange in the DC component 122 and/or the oscillating component 124 ofthe power signal 116. The power signal change detection circuit 112 thengenerates the signal representative 120 of the change to the powersignal based on the change to the power signal. For example, the changeto the power signal results from the impedance of the sensor and/or achange in impedance of the sensor. The representative signal 120 isreflective of the change in the power signal and/or in the change in thesensor's impedance.

In an embodiment, the power signal change detection circuit 112 isconfigured to detect a change to the oscillating component at afrequency, which may be a phase shift, frequency change, and/or changein magnitude of the oscillating component. The power signal changedetection circuit 112 is also configured to generate the signalrepresentative of the change to the power signal based on the change tothe oscillating component at the frequency. The power signal changedetection circuit 112 is further configured to provide feedback to thepower source circuit 110 regarding the oscillating component. Thefeedback allows the power source circuit 110 to regulate the oscillatingcomponent at the desired frequency, phase, and/or magnitude.

FIG. 13 is a schematic block diagram of another embodiment of a drivesense circuit 28-b includes a change detection circuit 150, a regulationcircuit 152, and a power source circuit 154. The drive-sense circuit28-b is coupled to the sensor 30, which includes a transducer that hasvarying electrical characteristics (e.g., capacitance, inductance,impedance, current, voltage, etc.) based on varying physical conditions114 (e.g., pressure, temperature, biological, chemical, etc.).

The power source circuit 154 is operably coupled to the sensor 30 and,when enabled (e.g., from a control signal from the processing module 42,power is applied, a switch is closed, a reference signal is received,etc.) provides a power signal 158 to the sensor 30. The power sourcecircuit 154 may be a voltage supply circuit (e.g., a battery, a linearregulator, an unregulated DC-to-DC converter, etc.) to produce avoltage-based power signal or a current supply circuit (e.g., a currentsource circuit, a current mirror circuit, etc.) to produce acurrent-based power signal. The power source circuit 154 generates thepower signal 158 to include a DC (direct current) component and anoscillating component.

When receiving the power signal 158 and when exposed to a condition 114,an electrical characteristic of the sensor affects 160 the power signal.When the change detection circuit 150 is enabled, it detects the affect160 on the power signal as a result of the electrical characteristic ofthe sensor 30. The change detection circuit 150 is further configured togenerate a signal 120 that is representative of change to the powersignal based on the detected effect on the power signal.

The regulation circuit 152, when its enabled, generates regulationsignal 156 to regulate the DC component to a desired DC level and/orregulate the oscillating component to a desired oscillating level (e.g.,magnitude, phase, and/or frequency) based on the signal 120 that isrepresentative of the change to the power signal. The power sourcecircuit 154 utilizes the regulation signal 156 to keep the power signalat a desired setting 158 regardless of the electrical characteristic ofthe sensor. In this manner, the amount of regulation is indicative ofthe affect the electrical characteristic had on the power signal.

In an example, the power source circuit 158 is a DC-DC converterconfigured to provide a regulated power signal having DC and ACcomponents. The change detection circuit 150 is a comparator and theregulation circuit 152 is a pulse width modulator to produce theregulation signal 156. The comparator compares the power signal 158,which is affected by the sensor, with a reference signal that includesDC and AC components. When the electrical characteristics is at a firstlevel (e.g., a first impedance), the power signal is regulated toprovide a voltage and current such that the power signal substantiallyresembles the reference signal.

When the electrical characteristics changes to a second level (e.g., asecond impedance), the change detection circuit 150 detects a change inthe DC and/or AC component of the power signal 158 and generates therepresentative signal 120, which indicates the changes. The regulationcircuit 152 detects the change in the representative signal 120 andcreates the regulation signal to substantially remove the effect on thepower signal. The regulation of the power signal 158 may be done byregulating the magnitude of the DC and/or AC components, by adjustingthe frequency of AC component, and/or by adjusting the phase of the ACcomponent.

With respect to the operation of various drive-sense circuits asdescribed herein and/or their equivalents, note that the operation ofsuch a drive-sense circuit is operable simultaneously to drive and sensea signal via a single line. In comparison to switched, time-divided,time-multiplexed, etc. operation in which there is switching betweendriving and sensing (e.g., driving at first time, sensing at secondtime, etc.) of different respective signals at separate and distincttimes, the drive-sense circuit is operable simultaneously to performboth driving and sensing of a signal. In some examples, suchsimultaneous driving and sensing is performed via a single line using adrive-sense circuit.

In addition, other alternative implementations of various drive-sensecircuits (DSCs) are described in U.S. Utility patent application Ser.No. 16/113,379, entitled “DRIVE SENSE CIRCUIT WITH DRIVE-SENSE LINE,”(Attorney Docket No. SGS00009), filed Aug. 27, 2018, pending. Anyinstantiation of a drive-sense circuit as described herein may also beimplemented using any of the various implementations of variousdrive-sense circuits (DSCs) described in U.S. Utility patent applicationSer. No. 16/113,379.

In addition, note that the one or more signals provided from adrive-sense circuit (DSC) may be of any of a variety of types. Forexample, such a signal may be based on encoding of one or more bits togenerate one or more coded bits used to generate modulation data (orgenerally, data). For example, a device is configured to perform forwarderror correction (FEC) and/or error checking and correction (ECC) codeof one or more bits to generate one or more coded bits. Examples of FECand/or ECC may include turbo code, convolutional code, trellis codedmodulation (TCM), turbo trellis coded modulation (TTCM), low densityparity check (LDPC) code, Reed-Solomon (RS) code, BCH (Bose andRay-Chaudhuri, and Hocquenghem) code, binary convolutional code (BCC),Cyclic Redundancy Check (CRC), and/or any other type of ECC and/or FECcode and/or combination thereof, etc. Note that more than one type ofECC and/or FEC code may be used in any of various implementationsincluding concatenation (e.g., first ECC and/or FEC code followed bysecond ECC and/or FEC code, etc. such as based on an inner code/outercode architecture, etc.), parallel architecture (e.g., such that firstECC and/or FEC code operates on first bits while second ECC and/or FECcode operates on second bits, etc.), and/or any combination thereof.

Also, the one or more coded bits may then undergo modulation or symbolmapping to generate modulation symbols (e.g., the modulation symbols mayinclude data intended for one or more recipient devices, components,elements, etc.). Note that such modulation symbols may be generatedusing any of various types of modulation coding techniques. Examples ofsuch modulation coding techniques may include binary phase shift keying(BPSK), quadrature phase shift keying (QPSK), 8-phase shift keying(PSK), 16 quadrature amplitude modulation (QAM), 32 amplitude and phaseshift keying (APSK), etc., uncoded modulation, and/or any other desiredtypes of modulation including higher ordered modulations that mayinclude even greater number of constellation points (e.g., 1024 QAM,etc.).

In addition, note that a signal provided from a DSC may be of a uniquefrequency that is different from signals provided from other DSCs. Also,a signal provided from a DSC may include multiple frequenciesindependently or simultaneously. The frequency of the signal can behopped on a pre-arranged pattern. In some examples, a handshake isestablished between one or more DSCs and one or more processing modules(e.g., one or more controllers) such that the one or more DSC is/aredirected by the one or more processing modules regarding which frequencyor frequencies and/or which other one or more characteristics of the oneor more signals to use at one or more respective times and/or in one ormore particular situations.

With respect to any signal that is driven and simultaneously detected bya DSC, note that any additional signal that is coupled into a line, aconnection to an electrical node, an electrode, a touch sensor, a bus, acommunication link, a battery, a load, an electrical coupling orconnection, etc. associated with that DSC is also detectable. Forexample, a DSC that is associated with such a line, a connection to anelectrical node, an electrode, a touch sensor, a bus, a communicationlink, a power source such as an AC power source or battery, a load, anelectrical coupling or connection, etc. is configured to detect anysignal from one or more other lines, connection to electrical nodes,electrodes, touch sensors, buses, communication links, loads, electricalcouplings or connections, etc. that get coupled into that line,connection to an electrical node, electrode, touch sensor, bus,communication link, a power source such as an AC power source orbattery, load, electrical coupling or connection, etc.

Note that the different respective signals that are driven andsimultaneously sensed by one or more DSCs may be differentiated from oneanother. Appropriate filtering and processing can identify the varioussignals given their differentiation, orthogonality to one another,difference in frequency, etc. Other examples described herein and theirequivalents operate using any of a number of different characteristicsother than or in addition to frequency.

Moreover, with respect to any embodiment, diagram, example, etc. thatincludes more than one DSC, note that the DSCs may be implemented in avariety of manners. For example, all of the DSCs may be of the sametype, implementation, configuration, etc. In another example, the firstDSC may be of a first type, implementation, configuration, etc., and asecond DSC may be of a second type, implementation, configuration, etc.that is different than the first DSC. Considering a specific example, afirst DSC may be implemented to detect change of impedance associatedwith a line, a connection to an electrical node, an electrode, a touchsensor, a bus, a communication link, an electrical coupling orconnection, etc. associated with that first DSC, while a second DSC maybe implemented to detect change of voltage associated with a line, aconnection to an electrical node, an electrode, a touch sensor, a bus, acommunication link, an electrical coupling or connection, etc.associated with that second DSC. In addition, note that a third DSC maybe implemented to detect change of a current associated with a line, aconnection to an electrical node, an electrode, a touch sensor, a bus, acommunication link, an electrical coupling or connection, etc.associated with that DSC. In general, while a common reference may beused generally to show a DSC or multiple instantiations of a DSC withina given embodiment, diagram, example, etc., note that any particular DSCmay be implemented in accordance with any manner as described herein,such as described in U.S. Utility patent application Ser. No.16/113,379, etc. and/or their equivalents.

Note that certain of the diagrams herein show a computing device (e.g.,alternatively referred to as device; the terms computing device anddevice may be used interchangeably) that may include or be coupled toone or more processing modules. In certain instances, the one or moreprocessing modules is configured to communicate with and interact withone or more other devices including one or more of DSCs, one or morecomponents associated with a DSC, a battery, a load, a wire connectionor coupling a battery to a load, one or more multiple wires connectingor coupling one or more batteries to one or more loads, etc.

Note that any such implementation of one or more processing modules mayinclude integrated memory and/or be coupled to other memory. At leastsome of the memory stores operational instructions to be executed by theone or more processing modules. In addition, note that the one or moreprocessing modules may interface with one or more other devices,components, elements, etc. via one or more communication links,networks, communication pathways, channels, etc. (e.g., such as via oneor more communication interfaces of the device, such as may beintegrated into the one or more processing modules or be implemented asa separate component, circuitry, etc.).

In addition, when a DSC is implemented to communicate with and interactwith another element, the DSC is configured simultaneously to transmitand receive one or more signals with the element. For example, a DSC isconfigured simultaneously to sense (e.g., including to sense change of)and to drive one or more signals to the one element. During transmissionof a signal from a DSC, that same DSC is configured simultaneously tosense the signal being transmitted from the DSC including any changethereof including any other signal may be coupled into the signal thatis being transmitted from the DSC.

In addition, while many examples, embodiments, diagrams, etc. hereininclude one or more DSCs (e.g., coupled to one or more processingmodules and one or more connection to electrical nodes including someimplemented via a connection to an electrical node via a single line),note that any instantiation of a DSC may alternatively be implementedusing a channel drive circuitry, an Analog Front End (AFE) that includesanalog to digital and/or digital to analog conversion capability, etc.within alternative embodiments.

FIG. 14 is a schematic block diagram of an embodiment 1400 of adrive-sense circuit (DSC) that is interactive with a connection to anelectrical node via a single line a connection to an electrical node viaa single line in accordance with the present disclosure. Similar toother diagrams, examples, embodiments, etc. herein, the DSC 28-a 2 ofthis diagram is in communication with one or more processing modules 42.The DSC 28-a 2 is configured to provide a signal (e.g., a power signal,an electrode signal, transmit signal, a monitoring signal, etc.) to aconnection to an electrical node via a single line and simultaneously tosense that signal via the single line. Note that the connection to anelectrical node may be implemented in a variety of ways. For example,the DSC 28-a 2 is connected via a single line to the electrical node,and the electrical node is a point on another line at which the singleline from the DSC 28-a 2 connects. Consider an example in which abattery terminal is connected to a load terminal via another line, andthe DSC 28-a connects at a point along that other line at a first pointin that is proximate to the battery terminal. Consider another examplein which the battery terminal is connected to the load terminal viaanother line, and the DSC 28-a connects at another point along thatother line at a second point in that is proximate to the load terminal.Generally speaking, such an electrical node may be viewed as anyelectrical contact point at which the DSC 28—as of this diagram or anyother DSC described herein connects to another element (e.g., a line, aconnection to an electrical node, an electrode, a touch sensor, a bus, acommunication link, an electrical coupling or connection, etc.).

In some examples, sensing the signal includes detection of an electricalcharacteristic of the electrical node that is based on a response of theelectrical node to that signal. Examples of such an electricalcharacteristic may include detection of an impedance of the electricalnode such as a change of capacitance of the electrical node, detectionof one or more signals coupled into the electrical node such as from oneor more other electrodes, and/or other electrical characteristics.

This embodiment of a DSC 28-a 2 includes a current source 110-1 and apower signal change detection circuit 112-a 1. The power signal changedetection circuit 112-a 1 includes a power source reference circuit 130and a comparator 132. In some examples, the comparator 132 isalternatively be implemented as an operational amplifier. The currentsource 110-1 may be an independent current source, a dependent currentsource, a current mirror circuit, etc.

In an example of operation, the power source reference circuit 130provides a current reference 134 with DC and oscillating components tothe current source 110-1. The current source generates a current as thepower signal 116 based on the current reference 134. An electricalcharacteristic of the electrical node has an effect on the current powersignal 116. For example, if the impedance of the electrical nodedecreases and the current power signal 116 remains substantiallyunchanged, the voltage across the electrical node is decreased.

The comparator 132 compares the current reference 134 with the affectedpower signal 118 to produce the signal 120 that is representative of thechange to the power signal. For example, the current reference signal134 corresponds to a given current (I) times a given impedance (Z). Thecurrent reference generates the power signal to produce the givencurrent (I). If the impedance of the electrical node substantiallymatches the given impedance (Z), then the comparator's output isreflective of the impedances substantially matching. If the impedance ofthe electrical node is greater than the given impedance (Z), then thecomparator's output is indicative of how much greater the impedance ofthe electrical node is than that of the given impedance (Z). If theimpedance of the electrical node is less than the given impedance (Z),then the comparator's output is indicative of how much less theimpedance of the electrical node is than that of the given impedance(Z).

FIG. 15 is a schematic block diagram of another embodiment 1500 of a DSCthat is interactive with a connection to an electrical node via a singleline a connection to an electrical node via a single line in accordancewith the present disclosure. Similar to other diagrams, examples,embodiments, etc. herein, the DSC 28-a 3 of this diagram is incommunication with one or more processing modules 42. Similar to theprevious diagram, although providing a different embodiment of the DSC,the DSC 28-a 3 is configured to provide a signal to the electrical nodevia a single line and simultaneously to sense that signal via the singleline. In some examples, sensing the signal includes detection of anelectrical characteristic of the electrical node that is based on aresponse of the electrical node to that signal. Examples of such anelectrical characteristic may include detection of an impedance of theelectrical node such as a change of capacitance of the electrical node,detection of one or more signals coupled into the electrical node suchas from one or more other electrodes, and/or other electricalcharacteristics.

This embodiment of a DSC 28-a 3 includes a voltage source 110-2 and apower signal change detection circuit 112-a 2. The power signal changedetection circuit 112-a 2 includes a power source reference circuit130-2 and a comparator 132-2. The voltage source 110-2 may be a battery,a linear regulator, a DC-DC converter, etc.

In an example of operation, the power source reference circuit 130-2provides a voltage reference 136 with DC and oscillating components tothe voltage source 110-2. The voltage source generates a voltage as thepower signal 116 based on the voltage reference 136. An electricalcharacteristic of the electrical node has an effect on the voltage powersignal 116. For example, if the impedance of the electrical nodedecreases and the voltage power signal 116 remains substantiallyunchanged, the current through the electrical node is increased.

The comparator 132 compares the voltage reference 136 with the affectedpower signal 118 to produce the signal 120 that is representative of thechange to the power signal. For example, the voltage reference signal134 corresponds to a given voltage (V) divided by a given impedance (Z).The voltage reference generates the power signal to produce the givenvoltage (V). If the impedance of the electrical node substantiallymatches the given impedance (Z), then the comparator's output isreflective of the impedances substantially matching. If the impedance ofthe electrical node is greater than the given impedance (Z), then thecomparator's output is indicative of how much greater the impedance ofthe electrical node is than that of the given impedance (Z). If theimpedance of the electrical node is less than the given impedance (Z),then the comparator's output is indicative of how much less theimpedance of the electrical node is than that of the given impedance(Z).

In certain examples, the DSC is implemented by a power source circuitand a power source change detection circuit. The power source circuit isoperably coupled via a single line to the electrical node. When enabled,the power source circuit is configured to provide an analog signal viathe single line coupling to the electrical node. The analog signalincludes a DC (direct current) component and/or an oscillatingcomponent. The power source change detection circuit is operably coupledto the power source circuit. When enabled, the power source changedetection circuit is configured to detect an effect on the analog signalthat is based on an electrical characteristic of the TSD electrode andto generate the digital signal that is representative of the change ofimpedance of the electrical node.

In even other examples, the power source circuit is implemented by apower source to source a voltage and/or a current via the single line tothe electrical node. The power source change detection circuit includesa power source reference circuit configured to provide a voltagereference and/or a current reference. The power source change detectioncircuit also includes a comparator configured to compare the voltageand/or the current provided via the single line to the electrical nodeto the voltage reference and/or the current reference to produce theanalog signal.

In another implementation, the DSC is implemented by a power sourcecircuit and a power source change detection circuit. The power sourcecircuit is operably coupled via a single line to the electrical node.When enabled, the power source circuit is configured to provide ananalog signal via the single line coupling to the electrical node. Theanalog signal includes at least one of a DC (direct current) componentor an oscillating component. The power source change detection circuitis operably coupled to the power source circuit. When enabled, the powersource change detection circuit is configured to detect an effect on theanalog signal that is based on an electrical characteristic of theelectrical node and to generate the digital signal that isrepresentative of the change of impedance of the electrical node.

In yet other examples, the power source circuit includes a power sourceto source at least one of a voltage or a current via the single line tothe electrical node. The power source change detection circuit includesa power source reference circuit configured to provide at least one of avoltage reference or a current reference, and a comparator configured tocompare the at least one of the voltage and the current provided via thesingle line to the electrical node to the at least one of the voltagereference and the current reference to produce the analog signal.

With respect to many of the following diagrams, one or more processingmodules 42, which includes and/or is coupled to memory, is configured tocommunicate and interact with one or more DSCs 28 that are coupled toone or more electrodes of the panel or a touchscreen display such as maybe implemented within a touch sensor device (TSD) (with or withoutdisplay functionality). In many of the diagrams, the DSCs 28 are shownas interfacing with electrodes of the panel or touchscreen display(e.g., via interface 86 that couples to row electrodes and anotherinterface 86 that couples to column electrodes). Note that the number oflines that coupled the one or more processing modules 42 to therespective one or more DSCs 28, and from the one or more DSCs 28 to therespective interfaces 86 may be varied (e.g., such as may be describedby n and m, which are positive integers greater than or equal to 1).Note that the respective values may be the same or different withindifferent respective embodiments and/or examples herein.

Note that the same and/or different respective signals may be drivensimultaneously sensed by the respective one or more DSCs 28 that coupleto the electrical nodes within any of the various embodiments and/orexamples herein. In some examples, a common signal (e.g., having commonone or more characteristics) is implemented and also differentrespective signals (e.g., different respective signals having one ormore different characteristics) are implemented. For example, withrespect to touchscreens, touchscreen displays, touch sensor devices,etc., a common signal (e.g., having common one or more characteristics)is implemented in accordance with self signaling on each electrode of atouchscreen, a touchscreen display, a touch sensor device, etc., andalso different respective signals (e.g., different respective signalshaving one or more different characteristics) are implemented inaccordance with mutual signal such that those mutual signals areprovided to some of the electrodes of the touchscreen, the touchscreendisplay, the touch sensor device, etc., and are detected using evenother of the electrodes of the touchscreen, the touchscreen display, thetouch sensor device, etc. Again, as mentioned above, note that thedifferent respective signals that are driven and simultaneously sensedvia the electrical nodes may be differentiated from one another.

FIG. 16A is a schematic block diagram of another embodiment 1601 of aDSC configured simultaneously to drive and sense a drive signal to aconnection to an electrical node via a single line in accordance withthe present disclosure. In this diagram, one or more processing modules42 is configured to communicate with and interact with a drive-sensecircuit (DSC) 28-16 a. The one or more processing modules 42 is coupledto a DSC 28-16 a and is configured to provide control to and supportcommunication with the DSC 28-16 a. Note that the one or more processingmodules 42 may include integrated memory and/or be coupled to othermemory. At least some of the memory stores operational instructions tobe executed by the one or more processing modules 42. In addition, notethat the one or more processing modules 42 may interface with one ormore other devices, components, elements, etc. via one or morecommunication links, networks, communication pathways, channels, etc.

In this diagram, the one or more processing module 42 is configured toprovide a reference signal to one of the inputs of a comparator 1615. Aswith respect to other diagrams, embodiments, diagrams, etc., herein.Note that the comparator 1615 may alternatively be implemented as anoperational amplifier. Note that the drive signal provided to theelectrical node is implemented to track, follow, match, etc. thereference signal provided to the one of the inputs of the comparator1615. As the drive signal provided to the electrical node may beaffected based on one or more electrical characteristics of theelectrical node including any change thereof, the DSC 28-16 a isconfigured to adapt the drive signal to track, follow, match, etc. thereference signal. Note that the comparator 1615 may alternatively beimplemented as an operational amplifier in certain embodiments. Theother input of the comparator 1615 is coupled to provide a drive signaldirectly from the DSC 28-16 a to the electrical node. The DSC 28-16 a isconfigured to provide the drive signal to the electrical node and alsosimultaneously to sense the drive signal and to detect any effect on thedrive signal including any change of the drive signal based on one ormore electrical characteristics of the electrical node.

The output of the comparator 1615 is provided to an analog to digitalconverter (ADC) 1660 that is configured to generate a digital signalthat is representative of the effect on the drive signal that isprovided to the electrical node. In addition, the digital signal isoutput from the ADC 1660 is fed back via a digital to analog converter(DAC) 1662 to a dependent current source that is configured to generatethe drive signal that is provided to the electrical node and also to theinput of the comparator 1615 that is also coupled to the electricalnode. In certain examples, note that the dependent current source isconfigured to source and/or sink current as may be needed to ensure thevoltage at the electrical node tracks, follows, matches, etc. thereference signal. In this diagram, the dependent current source isoperated based on digital control signaling from the DAC 1662. Inaddition, the digital signal that is representative of the effect on thedrive signal, as generated by the ADC 1660, is also provided to the oneor more processing modules 42. The one or more processing modules 42 isconfigured to provide control to and be in communication with the DSC28-16 a including to adapt the reference signal so as to adapt the drivesignal is provided to the electrical node and also to the input of thecomparator 1615 that is also coupled to the electrical node therein asdesired to direct and control operation of the electrical node via thedrive signal.

FIG. 16B is a schematic block diagram of another embodiment 1602 of aDSC configured simultaneously to drive and sense a drive signal to aconnection to an electrical node via a single line in accordance withthe present disclosure. In this diagram, one or more processing modules42 is configured to communicate with and interact with a drive-sensecircuit (DSC) 28-16 b. The one or more processing modules 42 is coupledto a DSC 28-16 b and is configured to provide control to and supportcommunication with the DSC 28-16 b. Note that the one or more processingmodules 42 may include integrated memory and/or be coupled to othermemory. At least some of the memory stores operational instructions tobe executed by the one or more processing modules 42. In addition, notethat the one or more processing modules 42 may interface with one ormore other devices, components, elements, etc. via one or morecommunication links, networks, communication pathways, channels, etc.

This diagram has some similarities to the previous diagram with at leastone difference being that this diagram excludes the DAC 1662 of theprior diagram. In this diagram, within the DSC 28-16 b the analog outputsignal from the comparator 1615 is fed back directly to the dependentcurrent source that is configured to generate the drive signal that isprovided to the electrical node and also to the input of the comparator1615 thereby providing the drive signal (and simultaneously sensing thedrive signal) that is provided to the electrical node by the DSC 28-16b. In this diagram, the dependent current source is operated based onanalog control signaling from the analog output signal from thecomparator 1615.

FIG. 17 is a schematic block diagram of an embodiment 1700 of a leadacid battery such as may be serviced using one or more DSCs inaccordance with the present disclosure. Generally speaking, a lead acidbattery 1710 includes a number of cells each having approximately asimilar voltage per cell (e.g., often times cited as approximately 2.1 Vper cell and including 6 respective cells providing a nominal voltage of12.6 V). In some applications, 2 separate 6 V batteries are implementedwithin a given battery casing in series with one another to generate anoutput voltage of approximately 12 V. A nominal 6 V battery may beimplemented using three separate single cells each of approximate 2.1 Vper cell thereby providing an output voltage of approximately 6.3 V.

Each cell includes a respective negative plate (e.g., such as may beimplemented using sponge lead, etc.) and a positive plate (e.g., leaddioxide, etc.). The lead acid battery 1710 also includes a negativeterminal 1712 (e.g., anode) that is connected to a negative plate and apositive terminal 1714 (e.g., cathode) that is connected to a positiveplate. Within each cell, the negative plate and the positive plate areseparated by a separator or insulator. The respective cells are immersedwithin an electrolyte (e.g., often implemented using water and sulfuricacid).

During a charging cycle, or recharging process, a battery charger isconnected to the positive terminal 1714 and the negative terminal 1712.During this process, as electricity flows through the water portion ofthe electrolyte, some of the water is converted to its basic elements ofhydrogen and oxygen thereby producing gas within the casing of the leadacid battery 1710. Gassing of a battery can be problematic for a numberof reasons including the fact that these gases are extremely flammable.In addition, the gassing can reduce the amount of water content of theelectrolyte and dry out the battery. Some types of lead acid batteriesoperate such that they are vented to allow these gases to escape, butsealed lead acid batteries do not perform any such bending and keep suchgases trapped within the battery casing. Ideally and preferably, whenthe such gases are trapped within the battery casing, they willrecombine into the electrolyte are at however, there can be someinstances in which this does not occur such as based on the batterybeing overcharged, based on the battery including an internal electricalfailure of fault, based on an electrical failure or fault within one ormore of the cells, based on corrosion within the battery or on therespective battery terminals, based on buildup of lead sulfate oncertain plates of the battery, etc. among other possible adverseconditions that can adversely affect the health of a lead acid battery1710.

With respect to the seriousness of the gases produced within a lead acidbattery 1710 in these circumstances, note that oxygen and hydrogen arehighly flammable and can even be explosive in certain situations. Forexample, while hydrogen is not particularly toxic, at highconcentrations it is a highly explosive gas having a lower explosivelimit (LEL) concentration of approximately 4% by volume. Not only doesthe buildup of gas within a lead acid battery 1710 can adversely affectthe operation of the lead acid battery 1710 (e.g., adversely affectingthe electrolyte, drying out the battery by reducing the amount of waterwithin the electrolyte, etc.), but the buildup of such gases can be apotentially dangerous situation.

Gas buildup within the battery casing can generate pressure on thebattery casing. For example, this can cause the surface of the batteryto swell, bulge, deform, etc. Based on the excess of gas buildup inside.In addition, some non-sealed lead acid batteries include one or moreports via which one or more of the respective cells may be accessed suchas to check electrolyte levels, add electrolyte, add water, etc. In suchnon-sealed lead acid batteries, excessive gas buildup within the batterycasing will sometimes affect such ports before affecting other portionsof the battery casing in terms of swelling, bulging, deformation, etc.

FIG. 18 is a schematic block diagram of an embodiment 1800 of aLithium-ion battery such as may be serviced using one or more DSCs inaccordance with the present inv disclosure. Another type of battery is aLithium-ion battery 1830, sometimes referred to as a Li-ion battery.Lithium-ion batteries are used in a variety of applications includingportable and user devices such as laptop computers, cell phones,electronic pad devices, personal digital assistants, portable musicdevices, portable media players, etc. In addition, Lithium-ion batterieshave found a great deal of acceptance and traction within electricvehicle applications. For example, Lithium-ion batteries are used inmany plug-in hybrid and all-electric vehicles. With respect to anelectric vehicle applications, some electric vehicles are powered bywhat are often referred to as wet Lithium ion batteries that use aliquid electrolytes. There has been significant interest in researchefforts to develop Lithium-ion batteries that are implemented insolid-state such that they have cells that are made of solid and dryconductive material. Lithium-ion batteries have application to a widevariety of applications including power tools, electronics, electricvehicles, etc. among other possible applications.

Generally speaking, a Lithium-ion battery 1830 includes one or morecells each having approximately a similar voltage per cell (e.g., oftentimes cited as approximately 3.6 to 3.7 V per cell). Considering onepossible example, a Lithium-ion battery 1830 including 3-4 cells eachhaving a nominal approximate voltage of 3.6 to 3.7 V per cell will beable to provide an output voltage within the range of 10.8-14.8 V.

This diagram shows a Lithium-ion battery 1830 that includes a positivecurrent collector, such as made of aluminum, that is connected to apositive terminal/electrode 1814 (e.g., cathode). The positiveterminal/electrode 1814 may be constructed of various materials such asLithium metal oxide, Lithium cobalt oxide, Lithium manganese oxide,Lithium iron phosphate, Lithium nickel manganese cobalt (NMC), Lithiumnickel cobalt aluminum oxide (NCA), etc., among other possible candidatematerials. The Lithium ion battery 1830 also includes a negative currentcollector, such as made of copper, that is connected to a negativeterminal/electrode 1812 (e.g., anode). The negative terminal/electrode1812 may be constructed of various materials such as carbon, graphite,etc., among other possible candidate materials.

In addition, and electrolyte facilitates the transportation ofLithium-ion charge between the positive terminal/electrode 1814 in thenegative terminal/electrode 1812. The electrolyte may be implemented asa variety of materials such as a Lithium salt in an organic solvent, anon-aqueducts material, etc., among other possible candidate materials.Often times a separator or insulator is implemented within theelectrolyte. Such a separator or insulator may be constructed of variousmaterials such as micro perforated plastic, among other possiblecandidate materials. Generally speaking, the separator or insulatoroperates to keep the positive terminal/electrode 1814 in the negativeterminal/electrode 1812 separated while still facilitating thetransportation of lithium ions between the positive terminal/electrode1814 and the negative terminal/electrode 1812.

During the charging operation of the Lithium-ion battery 1830, Lithiumions are transported from the positive terminal/electrode 1814 to thenegative terminal/electrode 1812. During discharge (e.g., such as duringload servicing) of the Lithium-ion battery 1830, Lithium ions aretransported in the opposite direction from the negativeterminal/electrode 1812 to the positive terminal/electrode 1814.

Similar to the gas buildup situation that can occur within lead acidbatteries, similar gassing problems may unfortunately occur withinlithium ion batteries. For example, in some instances, Lithium-ionbatteries have the ability to burst into flames. Generally speaking, thesame problems of buildup of flammable or explosive gas that mayunfortunately occur within lead acid batteries may unfortunately occurwithin Lithium-ion batteries and generally batteries of many or mosttypes. Given the prevalence of Lithium-ion batteries in so manyapplications, even a very percentage of failure can be catastrophic incertain situations. For example, consider the number of products carriedby passengers on commercial aircraft that include one or more lithiumion batteries. Even a very small percentage of failure of such batteriesthat may lead to a potentially hazardous condition or unfortunately afailure such as flaming, bursting into flames, exploding can becatastrophic.

Some examples of the types of gases that may unfortunately build upwithin a lithium ion battery may include any one or more of hydrogen,carbon monoxide, carbon dioxide, olefins, alkanes, etc., among othertypes of gases. Such gases may unfortunately be formed during charging,especially during overcharging, by a fault in the battery, cell failure,separator breakdown, overheating, over-use, abuse conditions, etc.

Within Lithium-ion batteries, similar to lead acid batteries, gasbuildup within the battery casing can generate pressure on the batterycasing. For example, this can cause the surface of the battery to swell,bulge, deform, etc. Various aspects, embodiments, and/or examples of thedisclosure (and/or their equivalents) described herein provide variousmeans to facilitate improvement of the operation of the battery,monitoring of the battery, determining the health of the battery, etc.including avoiding one or more unsafe conditions that may unfortunatelyoccur with a battery such as flaming, bursting into flames, exploding,etc.

FIG. 19A is a schematic block diagram showing an embodiment 1901 of azero-time-constant model of an equivalent circuit of a battery inaccordance with the present invention. This diagram shows an equivalentcircuit representation of a battery that includes a voltage source, Voc,corresponding to the open circuit voltage of the battery when no load isconnected and a singular resistor, Rs, sometimes characterized ascorresponding to the resistance of the electrodes and the electrolyte ofthe battery, through which the current battery, Ibatt, flows to theterminal of the battery that provides an output voltage, Vbatt, whenconnected to one or more loads. With respect to this equivalent circuitrepresentation of the battery, the relationship between the variousparameters is as follows: Vbatt=Voc−Rs×Ibatt. In some examples, in thisdiagram and others herein, note that a terminal of the battery thatserves as the positive end of Vbatt may be viewed as V_1 such as withrespect to various other diagrams herein (e.g., V_1 corresponding to thevoltage at a point that is proximate to a terminal of the battery, suchas close to the terminal of the battery.

As can be seen with respect to this diagram, the internal impedance ofthe battery is shown solely as a singular resistor, Rs. There are manyother possible equivalent circuit representations of the batteryincluding those described below that provide representation of reactancecomponents of the impedance of the battery including characterizing thatimpedance using capacitive and/or inductive components showing variationof that impedance as a function of frequency. Such an equivalent circuitmodel of the battery in accordance with this diagram may be used forvarious battery types including lead acid and Lithium-ion.

FIG. 19B is a schematic block diagram showing an embodiment 1902 of aone-time-constant model of an equivalent circuit of a battery inaccordance with the present invention. This diagram shows an alternativeequivalent circuit representation of a battery that includes a voltagesource, Voc, corresponding to the open circuit voltage of the batterywhen no load is connected, an in-line resistor, Rs, sometimescharacterized as corresponding to the resistance of the electrodes andthe electrolyte of the battery, and also a RC network including aresistor, Rp, and a capacitor, Cp, implemented in parallel andcorresponding to the transient response of the battery charge/dischargeprofile, through which the current battery, Ibatt, flows to the terminalof the battery that provides an output voltage, Vbatt, when connected toone or more loads. The resistor, Rp, and the capacitor, Cp, may beviewed as corresponding to the charge transfer resistance that isencountered upon charge transfer from electrode to electrolyte (Rp) andthe double layer capacitance of the battery (Cp).

With respect to this equivalent circuit representation of the battery,the relationship between the various parameters is as follows:

Vbatt(t)=Voc−Ibatt×(Rs+Rp)+(Ibatt×Rp−Vp(t=0))exp((−t/(Rp×Cp)))

Note that at time, t=0, Vp(t=0)=Voc−Ibatt×(Rs)−Vbatt(t=0).

Note that some alternative equivalent circuit models operate by addingadditional RC elements in the chain of the top half of the equivalentcircuit model. In some modeling, the addition of a chain of RC elementsis used to represent the diffusion impedance of the battery, such aswith respect to a Lithium-ion battery.

Note that there are other equivalent circuit models that mayalternatively be used to represent the characteristics of a battery. Forexample, some alternative equivalent circuit models of a Lithium-ionbattery include more than two RC networks each including a respectiveresistor and a respective fastener, as well as one or more in-linecapacitors connecting between the final RC network in the chain and theterminal of the battery. For example, one possible alternativeequivalent circuit model is a dual polarization (DP) model as describedbelow.

FIG. 19C is a schematic block diagram showing an embodiment 1903 of adual polarization (DP) model of an equivalent circuit of a battery inaccordance with the present invention. This diagram shows yet anotheralternative equivalent circuit representation of a battery that includesa voltage source, Voc, corresponding to the open circuit voltage of thebattery when no load is connected, an in-line inductor used to modelinductive behavior of the battery at very high frequencies, Ls, anin-line resistor, Rs, sometimes characterized as corresponding to theresistance of the electrodes and the electrolyte of the battery, andalso multiple RC networks each including a respective resistor, Rp1 andRp2, and a respective capacitor, Cp1 and Cp2, each respectivelyimplemented in parallel and corresponding to the transient response ofthe battery charge/discharge profile as well as representing thediffusion impedance of the battery, through which the current battery,Ibatt, flows to the terminal of the battery that provides an outputvoltage, Vbatt, when connected to one or more loads.

FIG. 20A is a schematic block diagram showing an embodiment 2001 of abattery that is connected or coupled to a load in accordance with thepresent disclosure. Referring to embodiment 2001, a battery 2010 isconnected to a load 2020 via a wire. The voltage at a first point alongthe wire that is proximate to a first terminal of the battery is shownas V_1 (e.g., the positive terminal of battery). A second terminal ofthe battery (e.g., the negative terminal of the battery) is connected toelectrical ground, GND). The voltage at a second point along the wirethat is proximate to a terminal of the load 2020 is shown as V_2.

Because of the impedance (Z) of the wire that connects the battery 2010to the load 2020, as current (Isource) flows from the battery 2010 tothe load 2020, there is a slight voltage difference between V_1 and V_2.In certain examples, both voltages V_1 and V_2 are DC voltages. Thedifference between the two voltages, V_1 and V_2, is a product of thecurrent flowing through the wire and the impedance of the wire. Forexample, V_1−V_2=Isource×Zwire. In other examples, one or more ACsignals is applied to one or both of the first point and the secondpoint along the wire that are respectively proximate to the firstterminal of the battery 2010 and the terminal of the load 2020. Forexample, with respect to other embodiments herein, an AC signal isapplied to the first point along the wire that is proximate to the firstterminal of the battery 2010. In even other examples, an AC signal isapplied to the second point along the wire that is proximate to theterminal of the load 2020.

FIG. 20B is a schematic block diagram showing an embodiment 2002 of abattery that is connected or coupled to a load, and an associatedelectrical model of that configuration, in accordance with the presentdisclosure. This diagram is similar to the previous diagram but showsthe schematic representation of the components used to model atransmission line. For example, a resistive element, R, and an inductiveelement, L, are shown to be connected in series with one another betweenthe first terminal of the battery 2010 and the terminal of the load2020. In addition, a capacitive element, C, is shown as a shuntcapacitor connected from the wire to ground. In certain examples, aconductance, G, is also included as being connected from the wire toground. The characteristic impedance of the wire, Zwire, is as follows:

Zwire=sqrt (R+j ω L)/(G+j ω C)], where ω=2 π f, where f is frequency inHz

At lower frequencies including at DC, the inductive and capacitivecomponents contribute very little to the characteristic impedance of thewire, Zwire. As frequency increases, the characteristic impedance of thewire, Zwire, increases as the inductive and capacitive componentscontribute more significantly. On the lower right-hand portion of thediagram, a diagram showing the magnitude of the characteristic impedanceof the wire, Zwire (mag), as a function of frequency. At lowerfrequencies including DC, the characteristic impedance of the wire ispredominantly R. As frequency increases, the other components includingthe inductive and capacitive components can change the magnitude of thecharacteristic impedance of the wire, Zwire (mag), which may increase ordecrease as a function of increasing frequency.

FIG. 21A is a schematic block diagram showing an embodiment 2101 of abattery that is connected or coupled to a load and a DSC that isimplemented to detect voltage in conjunction with a high impedance (Z)reference load in accordance with the present disclosure. This diagramshows a DSC 28 that is connected or coupled to a point of the wire thatis proximate to a first terminal of the battery 2010. The voltage atthis point along the wire shown as V_1. A high impedance (Z) referenceload is shunted to ground from the point of the wire this proximate tothe first terminal of the battery 2010. By using a high impedance (Z)reference load, any effect to the system provided by the DSC 28 that isconfigured to determine the voltage at the point of the wire that isproximate to the first terminal of the battery 2010 is minimal. By usinga high impedance (Z) reference load, a very small amount of current,I_1, will flow from the point of the wire that is proximate to the firstterminal of the battery 2010.

Generally speaking, the high impedance (Z) may be real (e.g., purelyresistive) and/or reactive (e.g., also inductive and/or capacitive) innature. In addition, note that the high impedance (Z) reference load maybe of a very high impedance (e.g., 1 Mega-Ohms or more). Because the DSC28 is configured to detect such small voltages (e.g., including valueswithin milli-volts, micro-volts, nano-volts, pico-volts, and evensmaller values), a very high impedance (Z) reference load may be used.Because the DSC 28 is configured to detect voltages with such precision,different respective DSCs 28 may be configured to detect voltages atdifferent points along the wire connecting a first terminal of thebattery 2010 to a terminal of the load 2020 and to detect even verysmall differences between those voltages e.g., including values withinmilli-volts, micro-volts, nano-volts, pico-volts, and even smallervalues).

In an example of operation and implementation, the reference voltage ofthe DSC, Vref_1, is set to a first value. In certain examples, thereference voltage of the DSC, Vref_1, is initially set to an estimatedvoltage of the battery, such as an estimate of the voltage that is atthe point along the wire that is proximate to the first terminal of thebattery 2010, namely, V_1. For example, consider that the battery israted as a 12 V battery, then reference voltage of the DSC, Vref_1, isinitially set to 12 V. Alternatively, consider that the battery is ratedas a 3.5 V battery, then reference voltage of the DSC, Vref_1, isinitially set to 3.5 V.

Then, the reference voltage of the DSC 28, Vref_1, is tuned until itcompares favorably with the voltage, V_1, at the point along the wirethat is proximate to the first terminal of the battery 2010. When Vref_1and V_1 compare favorably, the voltage, V_1, at the point along the wirethat is proximate to the first terminal of the battery 2010 is known.For example, the DSC 28 will not output any current I_d1 (I_d1=0) whenVref_1=V_1, and the current Iref_1 will then be equal to I_1(Iref_1=I_1).

The reference voltage of the DSC 28, Vref_1, is known, and when the DSC28 is no longer outputting any current I_d1 (I_d1=0), then it is knownthat Vref_1=V_1. The DSC 28 is configured to determine the voltage, V_1,at the point along the wire that is proximate to the first terminal ofthe battery 2010.

Considering an example in which the voltage, V_1, at the point along thewire that is proximate to the first terminal of the battery 2010 is 12V, and considering a high impedance (Z) reference load of 1 mega-ohms,then based on the reference voltage of the DSC, Vref_1, being tuned sothat Vref_1=V_1, then DSC 28 does not output any current I_d1 (I_d1=0),and the current Iref_1 will then be equal to I_1 (Iref_1=I_1).V_1=I_1×Z, and I_1=V_1/Z. In this particular example, considering V_1=12V, and Z=1 mega-ohms, then I_1=Iref_1=0.000012 or 12 micro-amps (μA).Alternatively, consider an example that voltage, V_1, at the point alongthe wire that is proximate to the first terminal of the battery 2010 is4 V, then based on reference voltage of the DSC, Vref_1, being tuned sothat Vref_1=V_1, considering V_1=4 V, and Z=1 mega-ohms, thenI_1=Iref_1=0.000004 or 4 micro-amps (μA).

This implementation and others described herein facilitates themeasuring of a voltage at any desired point along the wire connectingthe battery to the load. In some examples, the point along the wire isproximate to the first terminal of the battery 2010. In other examples,the point along the wire is proximate to the terminal of the load 2020.Generally speaking, the point along the wire may be anywhere along thewire. In addition, other embodiments, examples, etc. operate to includetwo or more such circuits to facilitate the determination of two or morevoltages at two or more points along the wire. Because of the highresolution and extremely small signals that may be detected using a DSCas described herein, a determination of the difference of these voltagesat different points along the wire may be made based on the inherentimpedance (Z) of the wire including to determine even very smalldifferences of voltages at different respective points along the wire.

FIGS. 21B and 21C are schematic block diagram showing other embodiments2102 and 2103 of a battery that is connected or coupled to a load and aDSC that is implemented to detect voltage in conjunction with a highimpedance (Z) reference load in accordance with the present disclosure.

Referring to embodiment 2102, this diagram has some similarities to theprevious diagram and shows an implementation of a DSC in more detail.The DSC includes a comparator or operational amplifier that receives areference voltage, Vref_1, at one of its input terminals, and that hasthe other of one of its input terminals connected to the line thatconnects to the point along the wire that is proximate to the firstterminal of the battery 2010. The output of the comparator oroperational amplifier provides the control signal to a dependent currentsource that is configured to supply a current I_d1 that combines withthe current that is provided from the point along the wire that isproximate to the first terminal of the battery, I_1, to generate thereference current, Iref_1, that flows through the high impedance (Z)reference load. Note that the dependent current source is configured tosource and/or sink current as may be needed to ensure the voltage at theelectrical node tracks, follows, matches, etc. the reference voltage,Vref_1. The comparator or operational amplifier is connected to a powersupply voltage (e.g., Vdd and Vss, such as Vdd being the positive supplyvoltage, and Vss being the ground voltage or 0 V).

In an example of operation and implementation, the reference voltage ofthe DSC, Vref_1, is set to a first value. In certain examples, thereference voltage of the DSC, Vref_1, is initially set to an estimatedvoltage of the battery, such as an estimate of the voltage that is atthe point along the wire that is proximate to the first terminal of thebattery 2010, namely, V_1. Then, the reference voltage of the DSC,Vref_1, is tuned until it compares favorably with the voltage, V_1, atthe point along the wire that is proximate to the first terminal of thebattery 2010. When Vref_1 and V_1 compare favorably, the voltage at thevoltage, V_1, at the point along the wire that is proximate to the firstterminal of the battery 2010 is known. For example, the DSC will notoutput any current I_d1 (I_d1=0) when Vref_1=V_1, and the current Iref_1will then be equal to I_1 (Iref_1=I_1). The determination that Vref_1and V_1 compares favorably may be made based on the output of thecomparator or operational amplifier being zero, the dependent currentsource no longer supplying the current I_d1, etc. When Vref_1 and V_1compare favorably, the voltage, V_1, at the point along the wire that isproximate to the first terminal of the battery 2010 is known. Forexample, the DSC will not output any current I_d1 (I_d1=0) whenVref_1=V_1, and the current Iref_1 will then be equal to I_1(Iref_1=I_1).

Referring to embodiment 2103, this diagram is similar to the previousdiagram and also includes an analog to digital converter (ADC) 1660 thatis configured to process the output signal of the comparator oroperational amplifier to generate a digital signal. The output signal ofthe comparator or operational amplifier is representative of anydifference between the reference voltage, Vref_1, and the voltage, V_1,at the point along the wire that is proximate to the first terminal ofthe battery 2010.

In addition, in certain examples, a feedback circuit 2030 is configuredto process the output signal of the comparator or operational amplifierto generate the control signaling for the dependent current source. Incertain examples, the feedback circuit 2030 is configured to scale(e.g., amplify or divide) the output signal of the comparator oroperational amplifier to provide a scaled version of the output signalof the comparator or operational amplifier as the control signaling forthe dependent current source. Generally speaking, the feedback circuit2030 is configured to perform any desired processing to the outputsignal of the comparator or operational amplifier to generate aprocessed version of the output signal of the comparator or operationalamplifier as the control signaling for the dependent current source.

In addition, this diagram includes one or more processing modules 42.The one or more processing modules 42 includes memory and/or is coupledto memory that stores operational instructions. The one or moreprocessing modules 42 is configured to execute the operationalinstructions to facilitate operation of the DSC. In some examples, theone or more processing modules 42 is configured to provide the referencevoltage, Vref_1, that is provided to one of the input terminals of thecomparator or operational amplifier. In addition, the one or moreprocessing modules 42 is configured to direct the operation of thefeedback circuit 2030, when such a feedback circuit 2030 is implemented.A feedback circuit control signal (fb ckt ctrl) is provided to thefeedback circuit 2030 to direct the manner in which feedback circuit2030 is to process the output signal the comparator or operationalamplifier generate the control signaling for the dependent currentsource. In addition, any other control may be provided from the one ormore processing modules 42 to facilitate operation of the DSC todetermine the voltage, V_1, at the point along the wire that isproximate to the first terminal of the battery 2010.

FIGS. 21D, 21E, 21F, and 21G are schematic block diagrams showingvarious embodiments 2104, 2105, 2106, and 2107 of feedback circuits thatmay be implemented within a DSC in accordance with the presentdisclosure.

Referring to embodiment 2104, this diagram shows an amplifier that isconfigured to process an input signal, Vin, to generate an outputsignal, Vout. For example, consider the input signal, Vin, to be theoutput signal of the comparator or operational amplifier of a DSC andthe output signal, Vout, to be the control signaling for the dependentcurrent source of the DSC. Note that the amplifier may be implemented ina variety of different ways, such as a variable gain amplifier (VGA), aprogrammable gain amplifier (PGA), etc. Note that the gain controlsignaling of the amplifier may be provided via digital or analogsignaling depending on the particular implementation. Generallyspeaking, the output signal, Vout, is a function of the input signal,Vin, such as Vout=f(Vin). Consider the scaling factor of the amplifierto be k, then Vout=k×Vin.

Referring to embodiment 2105, this diagram shows a voltage divider thatincludes two resistors, R1 and R2. In certain examples, at least one ofthe resistors is variable/adjustable. The voltage at the node connectingthe two resistors, R1 and R2, is Vout and is a function of the tworesistors, R1 and R2, and the input voltage, Vin.

Vout=Vin×(R2/(R1+R2).

For example, consider the input signal, Vin, to be the output signal ofthe comparator or operational amplifier of a DSC and the output signal,Vout, to be the control signaling for the dependent current source ofthe DSC. This diagram shows one possible implementation by which theoutput signal of the comparator or operational amplifier of a DSC may bescaled to provide a scaled version of the output signal of thecomparator or operational amplifier as the control signaling for thedependent current source of the DSC. For example, consider the inputsignal, Vin (analog), to be the output signal of the comparator oroperational amplifier of a DSC and the output signal, Vout (analog), tobe the control signaling for the dependent current source of the DSC.

Referring to embodiment 2106, this diagram shows an analog to digitalconverter (ADC) 1660 that is configured to process an input signal, Vin,to generate a digital signal representative of the input signal, Vin.One or more processing modules 42, which include memory and/or arecoupled to memory that stores operational instructions, is configured toperform any desired digital signal processing on the digital signalrepresentative of the input signal, Vin, to generate a digital versionof an output signal, Vout. A digital to analog converter (DAC) 1662 thatis configured to process the digital signal representative of an outputsignal, Vout, to generate the output signal, Vout, in analog form. Notethat the digital signal processing is performed by the one or moreprocessing modules may include any type of digital signal processing,which may include gain adjust, scaling, filtering, etc.

Referring to embodiment 2107, this diagram is similar to the previousdiagram with at least one difference being that digital version of anoutput signal, Vout, is provided for digital control. For example,consider a dependent current source within the DSC that is operativebased on a digital control signal, then a digital version of an outputsignal, Vout, may be used to provide the control signaling for thatdependent current source within the DSC. For example, consider the inputsignal, Vin (analog), to be the output signal of the comparator oroperational amplifier of a DSC and the output signal, Vout (digital), tobe the control signaling for the dependent current source of the DSC.

FIG. 21H is a schematic block diagram of an embodiment of a method 2108for execution by one or more devices in accordance with the presentdisclosure.

The method 2108 operates in step 2180 by setting a first DSC referencevoltage, Vref_1, to a first value to produce a first reference current,Iref_1. For example, the first value of the DSC reference voltage,Vref_1, may be set to an estimated voltage of a battery (e.g., anestimate of V_1). The voltage, V_1, is at a point that is proximate to aterminal of the battery along a wire connecting the terminal of thebattery to a terminal of a load.

The method 2108 also operates in step 2182 by tuning the DSC referencevoltage, Vref_1, to compare favorably with the voltage, V_1, at thepoint along the wire that is proximate to the terminal of the battery.The method 2108 also operates in step 2184 by determining whether theDSC reference voltage, Vref_1, to compare favorably with the voltage,V_1, based on the tuning. For example, this may be determined based onthe operational amplifier or comparator output being zero, the dependentcurrent source of a DSC not needing to provide any current, I_d1, orsome other basis, etc.

Based on the DSC reference voltage, Vref_1, comparing favorably with thevoltage, V_1, based on the tuning, as determined in step 2186, themethod 2108 branches to step 2188 operates by determining with thevoltage, V_1. This is determined based on the tuned value of the DSCreference voltage, Vref_1. Referring back to certain of the previousdiagrams, this corresponds to the situation that the output of thecomparator or operational amplifier is zero, DSC reference voltage,Vref_1, is equal to V_1 (Vref_1=V_1), the dependent current source of aDSC no longer provides any current, I_d1, such that I_d1=0 andIref_1=I_1. The value of the DSC reference voltage, Vref_1, is known,and therefore V_1 is also known based on Vref_1=V_1.

Alternatively, based on the DSC reference voltage, Vref_1, comparingunfavorably with the voltage, V_1, as determined in step 2186, themethod 2108 branches back to step 2182 and continues to perform tuningof the DSC reference voltage, Vref_1. The tuning continues until the DSCreference voltage, Vref_1, compares favorably with the voltage, V_1,which facilitates the determination of voltage, V_1.

FIG. 22A is a schematic block diagram showing an embodiment 2201 of abattery that is connected or coupled to a load and a DSC that isimplemented to detect voltage without a high impedance (Z) referenceload in accordance with the present disclosure. This diagram has somesimilarities to FIG. 21A yet does not include a high impedance (Z)reference load. In this diagram, the path to ground is within the DSC28. The DSC reference voltage, Vref_1, is tuned until the output of theDSC is zero, based on Vref_1=V_1, so that the voltage, V_1, at the pointalong the wire that is proximate to the terminal of the battery 2010 isdetermined. In this diagram, the DSC 28 itself serves as a highimpedance component connecting or coupling to ground. The DSC 28minimally affects the circuit that includes the battery 2010 that isconnected to the load 2020 via the wire.

FIGS. 22B and 22C are schematic block diagrams showing other embodiments2202 and 2203 of a battery that is connected or coupled to a load and aDSC that is implemented to detect voltage without a high impedance (Z)reference load in accordance with the present disclosure.

Referring to embodiment 2202, this diagram has similarities to many ofthe previous diagrams including a battery 2010 that is connected to aload 2020 and the wire. The DSC is coupled or connected to a point alongthe wire that is proximate to a terminal of the battery and isconfigured to determine the voltage, V_1, at that point. The DSCincludes a comparator or operational amplifier that receives DSCreference voltage, Vref_1, at one of its inputs and has its other inputconnected to the output of a dependent current source and also to thatpoint along the wire that is proximate to the terminal of the battery.The output of the comparator or operational amplifier is provided via afeedback circuit 2030 that is configured to generate the controlsignaling for the dependent current source. The dependent current sourceis configured to source and/or sink current as may be needed to ensurethe voltage, V_1, at the electrical node tracks, follows, matches, etc.the DSC reference voltage, Vref_1. The comparator or operationalamplifier is connected to a power supply voltage (e.g., Vdd and Vss,such as Vdd being the positive supply voltage, and Vss being the groundvoltage or 0 V).

The feedback circuit 2030 is configured to perform any desiredprocessing on the output of the comparator or operational amplifier togenerate the control signaling for the dependent current source. In anexample of operation and implementation, the feedback circuit 2030 isconfigured to scale the output signal of the comparator or operationalamplifier. The gain adjustment of the feedback circuit 2030 isconfigured to affect the slope of the linear region of operation of thecomparator or operational amplifier between the rails of the powersupply. For example, consider the rails of the power supply voltage tobe Vdd and Vss, then the output of the comparator or operationalamplifier will be linear when the DSC reference voltage, Vref_1, iswithin that range between Vdd and Vss. Particularly, when the DSCreference voltage, Vref_1, it at the midpoint between these rails of thepower supply voltage, at the midpoint of the linear region of operationof the comparator or operational amplifier, then the DSC referencevoltage, Vref_1, is equal to the voltage, V_1.

Referring to embodiment 2203, this diagram is similar to the previousdiagram and also includes an analog to digital converter (ADC) 1660 thatis configured to process the output signal of the comparator oroperational amplifier to generate a digital signal. that isrepresentative of any difference between the reference voltage, Vref_1,and the voltage, V_1, at the point along the wire that is proximate tothe first terminal of the battery 2010.

In addition, in certain examples, a feedback circuit 2030 is configuredto process the output signal of the comparator or operational amplifierto generate the control signaling for the dependent current source. Incertain examples, the feedback circuit 2030 is configured to scale(e.g., amplified or divide) the output signal of the comparator oroperational amplifier to provide a scaled version of the output signalof the comparator or operational amplifier as the control signaling forthe dependent current source. Generally speaking, the feedback circuit2030 is configured to perform any desired processing to the outputsignal of the comparator or operational amplifier to generate a processto version of the output signal of the comparator or operationalamplifier as the control signaling for the dependent current source.

In addition, this diagram includes one or more processing modules 42.The one or more processing modules 42 includes memory and/or is coupledto memory that stores operational instructions. The one or moreprocessing modules 42 is configured to execute the operationalinstructions to facilitate operation of the DSC. In some examples, theone or more processing modules 42 is configured to provide the referencevoltage, Vref_1, that is provided to one of the input terminals of thecomparator or operational amplifier. In addition, the one or moreprocessing modules 42 is configured to direct the operation of thefeedback circuit 2030, when such a feedback circuit 2030 is implemented.A feedback circuit control signal (fb ckt ctrl) is provided to thefeedback circuit 2030 to direct the manner in which feedback circuit2030 is to process the output signal the comparator or operationalamplifier generate the control signaling for the dependent currentsource. In addition, any other control may be provided from the one ormore processing modules 42 to facilitate operation of the DSC todetermine the voltage, V_1, at the point along the wire that isproximate to the first terminal of the battery 2010.

FIG. 22D is a schematic block diagram of an embodiment of a method 2204for execution by one or more devices in accordance with the presentdisclosure. The method 2204 operates in step 2280 by setting a DSCreference voltage, Vref_1, to a first value. For example, DSC referencevoltage, Vref_1, is set to an estimated voltage of the terminal of thebattery. the voltage, V_1, is the voltage at a point along the wire thatis proximate to the first terminal of the battery.

The method 2204 also operates in step 2282 by tuning the DSC referencevoltage, Vref_1, to compare favorably with the voltage, V_1, that is thevoltage at the point along the wire that is proximate to the firstterminal of the battery.

The method 2204 also operates in step 2284 by determining whether theDSC reference voltage, Vref_1, compares favorably with the voltage, V_1.Favorable comparison of the DSC reference voltage, Vref_1, and thevoltage, V_1, is based on the DSC reference voltage, Vref_1, being atthe halfway point between the rails of the voltage power supply. Forexample, this may be viewed as a halfway point between Vdd and Vss, orbetween Vdd and ground (GND).

Based on the DSC reference voltage, Vref_1, comparing favorably with thevoltage, V_1, based on the tuning, as determined in step 2286, themethod 2204 branches to step 2288 operates by determining with thevoltage, V_1. This is determined based on the tunes value of the DSCreference voltage, Vref_1. Referring back to certain of the previousdiagrams, this corresponds to the situation that the output of thecomparator or operational amplifier is zero, DSC reference voltage,Vref_1, is equal to V_1 (Vref_1=V_1), the dependent current source of aDSC no longer provides any current, I_d1, such that I_d1=0 andIref_1=I_1. The value of the DSC reference voltage, Vref_1, is known,and therefore V_1 is also known based on Vref_1=V_1.

Alternatively, based on the DSC reference voltage, Vref_1, comparingunfavorably with the voltage, V_1, as determined in step 2286, themethod 2204 branches back to step 2282 and continues to perform tuningof the DSC reference voltage, Vref_1. The tuning continues until the DSCreference voltage, Vref_1, compares favorably with the voltage, V_1,which facilitates the determination of voltage, V_1.

FIG. 23A is a schematic block diagram showing an embodiment 2301 of abattery that is connected or coupled to a load and multiple DSCs thatare implemented to detect voltages in conjunction with high impedance(Z) reference loads in accordance with the present disclosure. Thisdiagram also includes a battery 2010 that is coupled or connected to aload 2020 via a wire. In this diagram, the first DSC 28 is configured todetermine a voltage, V_1, at a first point along the wire that isproximate to a first terminal of the battery 2010, and a second DSC 28is configured to determine a voltage, V_2, of a second point along thewire that is proximate to a terminal of the load 2020. In addition, arespective high impedance (Z) reference load is connected from the firstpoint along the wire and the second point along the wire to ground.

Each of the DSCs operates as described above with respect to FIG. 21A todetermine the voltage, V_1, at the first point along the wire that isproximate to a first terminal of the battery 2010 and the voltage, V_2,of the second point along the wire that is proximate to a terminal ofthe load 2020.

In an example of operation and implementation, the reference voltage ofthe first DSC, Vref_1, is set to a first value. Then, the referencevoltage of the first DSC 28, Vref_1, is tuned until it comparesfavorably with the voltage, V_1, at the point along the wire that isproximate to the first terminal of the battery 2010. When Vref_1 and V_1compare favorably, the voltage, V_1, at the point along the wire that isproximate to the first terminal of the battery 2010 is known. Forexample, the first DSC 28 will not output any current I_d1 (I_d1=0) whenVref_1=V_1, and the current Iref_1 will then be equal to I_1(Iref_1=I_1).

The reference voltage of the first DSC 28, Vref_1, is known, and whenthe first DSC 28 is no longer outputting any current I_d1 (I_d1=0), thenit is known that Vref_1=V_1. The DSC 28 is configured to determine thevoltage, V_1, at the point along the wire that is proximate to the firstterminal of the battery 2010.

In an example of operation and implementation, the reference voltage ofthe second DSC, Vref_2, is set to a first value. Then, the referencevoltage of the second DSC 28, Vref_2, is tuned until it comparesfavorably with the voltage, V_2, at the point along the wire that isproximate to the terminal of the load 2020. When Vref_2 and V_2 comparefavorably, the voltage, V_2, at the point along the wire that isproximate to the terminal of the load 2020 is known. For example, thesecond DSC 28 will not output any current I_d2 (I_d2=0) when Vref_2=V_2,and the current Iref_2 will then be equal to I_2 (Iref_2=I_2).

The reference voltage of the second DSC 28, Vref_2, is known, and whenthe second DSC 28 is no longer outputting any current I_d2 (I_d2=0),then it is known that Vref_2=V_2. The DSC 28 is configured to determinethe voltage, V_2, at the point along the wire that is proximate to theterminal of the load 2020.

In another example of operation and implementation, the referencevoltage of the first DSC 28, Vref_1, is provided as an AC signal and isvaried across a desired frequency range. Similarly, reference voltage ofthe second DSC 28, Vref_2, is provided as an AC signal and is variedacross a desired frequency range. This will provide AC voltage signalsat each of the first point, V_1, along the wire that is proximate to theterminal of the battery 2010 and also at the second point, V_2, alongthe wire that is proximate to the terminal of the load 2020. Byoperating the AC domain, and by sweeping across a range of frequencies,the impedance (Z) of the wire may be determined as a function offrequency. When such an impedance (Z) profile of the wire is determinedas a function of frequency, identification of a flat portion of theimpedance (Z) profile at lower frequencies can be used to determine theresistive portion of the wire. For example, at DC and lower frequencies,the wire will exhibit characteristics that are primarily resistive. Asfrequency increases, the wire may exhibit characteristics that are alsoinductive and capacitive. By providing a range of AC signals at thefirst point, V_1, along the wire that is proximate to the terminal ofthe battery 2010 and measuring those AC signals at the second point, theDC resistance of the wire can be determined by a desired slope (e.g.,substantially flat, less than threshold slope between two or morepoints, etc.) of the measured frequency response values of the range ofAC signals. and also at the second point, V_2, along the wire that isproximate to the terminal of the load 2020, and by sweeping across adesired frequency range, the DC resistance of the wire can bedetermined.

For example, based on providing the reference voltages of the first DSC28, Vref_1, and the second DSC 28, Vref_2, as AC signals, and monitoringthe response of them as a function of frequency, and by identifying theflat portion of the impedance (Z) profile at lower frequency, theresistance, R, the wire may be determined. Note that the AC signalingthat is provided the first point, V_1, along the wire that is proximateto the terminal of the battery 2010 and also at the second point, V_2,along the wire that is proximate to the terminal of the load 2020 may beprovided via capacitive coupling by appropriately placed capacitors thatcouple were connect the DSCs to the first and second points along thewire. As may be desired, capacitive switches may be implemented suchthat the coupling or connection between the DSCs and the first andsecond points along the wire may be made via a direct connection or viacapacitive coupling through respective capacitors.

FIGS. 23B, 23C, and 23D are schematic block diagrams showing otherembodiments 2302, 2303, and 2304 of a battery that is connected orcoupled to a load and multiple DSCs that are implemented to detectvoltages in conjunction with high impedance (Z) reference loads inaccordance with the present disclosure.

Referring to embodiment 2302, this diagram has some similarities to theprevious diagram and shows an implementation of a first DSC and a secondDSC in more detail. Each DSC includes a comparator or operationalamplifier that receives a reference voltage, Vref_1 or Vref_2, at one ofits input terminals, and that has the other of one of its inputterminals connected to the line that connects to the first point alongthe wire that is proximate to the first terminal of the battery 2010 orthe second point along the wire that is proximate to the terminal of theload 2020, respectively.

Considering the DSC on the left-hand side of the diagram, the output ofthe comparator or operational amplifier provides the control signal to adependent current source that is configured to supply a current I_d1that combines with the current that is provided from the point along thewire that is proximate to the first terminal of the battery, I_1, togenerate the reference current, Iref_1, that flows through thatrespective high impedance (Z) reference load. Note that the dependentcurrent source is configured to source and/or sink current as may beneeded to ensure the voltage at the electrical node tracks, follows,matches, etc. the reference voltage, Vref_1. The comparator oroperational amplifier is connected to a power supply voltage (e.g., Vddand Vss, such as Vdd being the positive supply voltage, and Vss beingthe ground voltage or 0 V).

Considering the DSC on the right-hand side of the diagram, the output ofthe comparator or operational amplifier provides the control signal to adependent current source that is configured to supply a current I_d2that combines with the current that is provided from the point along thewire that is proximate to the terminal of the load, I_2, to generate thereference current, Iref_2, that flows through that respective highimpedance (Z) reference load. Note that the dependent current source isconfigured to source and/or sink current as may be needed to ensure thevoltage at the electrical node tracks, follows, matches, etc. thereference voltage, Vref_2. Similarly, the comparator or operationalamplifier is connected to a power supply voltage (e.g., Vdd and Vss,such as Vdd being the positive supply voltage, and Vss being the groundvoltage or 0 V).

In an example of operation and implementation, the reference voltage ofthe first DSC, Vref_1, is set to a first value. In certain examples, thereference voltage of the first DSC, Vref_1, is initially set to anestimated voltage of the battery, such as an estimate of the voltagethat is at the point along the wire that is proximate to the firstterminal of the battery 2010, namely, V_1. Then, the reference voltageof the first DSC, Vref_1, is tuned until it compares favorably with thevoltage, V_1, at the point along the wire that is proximate to the firstterminal of the battery 2010. When Vref_1 and V_1 compare favorably, thevoltage at the voltage, V_1, at the point along the wire that isproximate to the first terminal of the battery 2010 is known. Forexample, the first DSC will not output any current I_d1 (I_d1=0) whenVref_1=V_1, and the current Iref_1 will then be equal to I_1(Iref_1=I_1). The determination that Vref_1 and V_1 compares favorablymay be made based on the output of the comparator or operationalamplifier being zero, the dependent current source no longer supplyingthe current I_d1, etc. When Vref_1 and V_1 compare favorably, thevoltage, V_1, at the point along the wire that is proximate to the firstterminal of the battery 2010 is known. For example, the first DSC willnot output any current I_d1 (I_d1=0) when Vref_1=V_1, and the currentIref_1 will then be equal to I_1 (Iref_1=I_1).

In an example of operation and implementation, the reference voltage ofthe second DSC, Vref_2, is set to a first value. In certain examples,the reference voltage of the second DSC, Vref_2, is initially set to anestimated voltage of the load 2020, such as an estimate of the voltagethat is at the point along the wire that is proximate to the terminal ofthe load 2020, namely, V_2. Then, the reference voltage of the secondDSC, Vref_2, is tuned until it compares favorably with the voltage, V_2,at the point along the wire that is proximate to the terminal of theload 2020. When Vref_2 and V_2 compare favorably, the voltage at thevoltage, V_2, at the point along the wire that is proximate to theterminal of the load 2020 is known. For example, the second DSC will notoutput any current I_d2 (I_d2=0) when Vref_2=V_2, and the current Iref_2will then be equal to I_2 (Iref_2=I_2). The determination that Vref_2and V_2 compares favorably may be made based on the output of thecomparator or operational amplifier being zero, the dependent currentsource no longer supplying the current I_d2, etc. When Vref_2 and V_2compare favorably, the voltage, V_2, at the point along the wire that isproximate to the terminal of the load 2020 is known. For example, thesecond DSC will not output any current I_d2 (I_d2=0) when Vref_2=V_2,and the current Iref_2 will then be equal to I_2 (Iref_2=I_2).

Referring to embodiment 2303, this diagram is similar to the previousdiagram but also includes feedback circuits 2030 implemented within eachof the first DSC on the left-hand side of the diagram and the second DSCon the right-hand side of the diagram. The feedback circuit 2030 isimplemented to perform any desired processing on the respective outputsignal from the perspective comparator or operational amplifier togenerate the control signaling for the respective dependent currentsource within each DSC.

Referring to embodiment 2304, this diagram is similar to the previousdiagram but also includes capacitive switches that couple or connect tothe respective DSCs that couple or connect to the first point along thewire that is proximate to the first terminal of the battery 2010 and thesecond point along the wire that is proximate to the terminal of theload 2020, respectively. For example, a capacitive switch may beconfigured to provide a direct connection through the capacitive switchfor may be configured to provide a connection via a capacitor tofacilitate AC coupling and DC blocking. For example, at DC, a capacitorwill operate as an open circuit. However, AC signals will couple throughthe capacitor.

This diagram also includes a respective analog to digital converter(ADC) 1660 within each of the DSCs that is configured to process theoutput signal of the comparator or operational amplifier to generate adigital signal. The output signal of the comparator or operationalamplifier is representative of any difference between the referencevoltage, Vref_1, and the voltage, V_1, at the point along the wire thatis proximate to the first terminal of the battery 2010.

In addition, in certain examples, within each of the DSCs, a feedbackcircuit 2030 is configured to process the output signal of thecomparator or operational amplifier to generate the control signalingfor the dependent current source. In certain examples, the feedbackcircuit 2030 is configured to scale (e.g., amplify or divide) the outputsignal of the comparator or operational amplifier to provide a scaledversion of the output signal of the comparator or operational amplifieras the control signaling for the dependent current source. Generallyspeaking, the feedback circuit 2030 is configured to perform any desiredprocessing to the output signal of the comparator or operationalamplifier to generate a processed version of the output signal of thecomparator or operational amplifier as the control signaling for thedependent current source.

In addition, this diagram includes one or more processing modules 42.The one or more processing modules 42 includes memory and/or is coupledto memory that stores operational instructions. The one or moreprocessing modules 42 is configured to execute the operationalinstructions to facilitate operation of the DSC. In some examples, theone or more processing modules 42 is configured to provide the referencevoltages, Vref_1 and Vref_2, that are respectively provided to one ofthe input terminals of the comparator or operational amplifier in eachDSC. In addition, the one or more processing modules 42 is configured todirect the operation of the feedback circuits 2030, when such feedbackcircuits 2030 are implemented. Respective feedback circuit controlsignals (fb ckt ctrls) are provided to the feedback circuits 2030 todirect the manner in which feedback circuits 2030 is to process theoutput signal the comparator or operational amplifier within the DSCsgenerate the respective control signaling for the dependent currentsources within the DSCs. In addition, the one or more processing modules42 is configured to direct the operation of the capacitive switches.Respective capacitive switch control signals (C sw ctrls) are providedto the capacitive switches to direct their manner of connectivity,whether a straight connection or via capacitive coupling to the pointsalong the wire that couples or connects the battery 2010 to the load2020. In addition, any other control may be provided from one or moreprocessing modules 42 to facilitate operation of the first DSC todetermine the voltage, V_1, at the point along the wire that isproximate to the first terminal of the battery 2010 and also tofacilitate operation of the second DSC to determine the voltage, V_2, atthe point along the wire that is proximate to the terminal of the load2020.

Note that such capacitive switches may also be implemented within anyother embodiment, diagram, etc. herein to facilitate either directconnection or via capacitive coupling to a point along the wire thatcouples or connects the battery 2010 to the load 2020.

FIG. 23E is a schematic block diagram showing an embodiment 2305 of abattery that is connected or coupled to a load and a DSC that isimplemented to detect voltage without a high impedance (Z) referenceload in accordance with the present disclosure.

This diagram also includes a battery 2010 that is coupled or connectedto a load 2020 via a wire. In this diagram, a first DSC 28 is configuredto determine a voltage, V_1, at a first point along the wire that isproximate to a first terminal of the battery 2010, and a second DSC 28is configured to determine a voltage, V_2, of a second point along thewire that is proximate to a terminal of the load 2020.

Each of the DSCs operates as described above with respect to FIG. 22A todetermine the voltage, V_1, at the first point along the wire that isproximate to a first terminal of the battery 2010 and the voltage, V_2,of the second point along the wire that is proximate to a terminal ofthe load 2020. Note that neither of the DSCs includes a high impedance(Z) reference load.

In this diagram, the path to ground is within the first DSC 28 and thesecond DSC 28. The first DSC reference voltage, Vref_1, is tuned untilthe output of the first DSC is zero, based on Vref_1=V_1, so that thevoltage, V_1, at the point along the wire that is proximate to theterminal of the battery 2010 is determined. Similarly, the second DSCreference voltage, Vref_2, is tuned until the output of the second DSCis zero, based on Vref_2=V_2, so that the voltage, V21, at the pointalong the wire that is proximate to the terminal of the load 2020 isdetermined.

In this diagram, the first DSC 28 and the second DSC 28 themselves serveas the high impedance components connecting or coupling to ground. Thefirst DSC 28 and the second DSC 28 minimally affect the circuit thatincludes the battery 2010 that is connected to the load 2020 via thewire.

FIGS. 23F and 23G are schematic block diagrams showing other embodiments2306 and 2307 of a battery that is connected or coupled to a load andmultiple DSCs that are implemented to detect voltages without highimpedance (Z) reference loads in accordance with the present disclosure.

Referring to embodiment 2306, this diagram has similarities to many ofthe previous diagrams including a battery 2010 that is connected to aload 2020 and the wire. Two respective DSCs are coupled or connected topoint along the wire. A first point is proximate to a terminal of thebattery and is configured to determine the voltage, V_1, at that point.A second point is proximate to a terminal of the load and is configuredto determine the voltage, V_2, at that point. Each DSC includes acomparator or operational amplifier that receives DSC reference voltage,Vref_1 or Vref_2, at one of its inputs and has its other input connectedto the output of a dependent current source and also to a respectivepoint along the wire (e.g., proximate to the terminal of the battery orproximate to the terminal of the load). The output of the respectivecomparator or operational amplifier is provided via a respectivefeedback circuit 2030 that is configured to generate the controlsignaling for the respective dependent current source. The respectivedependent current source is configured to source and/or sink current asmay be needed to ensure the voltage, V_1 or Vref_2, at the electricalnode tracks, follows, matches, etc. the first DSC reference voltage,Vref_1, or the second DSC reference voltage, Vref_2. The comparator oroperational amplifiers are connected to a power supply voltage (e.g.,Vdd and Vss, such as Vdd being the positive supply voltage, and Vssbeing the ground voltage or 0 V).

As with respect to other embodiments, the respective feedback circuits2030 are configured to perform any desired processing on the outputs ofthe respective comparators or operational amplifiers to generate thecontrol signaling for the respective dependent current sources. In anexample of operation and implementation, the feedback circuit 2030 isconfigured to scale the output signal of the comparator or operationalamplifier. The gain adjustment of the feedback circuit 2030 isconfigured to affect the slope of the linear region of operation of thecomparator or operational amplifier between the rails of the powersupply. For example, consider the rails of the power supply voltage tobe Vdd and Vss, then the output of the comparator or operationalamplifier will be linear when the DSC reference voltage, Vref_1, iswithin that range between Vdd and Vss. Particularly, when the first DSCreference voltage, Vref_1, it at the midpoint between these rails of thepower supply voltage, at the midpoint of the linear region of operationof the comparator or operational amplifier, then the first DSC referencevoltage, Vref_1, is equal to the voltage, V_1. Similarly, when thesecond DSC reference voltage, Vref_2, it at the midpoint between theserails of the power supply voltage, at the midpoint of the linear regionof operation of the comparator or operational amplifier, then the secondDSC reference voltage, Vref_2, is equal to the voltage, V_2.

In an example of operation and implementation, the first DSC is coupledor connected to a first point along the wire that is proximate to aterminal of the battery and is configured to determine the voltage, V_1,at that point. The first DSC includes a comparator or operationalamplifier that receives the first DSC reference voltage, Vref_1, at oneof its inputs and has its other input connected to the output of adependent current source and also to that point along the wire that isproximate to the terminal of the battery. The output of the comparatoror operational amplifier is provided via a feedback circuit 2030 that isconfigured to generate the control signaling for the dependent currentsource. The dependent current source is configured to source and/or sinkcurrent as may be needed to ensure the voltage, V_1, at the electricalnode tracks, follows, matches, etc. the DSC reference voltage, Vref_1.The comparator or operational amplifier is connected to a power supplyvoltage (e.g., Vdd and Vss, such as Vdd being the positive supplyvoltage, and Vss being the ground voltage or 0 V).

The feedback circuit 2030 is configured to perform any desiredprocessing on the output of the comparator or operational amplifier togenerate the control signaling for the dependent current source. In anexample of operation and implementation, the feedback circuit 2030within the first DSC is configured to scale the output signal of thecomparator or operational amplifier. The gain adjustment of the feedbackcircuit 2030 within the first DSC is configured to affect the slope ofthe linear region of operation of the comparator or operationalamplifier between the rails of the power supply. For example, considerthe rails of the power supply voltage to be Vdd and Vss, then the outputof the comparator or operational amplifier will be linear when the firstDSC reference voltage, Vref_1, is within that range between Vdd and Vss.Particularly, when the first DSC reference voltage, Vref_1, it at themidpoint between these rails of the power supply voltage, at themidpoint of the linear region of operation of the comparator oroperational amplifier, then the first DSC reference voltage, Vref_1, isequal to the voltage, V_1.

In an example of operation and implementation, the second DSC is coupledor connected to a second point along the wire that is proximate to aterminal of the load and is configured to determine the voltage, V_2, atthat point. The second DSC includes a comparator or operationalamplifier that receives the second DSC reference voltage, Vref_2, at oneof its inputs and has its other input connected to the output of adependent current source and also to that point along the wire that isproximate to the terminal of the load. The output of the comparator oroperational amplifier is provided via a feedback circuit 2030 that isconfigured to generate the control signaling for the dependent currentsource. The dependent current source is configured to source and/or sinkcurrent as may be needed to ensure the voltage, V_2, at the electricalnode tracks, follows, matches, etc. the DSC reference voltage, Vref_2.The comparator or operational amplifier is connected to a power supplyvoltage (e.g., Vdd and Vss, such as Vdd being the positive supplyvoltage, and Vss being the ground voltage or 0 V).

The feedback circuit 2030 is configured to perform any desiredprocessing on the output of the comparator or operational amplifier togenerate the control signaling for the dependent current source. In anexample of operation and implementation, the feedback circuit 2030within the second DSC is configured to scale the output signal of thecomparator or operational amplifier. The gain adjustment of the feedbackcircuit 2030 within the second DSC is configured to affect the slope ofthe linear region of operation of the comparator or operationalamplifier between the rails of the power supply. For example, considerthe rails of the power supply voltage to be Vdd and Vss, then the outputof the comparator or operational amplifier will be linear when thesecond DSC reference voltage, Vref_2, is within that range between Vddand Vss. Particularly, when the second DSC reference voltage, Vref_2, itat the midpoint between these rails of the power supply voltage, at themidpoint of the linear region of operation of the comparator oroperational amplifier, then the second DSC reference voltage, Vref_2, isequal to the voltage, V_2.

Referring to embodiment 2307, this diagram is similar to the previousdiagram but also includes capacitive switches that couple or connect tothe respective DSCs that couple or connect to the first point along thewire that is proximate to the first terminal of the battery 2010 and thesecond point along the wire that is proximate to the terminal of theload 2020, respectively. For example, a capacitive switch may beconfigured to provide a direct connection through the capacitive switchfor may be configured to provide a connection via a capacitor tofacilitate AC coupling and DC blocking. For example, at DC, a capacitorwill operate as an open circuit. However, AC signals will couple throughthe capacitor.

This diagram also includes a respective analog to digital converter(ADC) 1660 within each of the DSCs that is configured to process theoutput signal of the comparator or operational amplifier to generate adigital signal. The output signal of the comparator or operationalamplifier is representative of any difference between the referencevoltage, Vref_1, and the voltage, V_1, at the point along the wire thatis proximate to the first terminal of the battery 2010.

In addition, in certain examples, within each of the DSCs, a feedbackcircuit 2030 is configured to process the output signal of thecomparator or operational amplifier to generate the control signalingfor the dependent current source. In certain examples, the feedbackcircuit 2030 is configured to scale (e.g., amplified or divide) theoutput signal of the comparator or operational amplifier to provide ascaled version of the output signal of the comparator or operationalamplifier as the control signaling for the dependent current source.Generally speaking, the feedback circuit 2030 is configured to performany desired processing to the output signal of the comparator oroperational amplifier to generate a process to version of the outputsignal of the comparator or operational amplifier as the controlsignaling for the dependent current source.

In addition, this diagram includes one or more processing modules 42.The one or more processing modules 42 includes memory and/or is coupledto memory that stores operational instructions. The one or moreprocessing modules 42 is configured to execute the operationalinstructions to facilitate operation of the DSC. In some examples, theone or more processing modules 42 is configured to provide the referencevoltages, Vref_1 and Vref_2, that are respectively provided to one ofthe input terminals of the comparator or operational amplifier in eachDSC. In addition, the one or more processing modules 42 is configured todirect the operation of the feedback circuits 2030, when such feedbackcircuits 2030 are implemented. Respective feedback circuit controlsignals (fb ckt ctrls) are provided to the feedback circuits 2030 todirect the manner in which feedback circuits 2030 is to process theoutput signal the comparator or operational amplifier within the DSCsgenerate the respective control signaling for the dependent currentsources within the DSCs. In addition, the one or more processing modules42 is configured to direct the operation of the capacitive switches.Respective capacitive switch control signals (C sw ctrls) are providedto the capacitive switches to direct their manner of connectivity,whether a straight connection or via capacitive coupling to the pointsalong the wire that couples or connects the battery 2010 to the load2020. In addition, any other control may be provided from the one ormore processing modules 42 to facilitate operation of the first DSC todetermine the voltage, V_1, at the point along the wire that isproximate to the first terminal of the battery 2010 and also tofacilitate operation of the second DSC to determine the voltage, V_2, atthe point along the wire that is proximate to the terminal of the load2020.

FIG. 23H is a schematic block diagram showing an embodiment 2308 ofoperations as may be used to perform impedance (Z) characterization inaccordance with the present disclosure. This diagram shows impedance (Z)characterization based on a reference signal having an AC component withfrequency, f. Based on reference signal, a DSC is configured to generatea signal having AC component with that frequency, f. Note that a signalhaving both AC and DC components may alternatively be provided from theDSC. Alternatively, a signal having only AC components may be providedfrom the DSC.

Based on the response of the element to which the signal is provided,the DSC generates a digital signal that is representative of one or moreelectrical characteristics of that element. For example, the impedanceof the element, Z(f), at the frequency, f, may be determined based onone or more processing modules interpreting the digital signal that isprovided from the DSC based on the response of the element to the signalfrom the DSC. Generally speaking, signal processing is performed todetermine one or more electrical characteristics of the element. Forexample, based on a change of the signal that is provided to the elementfrom the DSC, the DSC is configured to generate a digital signalrepresentative of that change.

Consider an example in which a signal from the DSC is a current signal.As such a signal (e.g., current signal in this example) is provided tothe element, then based on the impedance of the element, Z(f), one ormore characteristics of the signal (current signal) will be changed inresponse to the impedance of the element, Z(f). In one example, theimpedance of the element, Z(f), or voltage of the element may bedetermined based on a change of the signal (current signal).

In another example, consider a signal from the DSC is a voltage signal.As such a signal (voltage signal) is provided to the element, then basedon the impedance of the element, Z(f), one or more characteristics ofthe signal (voltage signal) will be changed in response to the impedanceof the element, Z(f). In one example, the impedance of the element,Z(f), or current drawn by the element may be determined based on achange of the signal (voltage signal).

One or more processing modules is configured to perform signalprocessing of the digital signal provided from the DSC to determine oneor more electrical characteristics of the element. Note that such one ormore electrical characteristics of the element may include any one ormore of spectrum analysis (SA) information, a frequency response of theelement to the charge or monitoring signal, determination of theimpedance of the element, Z(f), at the frequency, f, etc. suchdetermination may be used to estimate one or more equivalent circuitparameters of the element (e.g., the element being a battery and usingan equivalent circuit model of the battery).

In an example of operation and implementation, spectrum analysis (SA)information is generated by measuring the magnitude of the signal thatis detected/sensed by the DSC in response to a signal that is providedto the element as a function of frequency within a desired frequencyrange. Generally speaking, SA information corresponds to measuring wherethe power or energy of the signal lies as a function of frequency. SuchSA information also provides information of the frequency response ofthe element, in that, comparison of the signal to the detected/sensedsignal provides information regarding the electrical characteristics ofthe element and how it responds to the signal. Such SA informationincludes information regarding the spectral components of thedetected/sensed signal including a dominant frequency (if present),power including distribution of where the power within thedetected/sensed signal may lie as a function of frequency, harmonics,bandwidth, etc.

There are a variety of ways in which spectrum analysis (SA) informationmay be acquired. In some examples, one or more processing modules isconfigured to perform a Fourier transform operation in accordance withdigital signal processing (e.g., discrete Fourier transform (DFT)) onthe digital signal that is provided from the DSC. For example, based onthe signal that is output from an ADC of the DSC that provides a digitalsignal, the one or more processing modules is configured to perform sucha Fourier transform operation to determine the spectrum of thedetected/sensed signal and where the energy of the signal is located asa function of frequency.

In other examples, a spectrum analyzer using the heterodyne principlemay be used such that an input signal undergoes some initial filtering(e.g., often times attenuation, low pass filtering, etc.), then ispassed through a frequency mixer to perform frequency conversion to adesired frequency, an intermediate frequency (IF), for which thespectrum analyzer is specifically designed to process, then subsequentfiltering, and/or amplification, attenuation is performed on the signalbefore providing it to an envelope detector that is operative to detectthe amount of energy within the frequency of interest. Over time, theoperation of the frequency mixer is adapted to sweep across a desiredfrequency range so that analysis of the detected/sensed signal may beperformed at a number of different frequencies within a frequency rangeof interest.

Such SA information may also include the power spectral density (PSD) ofthe detected/sensed signal that corresponds to the spectral energydistribution of the signal as a function of per unit time. Such SAinformation may also include the energy spectral density of thedetected/sensed signal that corresponds to the spectral energydistribution of the signal. Generally speaking, a spectrum analyzer isoperative to determine the signal level of the detected/sensed signal ateach of a number of desired frequencies within a desired frequencyrange.

As described herein, a separately implemented digital spectrum analysis(SA) circuit may be implemented to perform such spectrum analysis, orthe one or more processing modules may be configured to perform digitalsignal processing of a digital signal provided from a DSC in accordancewith such spectrum analysis. The DSC is operative to provide a digitalsignal to such a digital SA circuit or one or more processing modulesthat may undergo any subsequent desired processing includingdetermination of SA information associated with the detected/sensedsignal.

Modifying the frequency of an AC component of a reference signal isprovided to a DSC to be used in the generation of a signal may beperformed in a variety of ways. In some examples, one or more processingmodules includes functionality and capability to generate signals havingdifferent frequencies. For example, one or more processing modules mayinclude a voltage controlled oscillator (VCO) that is operative togenerate a signal having a frequency that is a function of the voltageapplied thereto.

FIG. 23I is a schematic block diagram showing an embodiment 2309 of acircuit configured to provide a reference signal having a desiredfrequency to a DSC in accordance with the present disclosure. Thisdiagram shows one possible implementation of a numerically controlledoscillator (NCO) that may be used to generate a reference signal to beprovided to the DSC having a desired frequency. The NCO includes a phaseaccumulator 3020 and at least one phase to amplitude converter (PAC).This diagram shows the PAC 1 followed by a DAC 1 that are operative togenerate a reference signal and a PAC 2 followed by a DAC 2 that areoperative to generate another reference signal (e.g., a quadratureoutput of the reference signal generated by the PAC 1 followed by a DAC1).

The phase accumulator 3020 receives a frequency control word (FCW) thatis used to specify the frequency of the signal is to be generated by theNCO. For example, phase accumulation is performed (e.g., using an M-bitinteger register). In operation and when the NCO is clocked, the phaseaccumulator 3020 accumulates or adds to its currently held value at eachclock cycle. The PAC uses the output from the phase accumulator 3020which may be viewed as a phase word (e.g., sometimes using the mostsignificant bits (MSBs) of that phase word, such as in accordance withtruncation of the phase were), as the index to locate an appropriatevalue within a lookup table (LUT) (e.g., a cosine LUT including 2^(m)entries, where m is a positive integer) to provide an output signalhaving the corresponding desired amplitude. This output signal from thePAC is provided to a DAC to generate the reference signal. In thisdiagram, a quadrature output may be generated using a second PAC (e.g.,a sine LUT including 2^(m) entries, where m is a positive integer).

Generally speaking, in operation, the phase accumulator 3020 creates asawtooth waveform that is processed by the PAC to generate therespective samples of an oscillating signal, such as a sinusoidalsignal. Those respective samples are provided to the DAC to performdigital to analog conversion thereby generating the reference signalthat may be provided to the DSC.

Note that such an NCO may be implemented within one or more processingmodules that is implemented to provide a reference signal to a DSC.Alternatively, an NCO may be implemented in between the one or moreprocessing modules and the DSC and is operative to generate thereference signal to be provided to the DSC based on input from the oneor more processing modules.

FIG. 23J is a schematic block diagram showing an embodiment 2310 ofoperations as may be used to perform impedance (Z) characterizationacross a number of different frequencies in accordance with the presentdisclosure.

Signal processing and electrical signal analysis may be performed on thedigital signal provided from a DSC that is operative to sense/detect theresponse of the signal that is provided to the element. As such,impedance (Z) characterization may be performed not only based on theresponse of the element to an AC component of the signal having asingular frequency, but based on response of the element to the ACcomponent of the signal across any desired frequency range.

FIGS. 23K and 23L are schematic block diagrams showing embodiments 2311and 2312 of impedance (Z) profiles across a number of differentfrequencies in accordance with the present invention.

Referring to embodiment 2311, this diagram shows an impedance (Z)profile that exhibits primarily resistive characteristics at DC and lowfrequencies and has a magnitude that increases with increasingfrequency.

Referring to embodiment 2312, this diagram shows an impedance (Z)profile that exhibits primarily resistive characteristics at DC and lowfrequencies and has a magnitude that decreases with increasingfrequency.

Note that these diagrams of impedance (Z) profiles across a number ofdifferent frequencies are not exhaustive and merely examples showingvariation of impedance as a function of frequency. When modeling a wire,such as a wire connecting a terminal of the battery to a terminal of aload, the wire will exhibit primarily resistive characteristics at DCand low frequencies, and as frequency increases, the impedance of thewire may change, increase or decrease, based on the contributions of theinductive and capacitive components of the wire.

FIGS. 23M and 23N are schematic block diagrams of embodiments of methods2313 and 2314 for execution by one or more devices in accordance withthe present disclosure.

The method 2313 operates similar to the method 2108 of FIG. 21H yet doesso to determine a first voltage, V_1, that is at a first point that isproximate to a terminal of the battery along a wire connecting theterminal of the battery to a terminal of a load and also for a secondvoltage, V_2, that is at a second point that is proximate to a terminalof the load.

The method 2313 operates in step 2180 a by setting a first DSC referencevoltage, Vref_1, to a first value to produce a first reference current,Iref_1. For example, the first value of the DSC reference voltage,Vref_1, may be set to an estimated voltage of a battery (e.g., anestimate of V_1). The voltage, V_1, is at a point that is proximate to aterminal of the battery along a wire connecting the terminal of thebattery to a terminal of a load.

The method 2313 also operates in step 2182 a by tuning the DSC referencevoltage, Vref_1, to compare favorably with the voltage, V_1, at thepoint along the wire that is proximate to the terminal of the battery.The method 2313 also operates in step 2184 a by determining whether theDSC reference voltage, Vref_1, to compare favorably with the voltage,V_1, based on the tuning. For example, this may be determined based onthe operational amplifier or comparator output being zero, the dependentcurrent source of a DSC not needing to provide any current, I_d1, orsome other basis, etc.

Based on the DSC reference voltage, Vref_1, comparing favorably with thevoltage, V_1, based on the tuning, as determined in step 2186 a, themethod 2313 branches to step 2188 a operates by determining with thevoltage, V_1. This is determined based on the tuned value of the DSCreference voltage, Vref_1. Referring back to certain of the previousdiagrams, this corresponds to the situation that the output of thecomparator or operational amplifier is zero, DSC reference voltage,Vref_1, is equal to V_1 (Vref_1=V_1), the dependent current source of aDSC no longer provides any current, I_d1, such that I_d1=0 andIref_1=I_1. The value of the DSC reference voltage, Vref_1, is known,and therefore V_1 is also known based on Vref_1=V_1.

Alternatively, based on the DSC reference voltage, Vref_2, comparingunfavorably with the voltage, V_2, as determined in step 2186 b, themethod 2313 branches back to step 2182 b and continues to perform tuningof the DSC reference voltage, Vref_2. The tuning continues until the DSCreference voltage, Vref_2, compares favorably with the voltage, V_2,which facilitates the determination of voltage, V_2.

Along the other branch of the method 2313 that serves to determine V_2,the method 2313 operates in step 2180 b by setting a first DSC referencevoltage, Vref_2, to a first value to produce a first reference current,Iref_2. For example, the first value of the DSC reference voltage,Vref_2, may be set to an estimated voltage of a load (e.g., an estimateof V_2). The voltage, V_2, is at a point that is proximate to a terminalof the load along a wire connecting the terminal of the battery to aterminal of a load.

The method 2313 also operates in step 2182 b by tuning the DSC referencevoltage, Vref_2, to compare favorably with the voltage, V_2, at thepoint along the wire that is proximate to the terminal of the load. Themethod 2313 also operates in step 2184 b by determining whether the DSCreference voltage, Vref_2, to compare favorably with the voltage, V_2,based on the tuning. For example, this may be determined based on theoperational amplifier or comparator output being zero, the dependentcurrent source of a DSC not needing to provide any current, I_d2, orsome other basis, etc.

Based on the DSC reference voltage, Vref_2, comparing favorably with thevoltage, V_2, based on the tuning, as determined in step 2186 b, themethod 2313 branches to step 2188 b operates by determining with thevoltage, V_2. This is determined based on the tuned value of the DSCreference voltage, Vref_2. Referring back to certain of the previousdiagrams, this corresponds to the situation that the output of thecomparator or operational amplifier is zero, DSC reference voltage,Vref_2, is equal to V_2 (Vref_2=V_2), the dependent current source of aDSC no longer provides any current, I_d2, such that I_d2=0 andIref_2=I_2. The value of the DSC reference voltage, Vref_2, is known,and therefore V_2 is also known based on Vref_2=V_2.

Alternatively, based on the DSC reference voltage, Vref_2, comparingunfavorably with the voltage, V_2, as determined in step 2186 b, themethod 2313 branches back to step 2182 b and continues to perform tuningof the DSC reference voltage, Vref_2. The tuning continues until the DSCreference voltage, Vref_2, compares favorably with the voltage, V_2,which facilitates the determination of voltage, V_2.

Referring to FIG. 23N, the method 2314 operates in step 2370 by sweepingthe frequency of the first DSC reference voltage, Vref_1(AC component),across a range of frequencies (e.g., f1 through fx). The frequencieswithin this range may be uniformly spaced such as based on a commonincrement, or non-uniformly spaced in various examples. For example,considering substantially uniformly spaced frequencies, consider therange of frequencies may vary between 1 Hz and 1 kHz in increments of100 Hz (e.g., frequencies of 1 Hz, 100 Hz, 200 Hz, 300 Hz, up to 1 kHz),between 10 Hz and 100 kHz in increments of 10 kHz (e.g., frequencies of10 kHz, 20 kHz, 30 kHz, up to 100 kHz), or some other frequency rangeand increment. Alternatively, considering non-uniformly spacedfrequencies, consider the range of frequencies may vary between 1 Hz and1 kHz (e.g., frequencies of 1 Hz, 200 Hz, 500 Hz, 1 kHz), between 10 Hzand 100 kHz (e.g., frequencies of 10 kHz, 50 kHz, 80 kHz, 100 kHz), orsome other frequency range and frequencies.

Note that this sweeping of the AC component of the first DSC referencevoltage, Vref_1(AC component), is performed after the DC component ofthe first DSC reference voltage, Vref_1(DC component), has beenappropriately tuned so that the DC component of the first DSC referencevoltage, Vref_1(DC component), is same as the DC voltage of the pointalong the wire that is proximate to the terminal of the battery, V_1(DCcomponent). Once the DC component of the first DSC reference voltage,Vref_1(DC component), matches the DC voltage of the point along the wirethat is proximate to the terminal of the battery, V_1(DC component), andAC component of the first DSC reference voltage, Vref_1(AC component),may be added to the first DSC reference voltage, Vref_1(AC component),such that the overall first DSC reference voltage, Vref_1(DC+ACcomponents), includes both the DC component and an AC component.

The magnitude and frequency of the AC component areconfigurable/adjustable. For example, consider an embodiment in whichone or more processing modules is configured to provide the first DSCreference voltage, Vref_1(DC+AC components), then the DC componentmagnitude as well as the magnitude and frequency of the AC component maybe configured/adjusted to any desired value by the one or moreprocessing modules. Consider another embodiment in which a signalgenerator is configured to provide the first DSC reference voltage,Vref_1(DC+AC components), then the DC component magnitude as well as themagnitude and frequency of the AC component may be configured/adjustedto any desired value by the signal generator.

The loop gain of the DSC that operates based on first DSC referencevoltage, Vref_1 (AC component), is configured to determine the amount ofcurrent, I_d1(AC component), that is provided from the dependent currentsource within that particular DSC. For example, the amount of current,I_d1(AC component), that is provided from the dependent current sourcewithin the particular DSC will be a function of the loop gain of thatDSC and the first DSC reference voltage, Vref_1 (AC component).

In some examples, a very small magnitude AC component in comparison tothe magnitude of the DC component is used. For a specific example,consider the magnitude of the DC component of the first DSC referencevoltage, Vref_1(DC component), to be approximately 12 V, then a verysmall magnitude AC component of the first DSC reference voltage,Vref_1(AC component), may be in the 10s or 100s of millivolts (orsmaller or larger values). In even other examples, the magnitude of theAC component of the first DSC reference voltage, Vref_1(AC component),is even smaller in comparison to the DC component of the first DSCreference voltage, Vref_1(DC component).

As such, the AC component of the first DSC reference voltage, Vref_1 (ACcomponent), and the corresponding AC component of the of current,I_d1(AC component), that is provided from the dependent current sourceof that DSC may be very small. Note that based on the appropriate tuningof the DC component of the first DSC reference voltage, Vref_1(DCcomponent), being same as the DC voltage of the point along the wirethat is proximate to the terminal of the battery, V_1(DC component), theDC component of the current, I_d1(DC component), that is provided fromthe dependent current source will be zero, I_d1(DC component)=0 amps.Again, the AC component of the first DSC reference voltage, Vref_1(ACcomponent), may be very small in comparison to the DC component of thefirst DSC reference voltage, Vref_1(DC component), thereby having littleto no effect on the operation of the system including the battery 2010that is configured to provide power to the load 2020.

In an example of operation and implementation, consider a loop gain ofthis particular DSC having an AC peak to peak first DSC referencevoltage, Vref_1 (AC component), of 10 millivolts that is configured togenerate an AC peak to peak current, I_d1 (AC component), of 10 μA fromthe dependent current source within that particular DSC. In such a case,the particular gain of that loop would be 1/1000 amps/volts, such thatan AC peak to peak first DSC reference voltage, Vref_1 (AC component),of X volts is configured to generate an AC peak to peak current, I_d1(ACcomponent), of X/1000 amps that has a magnitude that is 1/1000 themagnitude of the AC peak to peak first DSC reference voltage, Vref_1 (ACcomponent), of X volts. Note that the gain of the loop may be adjustedbased on a feedback circuit having a disability/configurability (e.g.,such as based on any of those various embodiments described herein).Alternatively, consider an implementation in which the loop of the DSCincludes no feedback circuit, then the inherent gain of the loop may becharacterized and known and that gain of the loop may be used todetermine which amount of AC peak to peak current, I_d1 (AC component)is output from the dependent current source within that particular DSCbased on a particular AC peak to peak first DSC reference voltage,Vref_1 (AC component).

The AC current provided from the dependent current source within theDSC, current, I_d1(AC component), is then same as the AC current,Isource(AC component), that flows from the point along the wire that isproximate to the terminal of the battery to the point along the wirethat is proximate to the terminal of the load. This AC current, which isknown and which flows through the wire, may be used in conjunction withthe AC component of the first DSC reference voltage, Vref_1 (ACcomponent), which is equal to the AC component of the voltage, V_1(ACcomponent), at the point along the wire that is proximate to theterminal the battery and also the AC component of the voltage, V_2(ACcomponent), at the point along the wire that is proximate to theterminal the load to determine the impedance of the wire, Zwire(ACcomponent), at the particular frequency of the AC component of the firstDSC reference voltage, Vref_1 (AC component). Specifically, knowing theAC components of the voltages at both ends of the wire, V_1(ACcomponent) and V_2(AC component), as well as the AC current flowingthrough the wire, the impedance of the wire, Zwire(AC component), at aparticular frequency may be determined. These calculations may be basedon the following equations.

V_1(AC component)−V_2(AC component)=Isource(AC component)×Zwire(ACcomponent)

Zwire(AC component)=[V_1(AC component)−V_2(AC component)/Isource(ACcomponent)

Based on the AC component of the first DSC reference voltage, Vref_1 (ACcomponent), being added to the DC component of the first DSC referencevoltage, Vref_1 (DC component) thereby facilitating the AC current,Isource(AC component) (e.g., which is same as the AC current providedfrom the dependent current source within the DSC, current, I_d1(ACcomponent) to flow through the wire, and also based on the determinationof the AC component of the voltage, V_2(AC component), impedance of thewire, Zwire(AC component), at each of the respective frequencies may bedetermined.

The DC component of the second DSC reference voltage, Vref_2(DCcomponent), is tuned to be same as the DC voltage of the point along thewire that is proximate to the terminal of the load, V_2(DC component),thereby facilitating the DC component of the current, I_d2(DCcomponent), that is provided from the dependent current source of thesecond DSC to be zero, I_d2(DC component)=0 amps.

Then, the second DSC on the right hand side of the diagram is configuredto determine the AC component of the current, I_d2(AC component), thatis provided from the dependent current source of the second DSC. Theloop gain of the second DSC on the right-hand side of the diagram isthen used to determine the AC component of the voltage at the pointalong the wire that is proximate to the terminal of the load, voltage,V_2(AC component). Note that bandpass filtering may be performed on thesignal that is output from the comparator or operational amplifier ofthe second DSC on the right-hand side of the diagram. This bandpassfiltering may be performed using analog components, or it may beperformed in the digital domain by one or more processing modules. Forexample, once the output signal from the comparator or operationalamplifier of the second DSC on the right-hand side of the diagram ispassed through an analog to digital converter (ADC) thereby generating adigital signal, any desired digital signal processing on that digitalsignal may be performed including bandpass filtering to recover the ACcomponent of the voltage at the point along the wire that is proximateto the terminal of the load, voltage, V_2(AC component) while filteringout the DC component of the voltage at the point along the wire that isproximate to the terminal of the load, voltage, V_2(DC component).

In some examples, the AC component of the second DSC reference voltage,Vref_2(AC component), is tuned to be same as the AC voltage of the pointalong the wire that is proximate to the terminal of the load, V_2(ACcomponent), and information corresponding to the magnitude of the ACcomponent of the second DSC reference voltage, Vref_2(AC component), toachieve back condition facilitates the determination of the actual ACvoltage of the point along the wire that is proximate to the terminal ofthe load, V_2(AC component).

As such, the method 2314 operates in step 2372 by determining the ACcomponent of the point along the wire that is proximate to the terminalof the load, V_2(AC component), corresponding to each of the respectivefrequencies through which the AC component of the first DSC referencevoltage, Vref_1 (AC component), has swept through. Again, note that theAC current flowing through the wire, Isource(AC), will be same as the ACcurrent provided from the dependent current source within the first DSC,I_d1 (AC component), such that Isource(AC)=I_d1(AC component).Information regarding the AC component of the voltage at the point alongthe wire that is proximate to the terminal of the battery, V_2(ACcomponent), the AC current flowing through the wire, Isource(AC), aswell as the AC voltage of the point along the wire that is proximate tothe terminal of the load, V_2(AC component), facilitates determinationof the AC impedance of the wire, Zwire(AC component), at the frequencyof the AC signals (e.g., as initiated by the AC component of the firstDSC reference voltage, Vref_1(AC component)).

The method 2314 also operate in step 2374 by determining the ACimpedance of the wire, Zwire(AC component), at the respectivefrequencies of various AC signals. Note that the determination of the ACimpedance of the wire, Zwire(AC component), at the respectivefrequencies of various AC signals facilitates the determination of animpedance profile of the wire as a function of the respectivefrequencies of those various AC signals. For example, this involvesdetermining the AC impedance of the wire, Zwire(AC component), at afirst frequency, f1, in step 2374 a. This also involves determining theAC impedance of the wire, Zwire(AC component), at a second frequency,f2, in step 2374 b. This step may group performed with respect to any ofa number of desired frequencies within a particular frequency range. Forexample, this also involves determining the AC impedance of the wire,Zwire(AC component), at an xth frequency, fx, in step 2374 x. Generallyspeaking, these frequencies may be lower frequency signals andrelatively closer to DC than higher frequency.

The method 2314 and operates in step 2376 by determining the DCimpedance of the wire, Rwire. For example, this is based on identifyingflat response of the impedance profile of the wire as a function of therespective frequencies of the various AC signals. Based on multiple ACimpedances of the wire, Zwire(AC component), at various frequencies, anddetermining a flat response of that impedance profile of the wire is afunction of frequency, particularly at lower frequencies, including DC,the DC impedance of the wire, Rwire, may be determined.

Once the DC impedance of the wire, Rwire, is known, the method 2314operates in step 2378 by determining the DC current flowing through thewire, Isource(DC component). For example, this DC current flowingthrough the wire, Isource(DC component), corresponds to the DC currentbeing provided from a battery to a load. For example, this is determinedbased on based on information that is known corresponding to the DCvoltage at the point along the wire that is proximate to the terminal ofthe battery, V_1(DC component), the voltage at the point along the wirethat is proximate to the terminal of the load, V_2(DC component), andthe DC impedance of the wire, Rwire. These calculations may be based onthe following equations.

V_1(DC component)−V_2(DC component)=Isource(CC component)×Rwire

Isource(DC component)=[V_1(DC component)−V_2(DC component)]/Rwire

Note that the method 2314 may be performed with respect to several ofthe various embodiments, diagrams, etc. herein. For example, the method2014 may be performed by the various architectures describe within anyof the FIG. 23A through FIG. 23G. Note that various implementations ofDSCs, such as included within the left-hand side and right-hand side ofthe respective FIGS. 23A through 23G may all be adapted to perform suchoperations to facilitate the determination DC current flowing throughthe wire, Isource(DC component). Note that such functionality andoperations may be performed with no or minimal adverse effects to thesystem including the battery that is coupled or connected to the loadvia a wire. Note also that such functionality and operations may beperformed without requiring any additional components to be placed inline with the wire that couples are connects the battery to the load.Such functionality and operations may be performed merely by accessingthe wire that couples are connects the battery to load thereby providingmuch information regarding the overall system.

Note that such architectures, methods, functionality, and operations asdescribed herein facilitate the determination of the overall system inmanners that do not incur the adverse effects used by prior artapproaches that can significantly interfere with the operation of theoverall system.

FIG. 24A is a schematic block diagram showing an embodiment 2401 of abattery that is connected or coupled to a load and multiple DSCs thatare implemented to detect voltages in conjunction with a commonreference load impedance (Z) in accordance with the present disclosure.This diagram includes a common reference load impedance (Z) that is usedby both the first DSC on the left-hand side of the diagram and a secondDSC on the right-hand side of the diagram. The common reference loadimpedance (Z) is switched in to the first DSC on the left-hand side ofthe diagram at or during a first time and is switched in to the secondDSC on the right-hand side of the diagram at or during a second time.The use of a common reference load impedance (Z) operates to ensure thereference load is matched for reference current sensing by therespective DSCs. For example, when measuring the voltage, V_1, at thefirst point along the wire that is proximate to the terminal of thebattery, the common reference load impedance (Z) is switched in to thefirst DSC on the left-hand side of the diagram and disconnected from thesecond DSC on the right-hand side of the diagram. Then, when measuringthe voltage, V_2, at the second point along the wire that is proximateto the terminal of the load, the common reference load impedance (Z) isswitched in to the second DSC on the right-hand side of the diagram anddisconnected from the first DSC on the left-hand side of the diagram.

In addition, this diagram includes one or more processing modules 42.The one or more processing modules 42 includes memory and/or is coupledto memory that stores operational instructions. The one or moreprocessing modules 42 is configured to execute the operationalinstructions to facilitate operation of the DSC. In some examples, theone or more processing modules 42 is configured to provide the referencevoltages, Vref_1 and Vref_2, that are respectively provided to one ofthe input terminals of the comparator or operational amplifier in eachDSC. In addition, the one or more processing modules 42 is configured todirect the operation of the feedback circuits 2030, when such feedbackcircuits 2030 are implemented. Respective feedback circuit controlsignals (fb ckt ctrls) are provided to the feedback circuits 2030 todirect the manner in which feedback circuits 2030 is to process theoutput signal the comparator or operational amplifier within the DSCsgenerate the respective control signaling for the dependent currentsources within the DSCs. Also, the one or more processing modules 42 isconfigured to direct the operation of the switches that facilitateconnection or disconnection of the respective DSCs from the commonreference load impedance (Z). Switch control signals (sw ctrls) areprovided to switches to direct their manner of connectivity, whetherconnecting the common reference load impedance (Z) to a DSC ordisconnecting the common reference load impedance (Z) to a DSC.

In addition, the one or more processing modules 42 is configured todirect the operation of the capacitive switches, when such capacitiveswitches are implemented. Respective capacitive switch control signals(C sw ctrls) are provided to the capacitive switches to direct theirmanner of connectivity, whether a straight connection or via capacitivecoupling to the points along the wire that couples or connects thebattery 2010 to the load 2020. In addition, any other control may beprovided from the one or more processing modules 42 to facilitateoperation of the first DSC to determine the voltage, V_1, at the pointalong the wire that is proximate to the first terminal of the battery2010 and also to facilitate operation of the second DSC to determine thevoltage, V_2, at the point along the wire that is proximate to theterminal of the load 2020.

FIG. 24B is a schematic block diagram showing another embodiment 2402 ofa battery that is connected or coupled to a load and multiple DSCs thatare implemented to detect voltages in conjunction with a commonreference load impedance (Z) in accordance with the present disclosure.This diagram is similar to the previous diagram but does not include theswitches that facilitate connection or disconnection of the commonreference load impedance (Z) as in the previous diagram. In thisimplementation, the DSCs are operated such that when one of them isoperational to perform determination of voltage at a point along thewire, the other operates in such a way that no current is provided tothe common reference load impedance (Z). For example, when the first DSCon the left-hand side of the diagram operates to determine the voltage,V_1, at the point along the wire that is proximate to the first terminalof the battery 2010, the second DSC on the right-hand side of thediagram is operated such that the Iref_2 along the connection betweenthat second DSC on the right-hand side of the diagram and the commonreference load impedance (Z) is zero. Similarly, when the second DSC onthe right-hand side of the diagram operates to determine the voltage,V_2, at the point along the wire that is proximate to the terminal ofthe load 2020, the first DSC on the left-hand side of the diagram isoperated such that the Iref_1 along the connection between that firstDSC on the left-hand side of the diagram and the common reference loadimpedance (Z) is zero. This implementations operates to performelectrical isolation of one of the DSCs from the common reference loadimpedance (Z) when the other of the DSCs is operating to determine avoltage.

FIG. 24C includes schematic block diagrams showing various embodiments2403 a, 240 b, 240 c, and 240 d of common reference load impedances (Zs)that may be implemented in conjunction within multiple DSCs inaccordance with the present disclosure.

Note that each of the respective embodiments 2403 a, 240 b, 240 c, and240 d of common reference load impedances (Zs) may be electricallyconnected or disconnected using switches such as with respect to FIG.24A or electrically isolated based on the operation of the DSCs such asa suspect FIG. 24B.

Referring to embodiment 2403 a, this common reference load impedance (Z)includes two N-type metal-oxide-semiconductor field-effect transistors(MOSFETs) (NMOSs) having their respective gates connected and provided abias voltage, Vbias. The respective drains of the NMOSs are configuredto receive the reference currents, Iref_1 and Iref_2. Also, the sourcesof the NMOSs are connected to ground.

Referring to embodiment 2403 b, this common reference load impedance (Z)includes two N-type metal-oxide-semiconductor field-effect transistors(MOSFETs) (NMOSs) having their respective sources connected and alsoconnected to the drain of another N-type metal-oxide-semiconductorfield-effect transistor (MOSFET) (NMOS) having its source connected toground. The respective drains of the top two NMOSs are configured toreceive the reference currents, Iref_1 and Iref_2. The source of theother NMOS (on the bottom right) is connected to ground.

Referring to embodiment 2403 c, this common reference load impedance (Z)is implemented as a configurable impedance (Z) circuit such that any ofa number of different impedances may be switched in and configured toreceive the reference current, Iref_1, or the reference current, Iref_2.

Referring to embodiment 2403 d, this common reference load impedance (Z)generally shows any other high impedance (Z) common reference load thatmay be using any of a number of different electrical componentsincluding transistors, resistors, inductors, capacitors, etc.

FIG. 24D is a schematic block diagram of an embodiment of variousexamples of impedance (Zs) such as may be implemented within aconfigurable impedance (Z) circuit in accordance with the presentdisclosure. This diagram shows a number of possible impedances that maybe included within a configurable Z circuit. An impedance Z1 includes asingle resistor such that the impedance is as follows: Z=R. An impedanceZ2 includes a single inductor such that the impedance is as follows:Z=jωL, where ω=2 π f. An impedance Z3 includes a single capacitor suchthat the impedance is as follows: Z=−j(1/ωC).

Note that when two impedances are in series with another, e.g., Z1 inseries with Z2, then totally equivalent impedance is the sum of the twoas follows: Ze=Z1+Z2.

However, when two impedances are in parallel with another, e.g., Z1 inparallel with Z2, then totally equivalent impedance is as follows:Ze=(Z1*Z2)/(Z1+Z2).

An impedance Z4 includes a resistor in series with an inductor such thatthe impedance is as follows: Z=R+jωL. An impedance Z5 includes aresistor in series with a capacitor such that the impedance is asfollows: Z=R−j(1/ωC). An impedance Z6 includes an inductor in serieswith a capacitor such that the impedance is as follows: Z=jωL−j(1/ωC).

An impedance Z7 includes an inductor in parallel with a capacitor suchthat the impedance is as follows: Z=R//jωL, where // indicates parallelconnectivity of the two components. An impedance Z8 includes a resistorin parallel with a capacitor such that the impedance is as follows:Z=R//(−j(1/ωC)), where // indicates parallel connectivity of the twocomponents. An impedance Z9 includes an inductor in parallel with acapacitor such that the impedance is as follows: Z=jωL//(−j(1/ωC)),where // indicates parallel connectivity of the two components.

Generally speaking, an impedance Z10 such as may be included within aconfigurable Z circuit may include any other combination of R, L, C inseries, parallel, etc. In addition, note that any one or more of theimpedances within a given configurable Z circuit may include variabilityor adjustability (e.g., a variable/tunable capacitor, a variable/tunableinductor, a variable/tunable resistor, etc.).

Note that one or more processing modules may be configured to select anappropriate impedance value within a configurable Z circuit that isimplemented in line between the DSC and the battery to facilitate thedesired operation of the various components. Examples of some desiredoperations may include maximizing power transfer of a signal providedfrom the DSC to the battery or minimizing reflection of the signalprovided from the DSC to the battery.

FIG. 24E is a schematic block diagram of an embodiment of a method 2405for execution by one or more devices in accordance with the presentdisclosure.

The method 2405 operates in step 2450 by determining a voltage, V_1, ata point along a wire that is proximate to a terminal of the battery(e.g., of an implementation in which a battery is connected to a loadvia a wire). This determination is based on using a common referenceload impedance (Z). For example, this determination is made at or duringa time 1. Also, this determination may be made by using electricalisolation of the common reference load impedance (Z) based onappropriately operating switches facilitate electrical connection ordisconnection. Alternatively, this determination may be made by usingelectrical isolation of the common reference load impedance (Z) based onappropriately operating DSCs such one of them is electrically isolatedfrom the common reference load impedance (Z) when the other DSC isdetermining a voltage.

The method 2405 operates in step 2452 by determining a voltage, V_2, ata point along a wire that is proximate to a terminal of the load (e.g.,of the implementation in which the battery is connected to the load viathe wire). This determination is also based on using the commonreference load impedance (Z). Electrical isolation made be achieved forthe common reference load impedance (Z) using switches, based onoperation of DSCs, etc. as described above.

In some variants of the method 2405, the method 2405 operates in step2454 by employing the voltages, V_1 and V_2, for one or more subsequentprocesses, operations, etc. For example, this may involve determiningthe impedance of the wire connecting the battery to the load,determining the current flowing through the wire connecting the batteryto the load, etc.

FIG. 25A is a schematic block diagram of an embodiment 2500 of a batterysensor system that includes a plurality of drive sense circuits 28 andone or more processing module(s) 42. The processing module(s) 42 asdescribed herein, each includes memory and/or are coupled to memory thatstores operational instructions. In an embodiment, processing module 42includes a controller circuit 2525 for controlling operation of one ormore of the battery and loads. The drive sense circuits 28 areinteractive with (e.g., operably coupled to a wired connection between)a battery and a plurality of loads. The wired connection is illustratedby bolded lines and includes one or more wires operably coupled toprovide a low impedance path between the battery and the plurality ofloads. As an example, the impedance of the low impedance path issubstantially the impedance of a wire (e.g., Z=p+l/A_(eff), where p isthe resistivity of the wire, l is the length of the wire, and A_(eff) isthe effective cross-sectional area). Note two or more of the drive sensecircuits 28, the battery 2010, the wired connection, and the loads 2020may be collectively referred to herein as a battery sensor system. Theprocessing module(s) 42 operates to receive data (e.g., analog signals,digital signals, etc.) from the drive sense circuits 28 and to configureoperation of the drive sense circuits 28 (e.g., set reference signals,enable, disable, etc.)

In an example of operation, the battery sensor system determines avoltage at a point(s) of the wired connection as described in FIGS. 21A,22A, etc. For example, a first drive sense circuit DSC-1 28 determines avoltage V__(B1) at a first point of the wired connection proximate(e.g., touching, within 0.1 inches, within an inch, etc.), to thebattery 2010. As another example, a second drive sense circuit DSC-2 28determines a voltage V__(L1) at a second point of the wired connectionproximate to a first load 1 2020. As another example, a third drivesense circuit DSC-3 28 determines a voltage V__(L2) at a third point ofthe wired connection proximate to a second load 2 2020.

The processing module 42 obtains the voltages (e.g., via a voltagesignal, a digital value representative of a voltage, etc.) from thesensors circuits and determines a variance, or voltage drop, between thebattery and one or more loads. For example, the processing module 42determines the point V__(B1) is at 11.89 volts, the point V__(L1) is at11.87 volts and determines the point V__(L2) is at 11.86 volts. Theprocessing module 42 determines the variance (e.g., difference via asubtraction function) between point V__(B1) and V__(L1) is 0.02 volts,the variance between point V__(B1) and V__(L2) is 0.03 volts, and thevariance between point V__(L1) and V__(L2) is 0.01 volts.

In an embodiment, the processing module compares one or more of thevoltages to one or more voltage thresholds for the battery sensor systemand generates and sends (e.g., to a controller (e.g., to change functionof the battery and/or loads), to another processing module, etc.) analert message when a voltage exceeds a threshold and/or is outside avoltage threshold range. For example, when the variance between V__(B1)and V__(L2) exceeds 0.01155 volts, the processing module generates andsends an alert message to the controller.

The processing module further functions to control operation of thedrive sense circuits 28. For example, the processing modules determinesand/or provides a voltage reference signal for each drive sense circuitto utilize in determining a voltage at each respective point where drivesense circuit is operably coupled to the wired connection. As a specificexample, the processing module estimates a voltage (e.g., based onprevious voltage reading, based on a known desired voltage (e.g., 12V),based on time since last measurement, based on battery rating, etc.) ata particular point, and sets the voltage reference signal of the drivesense circuit to the estimated voltage. For example, the battery israted as a 48V battery and the processing module 42 estimates thevoltage on the first point of the wired connection to be 47.99995 V.

FIG. 25B is a schematic block diagram of an embodiment 2501 of a batterysensor system that includes the plurality of drive sense circuits 28 andthe processing module(s) 42 of FIG. 25A.

In an example of operation, the battery sensor system determines animpedance of one or more paths of the wired connection between thebattery and the plurality of loads. For example, the battery sensorsystem operates as described with reference to FIGS. 23A-N to determinea first impedance of a first path (Z_wire_1) of the wired connection andto determine a second impedance of a second path (e.g., Z_wire_2) of thewired connection.

As a specific example, the first drive sense circuit 28 provides aplurality of oscillating signals (e.g., an alternating current (AC)signal) on to the wired connection at or during the same time t1. Eachoscillating signal of the plurality of oscillating signals oscillates ata particular frequency (e.g., 20 signals from 5 hertz (Hz) to 195 Hzspaced evenly every 10 Hz, 10 signals from 100 Hz to 1 MHz non-evenlyspaced, etc.). The other drive sense circuits 28 (e.g., in this examplecoupled to the plurality of loads) sense the plurality of oscillatingsignals and provide a representation of the sensed plurality ofoscillating signals to the processing module for processing.

Alternatively, or in addition to, the battery sensor system sweepsthrough a plurality of oscillating signals as a function of time. Forexample, at or during time period t1, the first drive sense circuit 28injects a first number of oscillating signals, and at or during a secondtime period t2, the first drive sense circuit 28 injects a second numberof oscillating signals.

Still alternatively, or in addition to, a first drive sense circuit 28of the battery sensor system injects a first oscillating signal at orduring time t1 at a first frequency, and injects a second oscillatingsignal at or during time t2 at the first frequency. In a specificexample, the processing module determines the temperature of the wirehas increased based on an impedance change of the wire (e.g., afrequency response magnitude of second oscillating signal at the firstfrequency being less than a frequency response magnitude of the firstoscillating signal at the first frequency indicating wire has increasedin temperature).

FIG. 25C is a schematic block diagram of another embodiment 2502 of abattery sensor system that is interactive with a battery 2010 and aplurality of loads 2020. This diagram is similar to FIG. 25A with atleast one difference being that a minus direct current (DC) selector2505 (e.g., a capacitive switch of FIG. 21A, a switch, etc.) as shown inFIG. 25D is added between a drive sense circuit 28 and the wiredconnection. As illustrated in FIG. 25D, when the minus DC selector 2505is in a first position, it provides a very low impedance path (e.g., ashort, impedance of a wire, etc.), where signals (e.g., DC, alternatecurrent (AC), etc. signals) generated from a first drive sense circuit28 flow onto the wire to one or more other drive sense circuits 28. Whenthe minus DC selector 2505 is in a second position, it substantiallyremoves the constant component (e.g., DC) of the signals via capacitorC1 and provides the oscillating component (e.g., AC) of the signals onto the wire.

As a specific example, when a first drive sense circuit 28 generates afirst signal that includes a DC component and an AC component, a firstminus DC selector 2505 is set (e.g., via selector controls fromprocessing module 42) to the second position to remove the DC componentfrom the first signal to produce a first oscillating signal. The otherminus DC selectors 2505 coupled to the wired connection and the otherdrive sense circuits 28 (e.g., the drive sense circuits receiving thefirst oscillating signal) are set to the first position to provide a lowimpedance receive path.

FIG. 25E is a flowchart illustrating an example of a method ofdetermining operational status of a battery sensor system that includesa plurality of drive sense circuits, one or more processing modules, abattery, one or more loads, and a wired connection between the batteryand loads. The method begins or continues with step 2510, where a firstdrive sense circuit of the plurality of drive sense circuits senses afirst voltage at a first point of the wired connection, which isproximate to the battery.

The method continues with step 2512, where a second drive sense circuitof the plurality of drive-sense circuits senses a second voltage at asecond point of the wired connection, which is proximate to a first loadof the plurality of loads. The method continues with step 2514, where athird drive sense circuit of the plurality of drive-sense circuitssenses a third voltage at a third point of the wired connection, whichis proximate to a second load of the plurality of loads.

The method continues with step 2516, where a processing module of theone or more processing modules determines operational status of thebattery and/or loads based on one or more of the first, second and thirdvoltages. The operational status includes one or more of a voltage level(e.g., the voltage at a respective point, the voltage compared to adesired voltage (e.g., full charge voltage, voltage needed to optimaldrive a respective load, etc.), etc.), a voltage variance between twosensed voltages, a favorable operational status (e.g., good when a firstvoltage level exceeds a first voltage level threshold) and an estimatedtimeframe that the battery is configured to power the loads undercurrent and/or expected conditions.

The method continues to step 2518, where the processing moduledetermines whether the operational status compares unfavorably to aperformance threshold (low voltage threshold, voltage threshold range,high voltage threshold, operational status is bad, estimate battery lifethreshold, etc.). For example, the processing module determines avoltage of 8.499999 V proximate the battery is below a low voltagethreshold (e.g., 8.5V) for the battery. As another example, theprocessing module determines a voltage variance (e.g., 0.004937 V)between a first point and a second point of the wired connection isbelow a voltage variance threshold (e.g., 0-0.005V).

When the operational status compares unfavorably, the method continuesto step 2520, where the processing module generates and sends an alertmessage to a controller and/or other processing module regarding theoperational status issue (e.g., comparing unfavorably (e.g., 8V<8.5V)).Alternatively, or in addition to, the processing module implements anoperation status fix process based on the operational status. Forexample, the processing module instructs a controller to modifyoperation of one or more of the battery and the load such that theoperational status issue is rectified. For example, the processingmodule instructs the controller to turn off a load. As another example,the processing module instructs the controller to turn on or add abattery cell to the battery. When the operational status comparesfavorably, the method continues back to step 2510. For example, theprocessing module determines the voltage variance in within the voltagevariance threshold (e.g., compares favorably).

FIG. 26A is a schematic block diagram of another embodiment 2601 of abattery sensor system that is interactive with a wired connectionbetween a battery 2010 and a plurality of loads 2020. The battery sensorsystem includes the plurality of drive sense circuits 28 and theprocessing module(s) 42 of FIG. 25A.

In an example of operation, the battery sensor system determines thecurrents (e.g., I_source, I_load_1, I_load_2, etc.) flowing on the wiredconnection based on the voltages sensed (e.g., in FIG. 25A) and theresistance (e.g., based on the impedances determined (e.g., in FIG. 25B)on the wired connection. The first load current is determined inaccordance with Ohm's law V=IR, based on the voltage difference betweenthe first and second drive sense circuits and the resistance of thewired connection between the first drive-sense circuit and the seconddrive-sense circuit. The second load current is determined based on thevoltage difference between the first and third drive sense circuits andthe resistance of the wired connection between the first and third drivesense circuits.

This continues until the xth load current is determined based on thevoltage difference between the first and Yth drive sense circuits andthe resistance of the wired connection between the first and xth drivesense circuits. Having determined the first through xth load currents,the processing module determines I source current being generated by thebattery by summing the first through xth load currents.

FIG. 26B is a schematic block diagram of another embodiment 2603 of abattery sensor system that is interactive with a battery 2010 and aplurality of loads 2020. This diagram is similar to FIG. 26A with atleast one difference being that the battery sensor system includes aplurality of other sensors that sense characteristics of the environmentat and/or around the battery, the wired connection and the plurality ofloads. The other sensors include one or more of a vibration sensor, anacoustic sensor, a pressure sensor, an environmental sensor (e.g.,temperature, moisture, etc.), a global positioning system (GPS) sensor,an accelerometer, and a gyroscope. In an example, the other sensors arein direct contact with one or more of the battery, the wired connection,and the load. As another example, the other sensors are within theenvironment (e.g., same room, same module, coupled to a common structure(e.g., a chassis), etc.) of one or more of the battery, the wiredconnection, and the load.

The other sensors may be operably coupled to the processing module(s) 42via the same connections as the drive sense circuits and/or may have aseparate connection (e.g., different bus, different wire, coupled via aradio frequency identification (RFID) communication, Bluetoothcommunication, or near field communication (NFC), etc.) either wiredand/or wireless to the processing module(s) 42.

FIG. 26C is a schematic block diagram of another embodiment 2605 of abattery sensor system that is interactive with a battery 2010 and aplurality of loads 2020. This diagram is similar to FIG. 26A with atleast one difference being that additional drive sense circuits 28(e.g., 5^(th) and 6^(th) drive sense circuits) are placed throughout thewired connection at points of interest. A point of interest can be anybeginning or end point of a path segment of the wired connection, or anypoint where sensed data improves the accuracy, speed, reliability,amount of data needed, etc. to determine operational status of thebattery sensor system.

In this embodiment, I_source can be derived by determining the voltagesat the first and fifth sensor connection points (e.g., where thedrive-sense circuit connects to the wired connection), and bydetermining the impedance of the wired connection between the first andfifth drive sense circuits 28 connection points as discussed in theprevious Figures. Further, characteristics (e.g., voltage, impedance,current, temperature, etc.) of each section (e.g., portion of the wiredconnection between two drive-sense circuits) may be determined by theprocessing module 42, which allows the processing module 42 to makeadjustments to the battery sensor system based on one or more senseddata.

Based on the sensing information gathered by the drive sense circuits28, the processing module determines overall operating status (e.g.,performance based on comparison of sensed data to desired values of thedata) of the battery 2010, the wired connection, and/or the plurality ofloads 2020. For example, the processing module 42 determines operatingperformance is below a performance threshold when the voltage sensed bythe fourth drive sense circuit 28 is below a voltage threshold. Asanother example, the processing module 42 determines operatingperformance is below a performance threshold when the i_load 2 is abovea current threshold. As another example, the processing module 42determines operating performance is above the performance threshold whenthe impedances on the wired connection stay within an impedance rangethreshold.

In an example, the processing module 42 generates and sends an alert(e.g., to a computing device, to a controller, to another processingmodule, etc.) when the processing module determines operatingperformance is below a performance threshold and/or outside a desiredperformance range.

FIG. 26D is a flowchart illustrating an example of a method ofdetermining currents on a wired connection of a battery sensor system.The method begins or continues with step 2600, where a processing moduleof the battery sensor system determines a first impedance of a firstportion of a wired connection between a battery and a first load of aplurality of loads. The method continues with step 2602, where theprocessing module determines a second impedance of a second portion of awired connection between the battery and a second load of a plurality ofloads.

The method continues with step 2604, where the processing moduledetermines a first current to the first load and a second current to thesecond load based on the first and second impedances and voltages of thefirst and second portions. The method continues with step 2606, wherethe processing module determines a total current from the battery basedon the first and second currents. For example, the processing modulesums the first and second currents to obtain the total current from thebattery.

FIG. 27A is a schematic block diagram of another embodiment of a batterysensor system 2701 that is interactive with a battery 2010, a wiredconnection, and a plurality of loads 2020. This diagram is similar toFIG. 26B with at least one difference being that the battery sensorsystem includes a plurality of selectors 2750 operably coupled to thewired connection between the battery 2010 and the plurality of loads2020. A selector 2750 may be one or more of a single pole, single throw(SPST) switch, a single pole, double throw (SPDT) switch, double pole,single throw (DPST) switch, double pole, double throw (DPDT) switch, apressure switch, a reed switch, a float switch, a trembler switch, keyswitch, a limit switch, a sail switch, a proximity switch, asilicon-controlled rectifier, an analogue switch, a transistor, a logicgate, etc. Note that the selector 2750 may function as an on/off switchor as a dynamic adjustable selector to modify an electricalcharacteristic (e.g., voltage, current, impedance) to a desired range.For example, the processing module provides selector controls to aselector 2750 which causes the selector to reduce a first current by 50%(e.g., from 50 milliamps to 25 milliamps).

In an example of operation, the processing module 42 monitors operationone or more of the battery 2010, the wired connection and the loads2020. The processing module 42 obtains battery, wired connection, load,and/or environment data from the plurality of drive sense circuits 28and the plurality of other sensors. The processing module 42 determinesoperational characteristics (voltage, impedance, current, temperature,etc.) of the battery 2010, the wired connection, and/or loads 2020 basedon the obtained data. Having determined the operational characteristics,the processing module manages operation of the loads (e.g., keeps loadsoperating in desired performance range, keeps battery life withindesired life range, etc.) via selectors 2750.

For example, the processing module 42 determines current i_load 1 is2.254 Amperes (A), which is within a desired operational range of load 1of 1.5 A-3.5 A, and determines current i_load 2 is 2.501, which isoutside a desired operational range of 2.25 A-2.5 A. The processingmodule sends selector controls to selector 2 2750 such that i_load 2 isreduced to a level within the desired operational range. For example,selector 2 includes a resistive ladder circuit and the selector controlscause the resistive ladder to increase resistance, which decreasescurrent i_load 2 to 2.4 A, which is within the desired operationalrange.

In another example, the processing module 42 controls operation of theselectors 2750 to perform load balancing across each of the loads (e.g.,loads 1-3). For example, processing module 42 instructs selectors 1-32750 to provide 2 mA of current for each of i_load 1 through 1_load 3.In another example, the processing module 42 controls operation of theselectors 2750 to perform load balancing across each of the loads (e.g.,loads 1-3). For example, processing module 42 instructs selectors 1-32750 to provide a voltage 3V to each of i_load 1 through 1_load 3. Inanother example, the processing module 42 controls operation of theselectors 2750 to perform load balancing across each of the loads (e.g.,loads 1-3). For example, processing module 42 instructs selectors 1-32750 to an impedance of 1MΩ to each of i_load 1 through 1_load 3.

In another example of operation, the processing module 42 controlsoperation of the selectors 2750 to control operation (e.g., loadbalancing, on/off, cycling, power reduction, etc.) of the loads (e.g.,loads 1-3) based on load priority. For example, load 1 has a firstpriority, load 2 has a second priority, and load 3 has a third priority.The processing module obtains (e.g., generates, receives) priority dataassigned to each load. For example, load 1 is assigned a priority scoreof 55 of a range of 1-100, load 2 is assigned a priority score of 23,and load 3 is assigned a priority score of 77.

The priority may be a scoring system based on one or more of a powerscore, cycling ability score, an importance score, a need factor, ahistoric performance score, an amount of use score, a current score, anda voltage score. For example, the importance score is based on animportance of the load (e.g., for operational performance of a systempowered by the battery (e.g., in a car system, power steering, lidarsensing, etc. being more important than floor lighting, seat warmer,etc. being less important). The cycling ability score is based onwhether the load may be power non-continuously (e.g., intermittently).The historical data score is based on how often the load is consumingpower. The need factor score is based on an immediate need of load tothe system. For example, when the battery sensor system senses anexterior ambient light is above a threshold, need factor of headlightsis reduced. As another example, when the battery sensor system senses atemperature is below a threshold, the need factor for heated mirrors isincreased.

As a specific example, the battery sensor system is within a motorvehicle (e.g., electric vehicle, hybrid vehicle, internal combustingengine vehicle, hydrogen powered vehicle, etc.). The vehicle includes aplurality of loads 2020 powered by battery 2010. The first load is awindshield wiper motor, the second load is a light emitting diode (LED)interior lighting system, and the third load is headlights. The firstload is assigned a priority score of 14 based on a level of importancescore of 20, power requirements score of 15, historical data score of 7and an immediate need of 0.3 based on a priority score function of:

Priority score=(level of importance score+power requirementsscore+historical data score)*immediate need factor score

As such, the first loads' priority score=(20+15+7)*0.3=14. The secondload is assigned a priority score based on a level of importance scoreof 8, power requirements score of 3, historical data score of 44 and animmediate need of 0.1. As such, the second load priority score is(8+3+44)*0.1=5.5. The third load is assigned a priority score based on alevel of importance score of 95, power requirements score of 35,historical data score of 10 and an immediate need of 0.7. As such thesecond load priority score is (95+35+10)*0.7=98

Based on the priority scores, the processing module determines load 3has a higher priority than load 1, and load 1 has a higher priority thanload 2. As such, the processing module controls operation of loads 1-3based on the level of priority of the loads. For example, the processingmodule determines that battery 2010 will not have enough power for thevehicle to maintain its current state (e.g., power consumption) beforethe vehicle arrives at a scheduled recharging/refueling station. Thus,at or during a first time, t1, processing module determines to turn offthe lowest priority load, load 2 to save battery power. Note theprocessing module continues monitoring the operation of the battery andthe loads and may recalculate priority based on one or more of a changeto sensed data, based on a schedule (e.g., every 5 seconds, every 10milliseconds, etc.) and based on receiving a command.

As another example, the processing module 42 determines a temperatureassociated with load 3 is above a temperature threshold and theprocessing module controls the operation of selector 3 to turn load 3off. As yet another example, the processing module cycles power to oneor more loads at an interval. For instance, when load 2 only needs powerintermittently, the processing module controls selector 2 to providepower intermittently (e.g., on for 10 milliseconds (ms), off for 10 ms).

As another specific example, load 1 is a vehicle window heating systemand has a desired operating power need of 120 watts from the battery.Thus load 1 has a power score of 40 on a scale of 0 to 100. Load 1 isassigned an importance score of 20 on a 0-100 scale (e.g., based on atemperature (e.g., sensed by a temperature sensor) being above 45degrees Fahrenheit). The processing module determines the overallpriority score for load 1 based on the importance score and the powersource (e.g., averages, multiplies with a score type coefficient (e.g.,power score weighted higher than importance score), etc.). For example,the processing module determines the priority score is 30 by averagingthe importance and power scores. Continuing with this example, load 2 isvehicle driving lights that has a desired operating power need of 50watts. Thus, load 2 has a power score of 18 on a scale of 0 to 100.

Load 2 is assigned an importance score of 5 on a 0-100 scale (based onvehicle location (from GPS sensor), weather data (received by processingmodule 42), sensed exterior ambient light, and time of day) as theprocessing module determines the vehicle lights won't be needed (e.g.,no tunnels on driving path, time of day 10:14 am, weather sunny, etc.).As such, the processing module determines a priority score of load 2 tobe 11.5. As such, the processing module determines load 1 is of higherpriority than load 2.

Based on the priority, the processing module manages (e.g., controls)performance of the battery and loads. For example, during time t1,i_load 2 and i_load 3 are both outside a desired operational performancerange and load 2 has a higher priority than load 3. Further, theprocessing module determines that current i source cannot be adjusted topower i_load 2 and i_load 3 optimally during t1. However, the processingmodule determines that by turning off one of i_load 3 and i_load 2, theother current will be back inside the desired operational performancerange. Since i_load 2 has the higher priority, the processing moduleturns off (e.g., via selector 3) load 3. Note that the priority maychange from timeframe to timeframe. For example, during time t1 load 2has a higher priority than load 3, and during time t2 load 3 has ahigher priority than load 2.

FIG. 27B is a schematic block diagram of another embodiment 2703 of abattery sensor system that is interactive with a battery 2010, a wiredconnection, and a plurality of loads 2020. This diagram is similar toFIG. 27A with at least one difference being that the battery sensorsystem includes a plurality of fuses 1-x operably coupled to the wiredconnection between the battery and the plurality of loads. Note in oneembodiment, a combination of fuses and selectors are operably coupledwithin the wired connection between the battery and the plurality ofloads.

In an example of operation, the processing module 42 obtains battery,wired connection, load, and environment data/other data (e.g., GPS data,vibration data, etc.) from the plurality of drive sense circuits 28 andthe plurality of other sensors. The processing module 42 determines anerror condition associated with load 2 that indicates load 2 needsreplacement. The processing module 42 sends a fuse control signal to thesecond fuse to blow the fuse. The fuse is then replaced by a repairperson when servicing replacement of load 2. Alternatively, or inaddition to, the fuse is set (e.g., based on physical properties) toblow when a condition occurs (e.g., current above a threshold).

FIG. 27C is a flowchart illustrating an example of a method ofdetermining a load management operation for a plurality of loads in abattery sensor system. The method begins or continues with step 2700,where the processing module of the battery sensor system obtains batteryand load information of the battery sensor system (e.g., battery, load,wired connection, drive sense circuits, environment of the battery,load, etc.). The battery and load information includes one or more of avoltage, an impedance, a current, a temperature, a pressure, a batterylife expectancy, power, battery capability information (full chargedata, current supply capabilities, etc.), load operating parameterinformation (e.g., power needed, rating, etc.).

The method continues with step 2702, where the processing module of thebattery sensor system determines a performance level (e.g., anoperational status, a performance score, etc.) based on the battery andload information. The method continues with step 2704, where theprocessing module determines whether the level of performance comparesfavorably (e.g., over, within range) to a performance threshold. Whenthe level of performance compares favorably, the method continues tostep 2700. When the level of performance compares unfavorably, themethod continues to step 2706, where the processing module determines aload management operation based on the battery and load information. Forexample, the processing module determines the load management operationis to utilize a priority score associated with each load to determinehow to power and prioritize the loads.

The method continues with step 2708, where the processing moduleimplements the load management operation. For example, the processingmodule determines priority scores for each load and determines thepriority of the loads based on the priority scores. The processingmodule then controls operation of the loads in accordance with thepriority scores. For example, the processing module keeps a first amountof voltage on a first load for as long as possible. As another example,the processing module turns off load 2 when detecting an errorcondition. As yet another example, the processing module reduces currentto load 3 when determining load 3 is associated with a lowest priorityscore and loads 1 and 2 need more current to keep within a desiredperformance range during a time period.

FIG. 28A is a schematic block diagram of another embodiment 2801 of abattery sensor system interactive with a plurality of batteries 2010operably coupled via a wired connection to a load 2020. The batterysensor system includes processing module 42 and a plurality of drivesense circuits. The wired connection is illustrated by bolded lines andincludes one or more wires operably coupled to provide a low impedancepath between the plurality of batteries 2010 and the load 2020. Note theterm battery as used herein may indicate a plurality of battery cells, abattery stack (e.g., combination of batteries arranged in series), abattery module (stacks arranged in parallel) and/or a battery cell. As aspecific example, battery 1 2010 is a lead-acid battery that includesplurality of battery cells and battery 2 2010 is a lithium-ion batterymodule that includes 48 lithium-ion batteries, which are arranged in twoparallel stacks of 24 batteries. Note a battery may be any type ofbattery (e.g., lead acid, lithium ion, alkaline, dry cell, lithium air,solid state, zinc carbon, nickel iron, galvanic cell, etc.).

In an example of operation, the drive sense circuits 28 of the batterysensor system sense one or more voltages on the wired connection. Forexample, a first drive sense circuit DSC-1 28 senses a voltage V_B1 at afirst point of the wired connection, a second drive sense circuit DSC-228 senses a voltage V_B2 at a second point of the wired connection, athird drive sense circuit DSC-3 28 senses a voltage V_L at a third pointof the wired connection, and so on up to a “y”th drive sense circuitDSC-Y 28 senses a voltage V_BY at a zth point on the wired connection.

The processing module 42 obtains the voltages (e.g., via a voltagesignal, a digital value representative of a voltage, etc.) from thedrive sense circuits 28 and determines a variance, or voltage drop,between the load and one or more of the batteries. For example, theprocessing module determines the point V_B1 is at 48 volts, the pointV_B2 is at 47.98 volts and determines the point V_L is at 47.2 volts.The processing module 42 determines the variance between point V_B1 andV_L is 0.8 volts, the variance between point V_B2 and V_L is 0.78 volts,and the variance between point V_B1 and V_B2 is 0.02 volts.

The processing module 42 further functions to control operation of thedrive sense circuits 28. For example, the processing modules 42determines and/or provides a voltage reference signal for each drivesense circuit 28 to utilize in determining a voltage at each respectivepoint where the drive sense circuit 28 is operably coupled to the wiredconnection. As a specific example, the processing module 42 estimates avoltage (e.g., based on previous voltage reading, based on a knowndesired voltage (e.g., 48V) in a lookup table, based on time since lastmeasurement, pre-programmed, etc.) at a particular point, and sets thevoltage reference signal of the drive sense circuit 28 to the estimatedvoltage. As another example, the processing module 42 compares thevoltages to one or more voltage thresholds for the batteries and loadand generates and sends (e.g., to a controller (e.g., to change functionof the battery and/or loads), to another processing module, etc.) analert message when a voltage is outside a voltage threshold.

FIG. 28B is a schematic block diagram of another embodiment 2803 of abattery sensor system interactive with a plurality of batteries 2010operably coupled via a wired connection to a load 2020. The batterysensor system includes processing module(s) 42, the wired connection, aselector, a plurality of drive sense circuits 28.

In an example of operation, the processing modules 42 controls operationof batteries 2010 based on sensed data from the drive sense circuits 28that represent the operation of the batteries 2010 and the load 2020.For example, with only battery 1 enabled (e.g., via the selector), theprocessing module determines (e.g., based on signal from a fourth drivesense circuit 28) a voltage V_L is 1.9V, which is below a voltagethreshold of 2.0V. The processing module 42 provides a control signal tothe selector to enable battery 2 (e.g., when battery 1 and 2 are in aseries configuration) to bring the voltage V_L back above the voltagethreshold.

FIG. 28C is a schematic block diagram of another embodiment 2805 of abattery sensor system that is interactive with batteries 2010 and a load2020. This diagram is similar to FIG. 28B with at least one differencebeing that an independent selector is integrated within or operablycoupled to the wired connection for each battery 2010.

FIG. 28D is a schematic block diagram of an embodiment 2807 of a batterysensor system that is interacting with a plurality of batteries 2010, awired connection, and a load 2020. In this example, a fourth drive sensecircuit 28 (e.g., DSC-4) injects a plurality of oscillating signals ontothe wired connection. Other sensor circuits (e.g., drive sense circuit1, drive sense circuit 2, drive sense circuit 3) receive the pluralityof oscillating signals and produce signals representing a frequencyresponse (e.g., magnitude at one or more frequencies) of the pluralityof oscillating signals.

The processing module 42 determines an impedance (e.g., resistance atzero frequency (e.g., direct current value)) of a portion of the wiredconnection based on the frequency response of the plurality ofoscillating signals. For example, the processing module maps a function(e.g., y=mx+b) based on the magnitudes to determine (e.g., estimate(e.g., to 99.9999% accuracy)) a y-intercept magnitude (e.g., 0 Hertz) ofan x-y cartesian coordinate system, where the y axis represents themagnitude and x axis represents a frequency in Hertz of the oscillatingsignals. Thus, the estimated impedance of a portion of the wiredconnection at 0 Hertz is substantially equal to a resistance of theportion of the wired connection, which is determined without adding anyresistive element on the wired connection between a battery and a load.Being able to determine voltage, current and impedance of a portion ofthe wired connection between the bather and the load without adding theresistive element, increases the battery performance, battery life, heatdissipation, cost, etc. of the battery and/or loads. Further, the drivesense circuits' ability to sense microvolts, nanovolts or smallerchanges with a low power drive signal increases the accuracy of sensingand thus the performance of the battery based on more accurate charging,discharging, which reduces the likelihood of an overcharge, anundercharge and other battery damaging events. Further this increasesthe performance of the load as the optimal power can be delivered to theload resulting in less power wasted, longer load run times per batterycharge, and increased life expectancy of the load.

FIG. 28E is a flowchart illustrating an example of a method ofdetermining operational status of a battery sensor system that includesa plurality of drive sense circuits 28, one or more processing modules42, one or more batteries 2010, a load 2020, and a wired connectionbetween the batteries 2010 and the load 2020. The method begins orcontinues with step 2800, where a first drive sense circuit of theplurality of drive sense circuits senses a first voltage at a firstpoint of the wired connection, which is proximate to a first battery ofthe plurality of batteries.

The method continues with step 2802, where a second drive sense circuitof the plurality of drive sense circuits senses a second voltage at asecond point of the wired connection, which is proximate to a secondbattery of the plurality of batteries. The method continues with step2804, where a third drive sense circuit of the plurality of drive sensecircuits senses a third voltage at a third point of the wiredconnection, which is proximate to the load.

The method continues with step 2806, where a processing module of theone or more processing modules determines operational status of thebatteries and/or load based on one or more of the first, second andthird voltages. The operational status includes one or more of a voltagelevel, a voltage variance, an estimated battery health (e.g., amount ofcharge remaining, percentage of total charge, operating temperature,etc.), and an estimated timeframe that the batteries are configured topower the load under current conditions.

The method continues to step 2808, where the processing moduledetermines whether the operational status compares unfavorably to aperformance threshold (low voltage threshold, voltage threshold range,high voltage threshold, estimate battery life threshold, etc.). Forexample, the processing module determines a voltage of 39.98V proximatethe first battery is below a low voltage threshold (e.g., 40 V) for thebattery. As another example, the processing module determines a voltagevariance (e.g., 0.000012V) between a first point and a second point ofthe wired connection is below a voltage variance threshold (e.g.,0-0.00002V).

When the operational status compares unfavorably, the method continuesto step 2810, where the processing module generates and sends an alertmessage to a controller and/or other processing module regarding theoperational status issue (e.g., comparing unfavorably (e.g., 39.98V<40V)). When the operational status compares favorably, the methodcontinues back to step 2800. For example, the processing moduledetermines the voltage variance in within the voltage variance threshold(e.g., compares favorably). As another example, the processing moduledetermines a battery health (e.g., charge) is low and sends an alertmessage indicating the battery will need charging within a timeframebased on current conditions.

FIG. 29A is a schematic block diagram of another embodiment 2901 ofbattery sensor system interactive with a plurality of batteries 2010operably coupled via a wired connection to a load 2020. The batterysensor system includes processing module(s) 42 and a plurality of drivesense circuits 28.

In an example of operation, the battery sensor system determines thecurrents (e.g., I_batt 1, I_batt 2, I_load, etc.) flowing on the wiredconnection based on the voltages sensed (e.g., in FIG. 28A) and theresistance (e.g., based on the impedances determined (e.g., in FIG. 28D)on the wired connection. The first battery current is determined inaccordance with Ohm's law V=IR, based on the voltage difference betweenthe first and third drive sense circuits and the resistance of the wiredconnection between the first drive sense circuit 28 and the third drivesense circuit 28. The second battery current is determined based on thevoltage difference between the second and third drive sense circuits 28and the resistance of the wired connection between the second and thirddrive sense circuits 28.

This continues until the yth battery current is determined based on thevoltage difference between the third and yth drive sense circuits andthe resistance of the wired connection between the third and yth drivesense circuits. Having determined the first through yth batterycurrents, the processing module determines I_load current beinggenerated by the batteries by summing the first and yth batterycurrents.

FIG. 29B is a schematic block diagram of another embodiment 2903 ofbattery sensor system interactive with a plurality of batteries operablycoupled via a wired connection to a load. The battery sensor systemincludes processing module(s) 42 and a plurality of drive-sensecircuits. This diagram is similar to FIG. 29A with at least onedifference being that additional drive-sense circuits (e.g., a fourthand fifth drive-sense circuit) are placed throughout the wiredconnection at points of interest. A point of interest can be anybeginning or end point of a path segment of the wired connection, or anypoint where sensed data improves the accuracy, speed, amount of dataneeded, etc. to determine operational status of the battery sensorsystem. For example, the placement of drive-sense circuit 5 allowsdetermination of i batt 2 in conjunction with drive-sense circuit 2. Asanother example, the placement of drive-sense circuit 4 allows fordetermination of i_load in conjunction with drive-sense circuit 3.

FIG. 29C is a flowchart illustrating an example of another method ofdetermining currents on a wired connection of a battery sensor system.The method begins or continues with step 2900, where the battery sensorsystem determines a first impedance of a first portion of a wiredconnection between a load and a first battery of a plurality ofbatteries. The method continues with step 2902, where the battery sensorsystem determines a second impedance of a second portion of a wiredconnection between the load and a second battery of the plurality ofbatteries.

The method continues with step 2904, where the processing moduledetermines a first current to the load and a second current to the loadbased on the first and second impedances and voltages of the first andsecond portions. The method continues with step 2906, where theprocessing module determines a load current from the first and secondbatteries based on the first and second currents. For example, theprocessing module sums the first and second currents to obtain the loadcurrent from the first and second batteries.

FIG. 30A is a schematic block diagram of another embodiment 3001 ofbattery sensor system interactive with a plurality of batteries 2010operably coupled via a wired connection to a load 2020. The batterysensor system includes processing module 42, a selector and a pluralityof drive sense circuits 28. Note that each drive sense circuit may havea separate connection to the processing module or may share aconnection. In this example, the battery sensor system manages batteryoperation to power the load via one selector on the wired connectionsuch that current is enabled from a battery 2010 of batteries 1-y to theload 2020. Note for ease of illustration, a parallel configuration ofbatteries is shown, however, a battery or batteries in all embodimentsmay be implicitly in one or more of an independent, series and/orparallel combination.

In an example of operation, the processing module determines a loadcurrent is 2.1 amps. The processing module further determines that for atimeframe t2, a load current of 3 amps is needed. As such, theprocessing module sets the selector controls to produce an i load fromthe plurality of batteries to be substantially 3 amps.

FIG. 30B is a schematic block diagram of another embodiment 3003 ofbattery sensor system interactive with a plurality of battery cellsoperably coupled via a wired connection to a load 2020. The wiredconnection includes a battery bus 3005. Each battery cell has acontrolled fuse and current regulator circuit, which may be a siliconcontrolled rectifier, relay and fuse, or other circuit (e.g., selector)that is configured to control (e.g., reduce, stop) current on the wiredconnection.

In an example of operation, the drive sense circuits 28 sense electricalcharacteristics of the wired connection and provide signalsrepresentative of the characteristics to the processing module 42 forprocessing. The processing module 42 determines operational status(voltages of battery cells, current from each battery cell, temperatureof wired connection portion, etc.) of the battery sensor system based onthe processed signals. For example, the processing module determinesthat a portion (e.g., between two drive-sense circuits) of the wiredconnection has changed temperature based on a same current but differentvoltage (e.g., mV difference, nanovolt difference, etc.) being sensedfrom time t1 to time t2. As another example, the processing moduledetermines the load can be adequately powered using 3 cells (e.g., loadneeds 3 A minimum and each cells provides up to 1.5 A such that the 3cells provide up to 4.5 A of current to the load).

Having determined the operational status, the processing module 42controls (via fuse controls) which battery cells are utilized to drivethe load 2020 via a controlled fuse circuit. For example, the processingmodule rotates 3 cells on at time t1 (e.g., battery cell 1, 3 and 5),and battery cell 2, 4, and 6 for time t2. This can decrease thelikelihood a battery cell will need to be cooled or will overheat asadjacent cells are not on concurrently, and thus do not transfer heat toone another.

FIG. 30C is a schematic block diagram of another embodiment 3007 of abattery sensor system interactive with a plurality of battery cells 1-5and a load 2020. The battery sensor system includes processing module42, a plurality of controlled fuse and current regulator circuits and aplurality of drive sense circuits 28.

In an example of operation, the processing module 42 of the batterysensor system determines that battery cell 1 has an issue. The issueincludes one or more of an undesired (e.g., outside threshold range)temperature, voltage, current, and impedance of wired connectionconnecting to battery cell 1, the battery cell not needed during atimeframe to power the load, determining to turn off the battery cellaccording to a set rotation scheme, and receiving a command to turn offthe battery cell. In this example, the battery sensor system determinesthe issue is a voltage (e.g., sensed by drive sense circuit DSC-A1proximate to battery cell 1) is below a voltage threshold. Havingdetermined the issue, the battery sensor system removes battery cell 1from driving the load via the controlled fuse and current regulatorcircuit. The processing module 42 may further generate a messageindicating the voltage issue and send the message to another processingmodule 42 or computing device (e.g., associated with control of batterycell 1, user computing device associated with ownership of device thatincludes battery cell 1, etc.).

FIG. 30D is a schematic block diagram of another embodiment 3011 of abattery sensor system interactive with a plurality of battery cellsoperably coupled to a load or loads 2020 via a wired connection. Thebattery sensor system includes processing module(s) 42, a plurality ofselectors 1-x, a plurality of drive sense circuits 28, and a pluralityof batteries 1-x. Each battery includes a plurality of battery cells inseries. For example, battery 1 includes battery cell 1-1, battery cell1-2, battery cell 1-3, and battery cell 1-4 in series. A battery bus3005 of the wired connection couples the batteries 1-x in parallel todrive the load 2020.

In an example of operation, the processing module 42 receives sensorsignals from the plurality of drive sense circuits A-B. The sensorsignals represent one or more of a sensed voltage, a frequency responsemagnitude, a current, and a temperature on the wired connection. Theprocessing module also receives system data. The system data mayindicate operating parameters for a battery 1-x, a battery cell, and aload 2020, and battery layout information (e.g., how the batteries arearranged and location within a structure), battery coolant information(type of cooling system, capabilities of cooling system, direction ofcoolant flow, etc.), battery type (e.g., lead-acid, lithium ion, etc.),and expected environmental parameters (e.g., in liquid, expectedtemperature, etc.). The processing module 42 is configured to modifyselector and/or sensor controls (ctrls) based on the sensor signals andthe system data to manage battery use and life.

FIG. 30E is a schematic block diagram of another embodiment 3013 of abattery sensor system interactive with a plurality of batteries 1-xoperably coupled via a wired connection to a load 2020. The wiredconnection includes battery bus 3005. A first battery 1 includes batterycells 1-1 through 1-4, a second battery includes battery cells 2-1through 2-4, and so on up to a xth battery includes battery cells x-1through x-4. Note from battery to battery the number of battery cellsmay vary. The battery sensor system includes processing module(s) 42, aplurality of sensors (e.g., drive sense circuits 28 and other sensors)placed throughout the wired connection and the environment of thebatteries 1-x, wired connection and/or loads 2020.

In this example, the processing module 42 determines based on sensorsignals and system data, that cell 2-1 has a voltage that is below asecond desired voltage range, and cells 2-2 and 2-3 have a voltage thatis above the second desired voltage range, but below a first desiredvoltage range. The processing module 42 further determines thattemperature data from other sensor 2 indicates the temperature ofbattery 2 is over a first desired temperature range. As such, theprocessing module determines a load management operation to bring thebattery back within optimal desired operation. For example, theprocessing module determines to rotate battery 2 out from powering theload (e.g., via selector 2) the next 3 timeframes in order to cool thebattery. As another example, the processing module generates and sends acharge message to a controller computing device to charge battery 2 tobring cell voltages back within the first desired voltage range. Thecharge message may include any information the processing module hasregarding battery 2 (e.g., historic sensor data, last sensed voltage,last sensed temperature, etc.).

FIG. 30F is a schematic block diagram of an embodiment 3015 of a batterysensor system interactive with a plurality of batteries 2010 operablycoupled via a wired connection to a plurality of loads 2020. In thisembodiment, the processing module 42 controls operation of the loads2020 and the batteries 2010 via selector circuits to maintain oroptimize operational performance, life, and/or efficiency of thebatteries and/or loads. The processing module 42 also controls operationof the drive sense circuits 28 via sensor controls (e.g., setting drivesense circuit reference signals).

FIG. 30G is a flowchart illustrating an example of a method of batterycell management in a battery sensor system. The method begins orcontinues with step 3000, where a processing module of the batterysensor system obtains sensor data regarding battery and load informationof the battery sensor system (e.g., battery, load, wired connection,drive sense circuits, environment of the battery, load, etc.). Thesensor data includes one or more of a voltage, an impedance, a current,magnitude at a frequency data, a temperature, a pressure, a battery lifeexpectancy, power, battery capability information (full charge data,current supply capabilities, etc.), and load operating parameterinformation (e.g., power needed, rating, etc.).

The method continues with step 3002, where the processing module of thebattery sensor system determines a performance level (e.g., a batteryoperational status, a battery performance score, etc.) of a batterybased on the battery and load information. The method continues withstep 3004, where the processing module determines whether the level ofperformance compares favorably (e.g., over, within range) to aperformance threshold. When the level of performance compares favorably(e.g., voltage level of a battery above a voltage threshold), the methodcontinues to step 3000. When the level of performance comparesunfavorably (e.g., voltage level of a battery below a voltagethreshold), the method continues to step 3006, where the processingmodule determines a battery cell management operation based on theperformance level and/or the battery and load information. The batterycell management operation includes one or more of battery cell stack(e.g., series) rotation, turning a battery cell/stack on, turning abattery cell/stack off, adding a new battery cell/stack to existingbattery cell/stack, etc.

For example, the processing module determines the battery cellmanagement operation is to utilize rotating battery cell stack schemesuch that adjacent battery cell stacks are not on during the sametimeframe to reduce overheating issues. As another example, theprocessing module determines the battery cell management operation is toremove a battery cell stack from driving the load when the battery cellstack has a voltage below a voltage threshold. As another example, theprocessing module determines to rotate battery cell stacks to even outremaining charge across the battery cell stacks. As yet another example,the processing module determines the battery cell management operationis to add a battery cell stack for driving the load when the load needaddition current.

Having determined the battery cell management operation, the methodcontinues at step 3008, where the processing module implements thebattery cell management operation. For example, the processing modulegenerates selector controls to cause a battery cell stack to be removedfrom driving the load during timeframe t1.

As used in the preceding figures, a drive sense circuit has the generalreference number of 28. When, in a particular figure, the drive sensecircuit's reference number has a suffix (e.g., -a, -b, -c, etc.), thereference number with a suffix is referring to a specific embodiment ofa drive sense circuit. A specific embodiment of a drive sense circuitincludes some or all of the features and/or functions of drive sensecircuits having no suffix to its reference number. Further, when a drivesense circuit has a suffix with a letter and a number, this isrepresentative of different sub-embodiments of an embodiment of thedrive sense circuit. The same applies for other components in thefigures that have a reference number with a suffix.

It is noted that terminologies as may be used herein such as bit stream,stream, signal sequence, etc. (or their equivalents) have been usedinterchangeably to describe digital information whose contentcorresponds to any of a number of desired types (e.g., data, video,speech, text, graphics, audio, etc. any of which may generally bereferred to as ‘data’).

As may be used herein, the terms “substantially” and “approximately”provides an industry-accepted tolerance for its corresponding termand/or relativity between items. For some industries, anindustry-accepted tolerance is less than one percent and, for otherindustries, the industry-accepted tolerance is 10 percent or more. Otherexamples of industry-accepted tolerance range from less than one percentto fifty percent. Industry-accepted tolerances correspond to, but arenot limited to, component values, integrated circuit process variations,temperature variations, rise and fall times, thermal noise, dimensions,signaling errors, dropped packets, temperatures, pressures, materialcompositions, and/or performance metrics. Within an industry, tolerancevariances of accepted tolerances may be more or less than a percentagelevel (e.g., dimension tolerance of less than +/−1%). Some relativitybetween items may range from a difference of less than a percentagelevel to a few percent. Other relativity between items may range from adifference of a few percent to magnitude of differences.

As may also be used herein, the term(s) “configured to”, “operablycoupled to”, “coupled to”, and/or “coupling” includes direct couplingbetween items and/or indirect coupling between items via an interveningitem (e.g., an item includes, but is not limited to, a component, anelement, a circuit, and/or a module) where, for an example of indirectcoupling, the intervening item does not modify the information of asignal but may adjust its current level, voltage level, and/or powerlevel. As may further be used herein, inferred coupling (i.e., where oneelement is coupled to another element by inference) includes direct andindirect coupling between two items in the same manner as “coupled to”.

As may even further be used herein, the term “configured to”, “operableto”, “coupled to”, or “operably coupled to” indicates that an itemincludes one or more of power connections, input(s), output(s), etc., toperform, when activated, one or more its corresponding functions and mayfurther include inferred coupling to one or more other items. As maystill further be used herein, the term “associated with”, includesdirect and/or indirect coupling of separate items and/or one item beingembedded within another item.

As may be used herein, the term “compares favorably”, indicates that acomparison between two or more items, signals, etc., indicates anadvantageous relationship that would be evident to one skilled in theart in light of the present disclosure, and based, for example, on thenature of the signals/items that are being compared. As may be usedherein, the term “compares unfavorably”, indicates that a comparisonbetween two or more items, signals, etc., fails to provide such anadvantageous relationship and/or that provides a disadvantageousrelationship. Such an item/signal can correspond to one or more numericvalues, one or more measurements, one or more counts and/or proportions,one or more types of data, and/or other information with attributes thatcan be compared to a threshold, to each other and/or to attributes ofother information to determine whether a favorable or unfavorablecomparison exists. Examples of such an advantageous relationship caninclude: one item/signal being greater than (or greater than or equalto) a threshold value, one item/signal being less than (or less than orequal to) a threshold value, one item/signal being greater than (orgreater than or equal to) another item/signal, one item/signal beingless than (or less than or equal to) another item/signal, oneitem/signal matching another item/signal, one item/signal substantiallymatching another item/signal within a predefined or industry acceptedtolerance such as 1%, 5%, 10% or some other margin, etc. Furthermore,one skilled in the art will recognize that such a comparison between twoitems/signals can be performed in different ways. For example, when theadvantageous relationship is that signal 1 has a greater magnitude thansignal 2, a favorable comparison may be achieved when the magnitude ofsignal 1 is greater than that of signal 2 or when the magnitude ofsignal 2 is less than that of signal 1. Similarly, one skilled in theart will recognize that the comparison of the inverse or opposite ofitems/signals and/or other forms of mathematical or logical equivalencecan likewise be used in an equivalent fashion. For example, thecomparison to determine if a signal X>5 is equivalent to determining if−X<−5, and the comparison to determine if signal A matches signal B canlikewise be performed by determining -A matches -B or not(A) matchesnot(B). As may be discussed herein, the determination that a particularrelationship is present (either favorable or unfavorable) can beutilized to automatically trigger a particular action. Unless expresslystated to the contrary, the absence of that particular condition may beassumed to imply that the particular action will not automatically betriggered. In other examples, the determination that a particularrelationship is present (either favorable or unfavorable) can beutilized as a basis or consideration to determine whether to perform oneor more actions. Note that such a basis or consideration can beconsidered alone or in combination with one or more other bases orconsiderations to determine whether to perform the one or more actions.In one example where multiple bases or considerations are used todetermine whether to perform one or more actions, the respective basesor considerations are given equal weight in such determination. Inanother example where multiple bases or considerations are used todetermine whether to perform one or more actions, the respective basesor considerations are given unequal weight in such determination.

As may be used herein, one or more claims may include, in a specificform of this generic form, the phrase “at least one of a, b, and c” orof this generic form “at least one of a, b, or c”, with more or lesselements than “a”, “b”, and “c”. In either phrasing, the phrases are tobe interpreted identically. In particular, “at least one of a, b, and c”is equivalent to “at least one of a, b, or c” and shall mean a, b,and/or c. As an example, it means: “a” only, “b” only, “c” only, “a” and“b”, “a” and “c”, “b” and “c”, and/or “a”, “b”, and “c”.

As may also be used herein, the terms “processing module”, “processingcircuit”, “processor”, “processing circuitry”, and/or “processing unit”may be a single processing device or a plurality of processing devices.Such a processing device may be a microprocessor, micro-controller,digital signal processor, microcomputer, central processing unit, fieldprogrammable gate array, programmable logic device, state machine, logiccircuitry, analog circuitry, digital circuitry, and/or any device thatmanipulates signals (analog and/or digital) based on hard coding of thecircuitry and/or operational instructions. The processing module,module, processing circuit, processing circuitry, and/or processing unitmay be, or further include, memory and/or an integrated memory element,which may be a single memory device, a plurality of memory devices,and/or embedded circuitry of another processing module, module,processing circuit, processing circuitry, and/or processing unit. Such amemory device may be a read-only memory, random access memory, volatilememory, non-volatile memory, static memory, dynamic memory, flashmemory, cache memory, and/or any device that stores digital information.Note that if the processing module, module, processing circuit,processing circuitry, and/or processing unit includes more than oneprocessing device, the processing devices may be centrally located(e.g., directly coupled together via a wired and/or wireless busstructure) or may be distributedly located (e.g., cloud computing viaindirect coupling via a local area network and/or a wide area network).Further note that if the processing module, module, processing circuit,processing circuitry and/or processing unit implements one or more ofits functions via a state machine, analog circuitry, digital circuitry,and/or logic circuitry, the memory and/or memory element storing thecorresponding operational instructions may be embedded within, orexternal to, the circuitry comprising the state machine, analogcircuitry, digital circuitry, and/or logic circuitry. Still further notethat, the memory element may store, and the processing module, module,processing circuit, processing circuitry and/or processing unitexecutes, hard coded and/or operational instructions corresponding to atleast some of the steps and/or functions illustrated in one or more ofthe Figures. Such a memory device or memory element can be included inan article of manufacture.

One or more embodiments have been described above with the aid of methodsteps illustrating the performance of specified functions andrelationships thereof. The boundaries and sequence of these functionalbuilding blocks and method steps have been arbitrarily defined hereinfor convenience of description. Alternate boundaries and sequences canbe defined so long as the specified functions and relationships areappropriately performed. Any such alternate boundaries or sequences arethus within the scope and spirit of the claims. Further, the boundariesof these functional building blocks have been arbitrarily defined forconvenience of description. Alternate boundaries could be defined aslong as the certain significant functions are appropriately performed.Similarly, flow diagram blocks may also have been arbitrarily definedherein to illustrate certain significant functionality.

To the extent used, the flow diagram block boundaries and sequence couldhave been defined otherwise and still perform the certain significantfunctionality. Such alternate definitions of both functional buildingblocks and flow diagram blocks and sequences are thus within the scopeand spirit of the claims. One of average skill in the art will alsorecognize that the functional building blocks, and other illustrativeblocks, modules and components herein, can be implemented as illustratedor by discrete components, application specific integrated circuits,processors executing appropriate software and the like or anycombination thereof.

In addition, a flow diagram may include a “start” and/or “continue”indication. The “start” and “continue” indications reflect that thesteps presented can optionally be incorporated in or otherwise used inconjunction with one or more other routines. In addition, a flow diagrammay include an “end” and/or “continue” indication. The “end” and/or“continue” indications reflect that the steps presented can end asdescribed and shown or optionally be incorporated in or otherwise usedin conjunction with one or more other routines. In this context, “start”indicates the beginning of the first step presented and may be precededby other activities not specifically shown. Further, the “continue”indication reflects that the steps presented may be performed multipletimes and/or may be succeeded by other activities not specificallyshown. Further, while a flow diagram indicates a particular ordering ofsteps, other orderings are likewise possible provided that theprinciples of causality are maintained.

The one or more embodiments are used herein to illustrate one or moreaspects, one or more features, one or more concepts, and/or one or moreexamples. A physical embodiment of an apparatus, an article ofmanufacture, a machine, and/or of a process may include one or more ofthe aspects, features, concepts, examples, etc. described with referenceto one or more of the embodiments discussed herein. Further, from figureto figure, the embodiments may incorporate the same or similarly namedfunctions, steps, modules, etc. that may use the same or differentreference numbers and, as such, the functions, steps, modules, etc. maybe the same or similar functions, steps, modules, etc. or differentones.

While the transistors in the above described figure(s) is/are shown asfield effect transistors (FETs), as one of ordinary skill in the artwill appreciate, the transistors may be implemented using any type oftransistor structure including, but not limited to, bipolar, metal oxidesemiconductor field effect transistors (MOSFET), N-well transistors,P-well transistors, enhancement mode, depletion mode, and zero voltagethreshold (VT) transistors.

Unless specifically stated to the contra, signals to, from, and/orbetween elements in a figure of any of the figures presented herein maybe analog or digital, continuous time or discrete time, and single-endedor differential. For instance, if a signal path is shown as asingle-ended path, it also represents a differential signal path.Similarly, if a signal path is shown as a differential path, it alsorepresents a single-ended signal path. While one or more particulararchitectures are described herein, other architectures can likewise beimplemented that use one or more data buses not expressly shown, directconnectivity between elements, and/or indirect coupling between otherelements as recognized by one of average skill in the art.

The term “module” is used in the description of one or more of theembodiments. A module implements one or more functions via a device suchas a processor or other processing device or other hardware that mayinclude or operate in association with a memory that stores operationalinstructions. A module may operate independently and/or in conjunctionwith software and/or firmware. As also used herein, a module may containone or more sub-modules, each of which may be one or more modules.

As may further be used herein, a computer readable memory includes oneor more memory elements. A memory element may be a separate memorydevice, multiple memory devices, or a set of memory locations within amemory device. Such a memory device may be a read-only memory, randomaccess memory, volatile memory, non-volatile memory, static memory,dynamic memory, flash memory, cache memory, a quantum register or otherquantum memory and/or any other device that stores data in anon-transitory manner. Furthermore, the memory device may be in a formof a solid-state memory, a hard drive memory or other disk storage,cloud memory, thumb drive, server memory, computing device memory,and/or other non-transitory medium for storing data. The storage of dataincludes temporary storage (i.e., data is lost when power is removedfrom the memory element) and/or persistent storage (i.e., data isretained when power is removed from the memory element). As used herein,a transitory medium shall mean one or more of: (a) a wired or wirelessmedium for the transportation of data as a signal from one computingdevice to another computing device for temporary storage or persistentstorage; (b) a wired or wireless medium for the transportation of dataas a signal within a computing device from one element of the computingdevice to another element of the computing device for temporary storageor persistent storage; (c) a wired or wireless medium for thetransportation of data as a signal from one computing device to anothercomputing device for processing the data by the other computing device;and (d) a wired or wireless medium for the transportation of data as asignal within a computing device from one element of the computingdevice to another element of the computing device for processing thedata by the other element of the computing device. As may be usedherein, a non-transitory computer readable memory is substantiallyequivalent to a computer readable memory. A non-transitory computerreadable memory can also be referred to as a non-transitory computerreadable storage medium.

One or more functions associated with the methods and/or processesdescribed herein can be implemented via a processing module thatoperates via the non-human “artificial” intelligence (AI) of a machine.Examples of such AI include machines that operate via anomaly detectiontechniques, decision trees, association rules, expert systems and otherknowledge-based systems, computer vision models, artificial neuralnetworks, convolutional neural networks, support vector machines (SVMs),Bayesian networks, genetic algorithms, feature learning, sparsedictionary learning, preference learning, deep learning and othermachine learning techniques that are trained using training data viaunsupervised, semi-supervised, supervised and/or reinforcement learning,and/or other AI. The human mind is not equipped to perform such AItechniques, not only due to the complexity of these techniques, but alsodue to the fact that artificial intelligence, by its verydefinition—requires “artificial” intelligence—i.e., machine/non-humanintelligence.

One or more functions associated with the methods and/or processesdescribed herein can be implemented as a large-scale system that isoperable to receive, transmit and/or process data on a large-scale. Asused herein, a large-scale refers to a large number of data, such as oneor more kilobytes, megabytes, gigabytes, terabytes or more of data thatare received, transmitted and/or processed. Such receiving, transmittingand/or processing of data cannot practically be performed by the humanmind on a large-scale within a reasonable period of time, such as withina second, a millisecond, microsecond, a real-time basis or other highspeed required by the machines that generate the data, receive the data,convey the data, store the data and/or use the data.

One or more functions associated with the methods and/or processesdescribed herein can require data to be manipulated in different wayswithin overlapping time spans. The human mind is not equipped to performsuch different data manipulations independently, contemporaneously, inparallel, and/or on a coordinated basis within a reasonable period oftime, such as within a second, a millisecond, microsecond, a real-timebasis or other high speed required by the machines that generate thedata, receive the data, convey the data, store the data and/or use thedata.

One or more functions associated with the methods and/or processesdescribed herein can be implemented in a system that is operable toelectronically receive digital data via a wired or wirelesscommunication network and/or to electronically transmit digital data viaa wired or wireless communication network. Such receiving andtransmitting cannot practically be performed by the human mind becausethe human mind is not equipped to electronically transmit or receivedigital data, let alone to transmit and receive digital data via a wiredor wireless communication network.

One or more functions associated with the methods and/or processesdescribed herein can be implemented in a system that is operable toelectronically store digital data in a memory device. Such storagecannot practically be performed by the human mind because the human mindis not equipped to electronically store digital data.

One or more functions associated with the methods and/or processesdescribed herein may operate to cause an action by a processing moduledirectly in response to a triggering event—without any intervening humaninteraction between the triggering event and the action. Any suchactions may be identified as being performed “automatically”,“automatically based on” and/or “automatically in response to” such atriggering event. Furthermore, any such actions identified in such afashion specifically preclude the operation of human activity withrespect to these actions—even if the triggering event itself may becausally connected to a human activity of some kind.

While particular combinations of various functions and features of theone or more embodiments have been expressly described herein, othercombinations of these features and functions are likewise possible. Thepresent disclosure is not limited by the particular examples disclosedherein and expressly incorporates these other combinations.

What is claimed is:
 1. A battery sensor system comprising: a batteryoperably coupled to a plurality of loads via a wired connection,wherein: a first load of the plurality of loads is operably coupled to aterminal of the battery via a first portion of the wired connection; anda second load of the plurality of loads is operably coupled to theterminal of the battery via a second portion of the wired connection; afirst drive sense circuit operably coupled to a first point that iscommon to the first portion and the second portion and that is proximateto the battery, wherein, when enabled, the first drive sense circuit isconfigured to: sense a first voltage corresponding to the first point; asecond drive sense circuit operably coupled to a second point of thewired connection that is proximate to the first load of the plurality ofloads, wherein, when enabled, the second drive sense circuit isconfigured to: sense a second voltage corresponding to the second point,wherein the second voltage is different than the first voltage based ona first impedance of the wired connection between the first point andthe second point; a third drive sense circuit coupled to a third pointof the wired connection that is proximate to the second load of theplurality of loads, wherein, when enabled, the third drive sense circuitis configured to: sense a third voltage corresponding to the thirdpoint, wherein the third voltage is different than the first voltagebased on a second impedance of the wired connection between the firstpoint and the third point; memory that stores operational instructions;and one or more processing modules operably coupled to the first drivesense circuit, the second drive sense circuit, and the third drive sensecircuit, wherein, when enabled, the one or more processing modules areconfigured to execute the operational instructions to: process the firstvoltage, the second voltage, and the third voltage to determineoperational status of the battery sensor system.
 2. The battery sensorsystem of claim 1 further comprises: a fourth drive sense circuitoperably coupled to a fourth point of the wired connection that isproximate to a third load of the plurality of loads, wherein, whenenabled, the fourth drive sense circuit is configured to: sense a fourthvoltage corresponding to the fourth point, wherein the fourth voltage isdifferent than the first voltage based on a third impedance of the wiredconnection between the first point and the fourth point.
 3. The batterysensor system of claim 1 further comprises: a fourth drive sense circuitoperably coupled to a fourth point of the wired connection, wherein thefourth point is proximate to a split in the wired connection.
 4. Thebattery sensor system of claim 1, wherein the one or more processingmodules are further configured to: determine a voltage variance betweenthe battery and the first load based on the first and second voltagessensed on the first and second points.
 5. The battery sensor system ofclaim 1, wherein the one or more processing modules are furtherconfigured to: determine a voltage variance between the battery and thesecond load based on the voltage sensed on the first and third points.6. The battery sensor system of claim 1, wherein the one or moreprocessing modules are further configured to: determine a voltagevariance between the first load and the second load based on the voltagesensed on the second and third points.
 7. The battery sensor system ofclaim 1, wherein the first drive sense circuit further comprising: anoperational amplifier having a first input, a second input, and anoutput, wherein the first input is coupled via a line to the wiredconnection to sense the first voltage, the second input is coupled toreceive a voltage reference signal, and the output produces a comparisonsignal; and a dependent current source operably coupled to the output ofthe operational amplifier to receive the comparison signal and produce aregulation signal, wherein the regulation signal is provided to the lineto keep the first voltage substantially the same as the voltagereference signal.
 8. The battery sensor system of claim 7, wherein theone or more processing modules generates the voltage reference signal toinclude a direct current component.
 9. The battery sensor system ofclaim 7, wherein the one or more processing modules generates thevoltage reference signal to include an alternating current component.10. The battery sensor system of claim 9, wherein the one or moreprocessing modules is further configured to: determine a sampling ratefor determining the first voltage; and generating the alternatingcurrent component to have a frequency corresponding to the samplingrate.
 11. The battery sensor system of claim 1, wherein the operationalstatus includes one or more of: a voltage level of the battery; avoltage level of a respective load of the plurality of loads; a voltagevariance between two sensed voltages; and an estimated timeframe thatthe battery is configured to power one or more of the plurality of loadsunder one or more of: present conditions and expected conditions. 12.The battery sensor system of claim 1, wherein the one or more processingmodules is further configured to: determine whether the operationalstatus compares favorably to an operational threshold; when theoperational status does not compare favorably: determine an operationstatus issue for or more of the battery, the wired connection, and aload of the plurality of loads; generate an alert message regarding theoperation status issue; and output the alert message to anotherprocessing module or a computing device of the battery sensor system.13. The battery sensor system of claim 1, wherein the one or moreprocessing modules is further configured to: determine whether theoperational status compares favorably to an operational threshold; whenthe operational status does not compare favorably: determine anoperation status issue for one or more of the battery, the wiredconnection, and a load of the plurality of loads based on one or more ofthe first voltage, the second voltage, and the third voltage; implementan operation status fix process based on the operational status issue;generate a modify operation message; and send the modify operationmessage to a controller associated with one or more of the battery, thefirst load, and the second load, such that the controller implements theoperation status fix process to resolve the operational status issue.14. The battery sensor system of claim 13, wherein the operation statusfix process includes one or more of: modifying operation of the battery;modifying operation of the first load; and modifying operation of thesecond load.
 15. The battery sensor system of claim 1, wherein the oneor more processing modules is further configured to: send a referencesignal to the first drive sense circuit, wherein the reference signal isbased on an estimate of the first voltage at the first point.
 16. Thebattery sensor system of claim 15, wherein the first drive sense circuitis further configured to: generate a signal based on the referencesignal received from the one or more processing modules; provide thesignal to the first point; and generate an output signal thatcorresponds to a difference between the signal and the reference signal.17. The battery sensor system of claim 16, wherein the one or moreprocessing modules is further configured to: receive the output signal;tune the reference signal based on the output signal until the signalcompares favorably to the first voltage at the first point along thewired connection that is proximate to the terminal of the batterythereby generating a tuned reference signal; and determine the firstvoltage at the first point along the wired connection that is proximateto the terminal of the battery based on the tuned reference signal. 18.The battery sensor system of claim 16, wherein the first drive sensecircuit further comprises: an analog to digital converter configured to:receive the output signal; generate a digital representation of theoutput signal; and provide the digital representation of the outputsignal to the one or more processing modules for subsequent processing.19. The battery sensor system of claim 18, wherein the one or moreprocessing modules is further configured to: receive the digitalrepresentation of the output signal; tune the reference signal based onthe digital representation of the output signal until the signalcompares favorably to the first voltage at the first point along thewired connection that is proximate to the terminal of the batterythereby generating a tuned reference signal; and determine the firstvoltage at the first point along the wired connection that is proximateto the terminal of the battery based on the tuned reference signal. 20.The battery sensor system of claim 15, wherein the one or moreprocessing modules is further configured to determine the estimate ofthe first voltage by one or more of: obtaining a previously sensedvoltage at the first point; obtaining a battery rating of the battery;determining an expected voltage based on a time period since thepreviously sensed voltage was sensed; and receiving a command thatincludes the estimate of the first voltage.